... Abstract In this paper, the thermal performances of a Chiplet module with different numbers of dies were studied. The Chiplet module was assumed to be placed in the same server system, with the same ambient condition, and using the same heat sink. A thermal simulation was conducted to obtain...

... Abstract Thermal considerations are a critical facet in SoC and System design. There are numerous difficulties in performing comprehensive thermal analysis on modern SoC designs as well as considerable difficulty in moving towards a cross-discipline co-design strategy. The design space is large...

... Abstract Lead-free solder joints are the most widely used interconnects in electronic packaging industries. Usually solder joints in most of the electronic devices are exposed to an environment where variation of temperature exists, which indicates cyclic thermal loading to be a very common...

...Experimental Characterization of Heat Transfer and Thermal Energy Storage Capability Using Swirling Two-Phase Flow in the Package Integrated Cyclone COoler (PICCO) Dr. Peter deBock1, Dr. Rinaldo Miorini1, Dr. Cathleen Hoel1, Dr. Darin Sharar2, Bryan Whalen1 1GE Research, Niskayuna, NY 2Army...

... package modules with and without phosphors are evaluated in terms of their thermal resistance and reliability under wet high temperature operation life (WHTOL) test. The WHTOL test is with the condition of 85°C/85% RH and 350mA of forward current for 1008 hrs, specified in JESD22 Method A101-B. First...

... 07 01 2011 System-level thermal transient analysis of High-Power Dynamic Microelectronics System is performed using numerical simulations. The SmartMOS-type device is packaged in 20 lead SOIC module with exposed copper slug. The package is attached to 4-layer PCB with embedded thermal...

... exchanger and its thermal performance defined. It is found that the air supply temperature from heat exchanger is almost independent of air flow rate and altitude within application range. A thermal model is developed to simulate air temperatures into and out of cell cabinet heat exchanger for evaluating...

... 12 01 2010 A detailed transient thermal study for a Remote Keyless Entry System with dynamic heat sources is performed using numerical simulations. The SmartMOS-type device is packaged in a 54 lead SOIC (small outline IC) package with an exposed copper slug. The package is attached...

... 12 01 2010 A multidisciplinary optimization methodology for placement of heat generating logic blocks on integrated circuit chips is presented. The methodology includes thermal and wiring length criteria, which are optimized simultaneously using the genetic algorithm. An effective...

... warpage layup layout printed wiring board (PWB) printed wiring board assembly (PWBA) thermal CTE PWBA warpage is further compounded by the high densification of the PWBA, where heat dissipation occurs over a very small area during in-service operation. Automated component placement...

... KEYWORDS thermal an NOMENCLA A c DCBA t me outer radius boundary condition; the two-port lly separates the interior conduction and surface operties from the temperature and heat flux itions. Thus, using this scheme, temperature and be easily determined at every position within the oviding necessary...

... application challenges unique to LEDs. Conventional lighting methods provide little guidance for LED thermal problems since these usually involve a very high temperature source, such as a filament or an arc, and radiant heat transfer dissipates the thermal energy. LED junction temperatures are limited to much...