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Keywords: thermal models
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Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 119-127, July 17–22, 2005
Paper No: IPACK2005-73101
... 03 04 2009 A detailed evaluation of modeling techniques used to incorporate a complex component level steady-state thermal model of a 32-pin SSOP package in a system level simulation is described. The device is an Application Specific IC designed for the present system, intended...