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Keywords: underfill
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Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A006, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97349
... Abstract In this paper, an experimental approach is presented to investigate the influence of second level underfill on the thermomechanical behavior of two BGA packages during thermal cycles. Two different flip chip packages with two major underfill reinforcement methods (corner bonding...
Proceedings Papers

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A009, October 25–27, 2022
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2022-97433
.... Underfills provide extra support to the flip-chip bumps, enhancing the fatigue life and reducing the solder joint strains. Models and material degradation data are needed for the underfills exposed to high temperatures. The effect of the evolution of non-linear constitutive behavior of underfills...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A024, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74076
.... Much of the advanced functionality is enable through the use of advanced architectures including flip-chip ball-grid arrays. Underfills are used to enhance the solder joint reliability between the chip and the substrate. However, there is insufficient information about the viscoelasticity of Underfills...
Proceedings Papers

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A017, October 26–28, 2021
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2021-74061
... Abstract Automotive underhood electronics may be exposed to high temperature in the neighborhood of 100°C–200°C. Property evolution may impact reliability and accuracy of predictive models to assure desired use life. In this paper, evolution of properties of two underfill material properties...
Proceedings Papers

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2677
... different types of underfills has been cured and aged. Mechanical tests have been performed on all the four types of underfills too understand the degradation in properties under extended high temperature operation. Uniaxial tensile tests are conducted to study the elastic modulus, ultimate tensile strength...
Proceedings Papers

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A007, October 7–9, 2019
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2019-6561
... compounds, underfill encapsulants, adhesives and other polymers used in electronic assemblies. After characterization, these parameters can be used as input material property data for finite element analysis (FEA) simulations. In this study, both frequency dependent dynamic mechanical analysis (DMA...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 749-761, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52209
... 15 02 2012 In this work, the viscoplastic mechanical response of a typical underfill encapsulant has been characterized via rate dependent stress-strain testing over a wide temperature range, and creep testing for a large range of applied stress levels and temperatures. A specimen...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 609-615, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52260
... dissipation scheme during board level attach. Lidded FC packages use a metallic lid attached to the die. Bare die package can be further subdivided into bare die underfilled package and bare die flip chip molded ball grid array (FC m BGA) package. Each of these packaging configurations has advantages as well...
Proceedings Papers

Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 75-82, July 6–8, 2011
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2011-52264
... 15 02 2012 A thermo-mechanical analysis is carried out on a stacked die package having through silicon via technology to study the overall reliability of the package due to varying aspect ratio (size and shape) of through silicon vias, silicon die thickness, underfill thickness...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 789-796, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89209
... 07 01 2011 In this work, the effects of underfill cure temperature and JEDEC MSL preconditioning on underfill mechanical and strength properties, as well as flip chip assembly reliability have been explored. Baseline stress-strain curves, mechanical properties, and interfacial shear...
Proceedings Papers

Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 1, 417-433, July 19–23, 2009
Publisher: American Society of Mechanical Engineers
Paper No: InterPACK2009-89371
... environment electronic packaging. In this work, measurements of material behavior changes occurring in flip chip underfill encapsulants exposed to isothermal aging have been performed. A novel method has been developed to fabricate freestanding underfill uniaxial test specimens so that they accurately reflect...
Topics: Creep, Stress
Proceedings Papers

Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 2, 533-540, July 8–12, 2007
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2007-33939
... 12 01 2010 Underfill is one of the crucial materials in flip chip (FC) packages. The role of underfill is not only to protect the solder bumps but to minimize package warpage, and to protect the fragile low k dielectric at end of line (EOL), moisture resistance test (MRT...
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 115-121, July 6–11, 2003
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2003-35046
... lead-free SnAgCu wafer bumping flip chip underfill MSL HTSL TCT SnAgCu solder used in laminate package like PBGA and CSP BGA to replace eutectic SnPb as interconnection has become major trend in the electronic industry. But unlike well-known failure mode of wire bonding package...