Volumes | International Electronic Packaging Technical Conference and Exhibition | American Society of Mechanical Engineers Digital Collection

Topics: Cooling , Plates (structures) , Thermal resistance , Flow (Dynamics) , Pressure drop , Computational fluid dynamics , Coolants , Cooling systems , Engineering simulation , Fluids

Experimental Study of Transient Hydraulic Characteristics for Liquid Cooled Data Center Deployment

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Akiilessh Sivakumar, Akshay Lakshminarayana, Harold Miyamura, Gautam Gupta, Dereje Agonafer, Jeremy Rodriguez

InterPACK 2022; V001T01A009doi:https://doi.org/10.1115/IPACK2022-97425

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Topics: Cooling , Data centers , Flow control , Plates (structures) , Transients (Dynamics)

Comparative Study of Single-Phase Immersion Cooled Two Socket Server in Tank and Sled Configurations

Krishna Bhavana Sivaraju, Pratik Bansode, Gautam Gupta, Jacob Lamotte-Dawaghreh, Satyam Saini, Vibin Simon, Joseph Herring, II, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer

InterPACK 2022; V001T01A010doi:https://doi.org/10.1115/IPACK2022-97429

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Topics: Building renovation , Computational fluid dynamics , Coolants , Cooling , Data centers , Flow (Dynamics) , Fluids , Geometry , Heat , Heat transfer

A Control Strategy for Minimizing Temperature Fluctuations in High Power Liquid to Liquid CDUs Operated at Very Low Heat Loads

Ali Heydari, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Uschas Chowdhury, Chandraprakash Hinge, Lochan Sai Reddy Cinthaparthy, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Jeremy Rodriguez

InterPACK 2022; V001T01A011doi:https://doi.org/10.1115/IPACK2022-97434

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Topics: Coolants , Cooling , Data centers , Fluctuations (Physics) , Heat , Plates (structures) , Stress , Temperature , Failure , Flow control

Transient CFD Analysis of Dynamic Liquid-Cooling Implementation at Rack Level

Himanshu Modi, Pardeep Shahi, Akiilessh Sivakumar, Satyam Saini, Pratik Bansode, Vibin Shalom, Amrutha Valli Rachakonda, Gautam Gupta, Dereje Agonafer

InterPACK 2022; V001T01A012doi:https://doi.org/10.1115/IPACK2022-97443

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Topics: Computational fluid dynamics , Cooling , Transient analysis , Transients (Dynamics)

CFD Analysis of Heat Capture Ratio in a Hybrid Cooled Server

Vibin Shalom Simon, Lochan Sai Reddy, Pardeep Shahi, Amrutha Valli, Satyam Saini, Himanshu Modi, Pratik Bansode, Dereje Agonafer

InterPACK 2022; V001T01A013doi:https://doi.org/10.1115/IPACK2022-97445

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Topics: Computational fluid dynamics , Cooling , Heat

Power Usage Effectiveness Analysis of a High-Density Air-Liquid Hybrid Cooled Data Center

Ali Heydari, Bahareh Eslami, Vahideh Radmard, Fred Rebarber, Tyler Buell, Kevin Gray, Sam Sather, Jeremy Rodriguez

InterPACK 2022; V001T01A014doi:https://doi.org/10.1115/IPACK2022-97447

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Topics: Cooling , Data centers , Density , Energy consumption , Temperature , Computational fluid dynamics , Design , Flow (Dynamics) , Carbon , Cooling systems

Data Driven Modeling Advancements for Thermal Predictions in Data Center Applications

Dhaval Patel, Yogendra Joshi

InterPACK 2022; V001T01A015doi:https://doi.org/10.1115/IPACK2022-97478

Abstract

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Topics: Data centers , Modeling , Transients (Dynamics)

Machine Learning-Based Heat Sink Optimization Model for Single-Phase Immersion Cooling

Joseph Herring, Peter Smith, Jacob Lamotte-Dawaghreh, Pratik Bansode, Satyam Saini, Rabin Bhandari, Dereje Agonafer

InterPACK 2022; V001T01A016doi:https://doi.org/10.1115/IPACK2022-97481

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Topics: Artificial neural networks , Computational fluid dynamics , Cooling , Heat sinks , Machine learning , Machinery , Optimization , Thermal management

Single-Phase Immersion Cooling Study of a High-Density Storage System

Saket Karajgikar, Jasper Kidger, Andrew Shaw, Neil Edmunds, Veerendra Mulay

InterPACK 2022; V001T01A017doi:https://doi.org/10.1115/IPACK2022-97490

Abstract

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Topics: Cooling , Density , Storage

Feasibility Study of Rear Door Heat Exchanger for a High Capacity Data Center

Vibin Shalom Simon, Himanshu Modi, Krishna Bhavana Sivaraju, Pratik Bansode, Satyam Saini, Pardeep Shahi, Saket Karajgikar, Veerendra Mulay, Dereje Agonafer

InterPACK 2022; V001T01A018doi:https://doi.org/10.1115/IPACK2022-97494

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Topics: Cooling , Data centers , Density , Doors , Heat exchangers

Experimental Investigation of the Impact of Improved Ducting and Chassis Re-Design of a Hybrid-Cooled Server

Himanshu Modi, Pardeep Shahi, Lochan Sai Reddy Chinthaparthy, Gautam Gupta, Pratik Bansode, Vibin Shalom Simon, Dereje Agonafer

InterPACK 2022; V001T01A019doi:https://doi.org/10.1115/IPACK2022-97587

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Topics: Cooling , Design , Air flow , Heat sinks , Temperature , Cloud computing , Energy consumption , Flow (Dynamics) , Graphics processing units , Heat

Dual-Evaporator Thermosyphon Cooling System for Electronics Cooling

Filippo Cataldo, Raffaele Luca Amalfi

InterPACK 2022; V001T01A020doi:https://doi.org/10.1115/IPACK2022-97729

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Topics: Computer cooling , Cooling , Cooling systems

Digital Technologies in Microelectronics

AI/ML Applications for Thermally Aware SoC Designs

Adam Norman, Mark Gallina, Olena Zhu, Joyce Weiner, Fabian Garita Gonzalez

InterPACK 2022; V001T02A001doi:https://doi.org/10.1115/IPACK2022-97186

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Topics: Computation , Degrees of freedom , Design , Engineering disciplines , Excitation , Feedback , Machine learning , Modeling , Optimization , Robustness

Flexible and Wearable Electronics

Additive Manufacturing of Electronic Patterns for Harsh Environments

Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette

InterPACK 2022; V001T03A001doi:https://doi.org/10.1115/IPACK2022-94052

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Topics: Additive manufacturing , Extruding , Modeling , Strain measurement , Internet of things , Adhesives , Blocks (Building materials) , Inks , Optimization , Oscillations

Length-Scale Effects in Average Viscoplastic Behavior of Sintered Silver Materials: Empirical Exploration With Indentation Methods

David Leslie, Abhijit Dasgupta, Andrei Damian

InterPACK 2022; V001T03A002doi:https://doi.org/10.1115/IPACK2022-97363

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Topics: Creep , Silver

Drop Durability of Printed Hybrid Electronic (PHE) Assemblies Under Extreme Acceleration Level

Hisham Abusalma, Abhijit Dasgupta, Andres Bujanda, Jian Yu, Harvey Tsang

InterPACK 2022; V001T03A003doi:https://doi.org/10.1115/IPACK2022-97382

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Topics: Durability , Failure , Domes (Structural elements) , Cantilever beams , Disks , Silver , Additive manufacturing , Bending (Stress) , Clamps (Tools) , Damage

Predictive Methods for Electrical and Mechanical Process-Output for Inkjet Additive Printed Circuits

Pradeep Lall, Kartik Goyal, Scott Miller

InterPACK 2022; V001T03A004doi:https://doi.org/10.1115/IPACK2022-97428

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Topics: Circuits , Drops , Electronics , Equipment performance , Experimental design , Inks , Manufacturing , Materials properties , Mechanical properties , Nanoparticles

Evolution of Circuit Performance With Sustained 50°C Temperature Exposure for Additively Printed Inkjet Circuits With SMT Components

Pradeep Lall, Kartik Goyal, Scott Miller

InterPACK 2022; V001T03A005doi:https://doi.org/10.1115/IPACK2022-97430

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Topics: Circuits , Electronics , Temperature , Surface mount components , Filters , Manufacturing , Printing , Wearable devices , Energy dissipation , Heat

ANN Based Assessment of State-of-Health Reliability of Flexible Li-Ion Batteries Under Dynamic Flexing and Calendar Aging

Pradeep Lall, Hyesoo Jang

InterPACK 2022; V001T03A006doi:https://doi.org/10.1115/IPACK2022-97431

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Topics: Artificial neural networks , Batteries , Lithium-ion batteries , Machine learning , Reliability , Simulation

Characterization and Reliability Analysis of Direct-Write Additively Printed Flexible Humidity Sensor With Super Capacitive Material for Wearable Astronaut Sensor in Harsh Environments

Pradeep Lall, Hyesoo Jang, Curtis Hill

InterPACK 2022; V001T03A007doi:https://doi.org/10.1115/IPACK2022-97432

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Topics: Astronauts , Event history analysis , Manufacturing , Reliability , Sensors

Deep Learning for Prediction of Print Parameters and Realized Electrical Performance and Geometry on Inkjet Platform

Pradeep Lall, Shriram Kulkarni, Ved Soni, Kartik Goyal, Scott Miller

InterPACK 2022; V001T03A008doi:https://doi.org/10.1115/IPACK2022-97437

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Topics: Artificial neural networks , Geometry , Inks , Printing , Dimensions , Particulate matter , Computer software , Control algorithms , Electronics , Regression models

Additively Printed Flexible Charging Circuits and Effect on Evolution of Line Resistance and Charging Current in Charging Thin Flexible Batteries

Pradeep Lall, Ved Soni, Scott Miller

InterPACK 2022; V001T03A009doi:https://doi.org/10.1115/IPACK2022-97450

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Topics: Circuits , Electronics , Printing

SOH Degradation Estimation of Thin Flexible Li-Ion Power Sources Subjected to Accelerated Life Cycling With Randomized Charge-Discharge and C-Rates

Pradeep Lall, Ved Soni

InterPACK 2022; V001T03A010doi:https://doi.org/10.1115/IPACK2022-97451

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Topics: Batteries , Biomedical equipment , Cycles , Electronics , Errors , Flexible electronics , Industrial research , Model validation , Modeling , Service life (Equipment)

Mechanical and Electrical Properties of Additively Printed Circuits With Magnetically Orientated Anisotropic Conductive Adhesive Attachment for FHE Applications

Pradeep Lall, Jinesh Narangaparambil, Scott Miller

InterPACK 2022; V001T03A011doi:https://doi.org/10.1115/IPACK2022-97456

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Topics: Adhesives , Anisotropy , Circuits , Electrical properties , Failure , Reliability , Temperature , Electronics , Low temperature , Bonding

Influence of Cure-Reflow Profile and High-Temperature Operation of Additively Printed Conductive Circuits on Performance and Reliability

Pradeep Lall, Jinesh Narangaparambil, Curtis Hill

InterPACK 2022; V001T03A012doi:https://doi.org/10.1115/IPACK2022-97457

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Topics: Artificial neural networks , Circuits , Copper , Flexible electronics , High temperature , Reliability , Electrical resistivity , Sintering , Adhesives , Electronics

Harsh Environment Electronic Applications for Transportation Systems

Machine Learning Enables Autonomous Vehicles Under Extreme Environmental Conditions

Nhi V. Quach, Jewoo Park, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Alex K. Lee, Chenxi Yin, Yoonjin Won

InterPACK 2022; V001T04A001doi:https://doi.org/10.1115/IPACK2022-96542

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Topics: Autonomous vehicles , Machine learning

Evolution of Propensity for Chip-UF FCBGA Interface Delamination Under Fatigue-Loading and Sustained High Automotive Temperatures

Pradeep Lall, Aathi Raja Ram Pandurangan, Jaimal Williamson

InterPACK 2022; V001T04A002doi:https://doi.org/10.1115/IPACK2022-97424

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Topics: Delamination , Fatigue , Fracture toughness , Temperature

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

InterPACK 2022; V001T04A003doi:https://doi.org/10.1115/IPACK2022-97452

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Topics: Alloys , Shock (Mechanics) , Solders , Vibration , Reliability , Aerospace industry , Climate , Defense industry , Elastic moduli , Electronics

Heterogeneous Integration

Machine Learning and Simulation Based Temperature Prediction on High-Performance Processors

Carlton Knox, Zihao Yuan, Ayse K. Coskun

InterPACK 2022; V001T05A001doi:https://doi.org/10.1115/IPACK2022-96751

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Topics: Machine learning , Simulation , Temperature

Numerical Modeling and Experimental Validation on Non-Contact Bernoulli Picker for 3D Device Stacking Process

Daeho Min, Minsoo Han, Juno Kim, Kangsan Lee, Kyeongbin Lim, Euisun Choi, Seung Dae Seok, Byeongjun Lee, Minwoo Daniel Rhee

InterPACK 2022; V001T05A002doi:https://doi.org/10.1115/IPACK2022-97218

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Topics: Bonding , Computation , Computer simulation , Deformation , Design , Engineering prototypes , Flow (Dynamics) , Levitation , Optimization , Physics

Evaluation of Electromigration Coupling Different Physics Fields in Numerical Simulation

Chongyang Cai, Jiefeng Xu, Yangyang Lai, Junbo Yang, Huayan Wang, Suresh Ramalingam, Gamal Refai-Ahmed, Seungbae Park

InterPACK 2022; V001T05A003doi:https://doi.org/10.1115/IPACK2022-97338

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On the Viscoelastic Property Measurement of Filled Polymers by Dynamic Mechanical Analyzer (DMA)

Sukrut Prashant Phansalkar, Bongtae Han, Ehsan Akbari, Paulius Vaitiekunas

InterPACK 2022; V001T05A004doi:https://doi.org/10.1115/IPACK2022-97719

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Topics: Filled polymers , Viscoelasticity

Multi-Scale Thermal Transport, Thermal Materials, and Energy Systems

Power Envelope Analysis for the Thermal Optimization of a Chiplet Module

Eric Ouyang, Xiao Gu, Yonghyuk Jeong, Michael Liu

InterPACK 2022; V001T07A001doi:https://doi.org/10.1115/IPACK2022-97204

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Topics: Design , Heat sinks , Junctions , Optimization , Reliability , Resistors , Risk , Simulation , Temperature

Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability

Joshua Kasitz, Larry Marshall, Jr., David Huitink

InterPACK 2022; V001T07A002doi:https://doi.org/10.1115/IPACK2022-97399

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Topics: Cooling , Heat transfer , Nanoparticles , Phase change materials , Thermal conductivity

Additively Manufactured Liquid-Cooled Heat Sink: Gyroid-Based Design, Fabrication, and Testing

Adrian Jourdan, Alexander Sarvadi, Hector R. Siller, Huseyin Bostanci

InterPACK 2022; V001T07A003doi:https://doi.org/10.1115/IPACK2022-97476

Abstract

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Topics: Additive manufacturing , Design , Heat sinks , Manufacturing , Testing , Topology

Photonics and Optics

High Brightness Illumination Based on Laser Light Diffusion With Mie Scattering

Mohammad Azarifar, Ceren Cengiz, Kerem Ocaksönmez, Asim Onal, Sedat Nizamoglu, Mehmet Arik

InterPACK 2022; V001T08A001doi:https://doi.org/10.1115/IPACK2022-97220

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Topics: Brightness (Photometry) , Diffusion (Physics) , Electromagnetic scattering , Lasers , Radiation scattering , Scattering (Physics)

Pool Boiling Heat Transfer in Dielectric Fluids and Impact of Surfaces on the Repeatability

Tolga Emir, Yakup Gokalp Yazici, Mete Budakli, Mehmet Arik

InterPACK 2022; V001T08A002doi:https://doi.org/10.1115/IPACK2022-97266

Abstract

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Topics: Critical heat flux , Fluids , Heat transfer , Oxidation , Pool boiling

Experimental Investigation of R134a Flow Boiling in Copper Foam Evaporators for High Heat Flux Electronics Cooling

Deogratius Kisitu, Carol Caceres, Metodi Zlatinov, Denver Schaffarzick, Alfonso Ortega

InterPACK 2022; V001T08A003doi:https://doi.org/10.1115/IPACK2022-97400

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Topics: Boiling , Computer cooling , Cooling , Copper , Flow (Dynamics) , Heat flux , Metal foams

Feasibility Demonstration of Server Chip Package With Direct-to-Chip Optical Transceivers

Shidong Li, Bakul Parikh, Chelsea Savoy, Daniel Kuchta, Guillaume Jutras, Harry Bagheri, Hilton Toy, Joe Ross, Ken-Ichi Akasofu, Mark Kapfhammer, Mark Schultz, Steven Ostrander, Thomas Wassick

InterPACK 2022; V001T08A004doi:https://doi.org/10.1115/IPACK2022-97455

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Topics: Cables , Construction , Copper , Cycles , Density , Elastomers , Fibers , Flat heat pipes , Flip-chip , Flip-chip devices

Power Electronics

Dual Converging Jets for Enhanced Liquid Impingement Cooling

Reece Whitt, Rafael Estrella, David Huitink

InterPACK 2022; V001T09A001doi:https://doi.org/10.1115/IPACK2022-96635

Abstract

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Topics: Additive manufacturing , Electronics , Impingement cooling , Jets , Heat transfer , Nozzles , Turbulence , Aluminum , Cooling , Fluids

Comparative Analysis of Direct and Indirect Cooling of Wide-Bandgap Power Modules and Performance Enhancement of Jet Impingement-Based Direct Substrate Cooling

Himel Barua, Emre Gurpinar, Lingxiao Xue, Burak Ozpineci

InterPACK 2022; V001T09A002doi:https://doi.org/10.1115/IPACK2022-97172

Abstract

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Topics: Cooling , Energy gap

Thermal Optimization of a Silicon Carbide, Half-Bridge Power Module

Gilberto Moreno, Joshua Major, Douglas DeVoto, Faisal Khan, Sreekant Narumanchi, Xuhui Feng, Paul Paret

InterPACK 2022; V001T09A003doi:https://doi.org/10.1115/IPACK2022-97283

Abstract

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Topics: Bridges (Structures) , Electronics , Energy gap , Optimization , Silicon , Design , Thermal resistance , Computational fluid dynamics , Heat exchangers , Fluids

Multiphysics Co-Optimization Design and Analysis of a Double-Side-Cooled Silicon Carbide-Based Power Module

Xuhui Feng, Gilberto Moreno, Sreekant Narumanchi, Paul Paret

InterPACK 2022; V001T09A004doi:https://doi.org/10.1115/IPACK2022-97355

Abstract

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Topics: Cooling , Design , Electronics , Finite element analysis , Optimization , Silicon

Performance Validation of Voltage Blocking Technologies for Direct Cooling of High-Density Power Electronics

Ange-Christian Iradukunda, David Huitink, Tarek Gebrael, Nenad Miljkovic

InterPACK 2022; V001T09A005doi:https://doi.org/10.1115/IPACK2022-97412

Abstract

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Topics: Chemical vapor deposition , Coatings , Cooling , Density , Electrodes , Electronics , Fluids , Ionization , Thermal resistance

Computational Models of Additive Manufactured Heat Spreading Device for Enhanced Localized Cooling

Zion Clarke, Sonya Smith, Reece Whitt, David Huitink

InterPACK 2022; V001T09A006doi:https://doi.org/10.1115/IPACK2022-97446

Abstract

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Topics: Additive manufacturing , Computer simulation , Cooling , Geometry , Heat , Heat sinks , Heat transfer , Manifolds , Nozzles

Design of Buck Converter With Control System for Electric Vehicle Using SiC Device With Thermal Loss Model

Utsav Gupta, Andras Vass-Varnai

InterPACK 2022; V001T09A007doi:https://doi.org/10.1115/IPACK2022-97669

Abstract

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Topics: Control systems , Design , Electric vehicles , Power converters , Automobiles , Batteries , Electronic components , Energy management , Modeling , Motors

A Three-Face Utilized Heat Sink Design for 3-D Integrated 75 kVA Intelligent Power Stage (IPS)

Abdul Basit Mirza, Xiaoqiang Xu, Asif Imran Emon, Fang Luo, Shikui Chen

InterPACK 2022; V001T09A008doi:https://doi.org/10.1115/IPACK2022-97886

Abstract

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Topics: Design , Heat sinks , Optimization

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen

InterPACK 2022; V001T09A009doi:https://doi.org/10.1115/IPACK2022-98066

Abstract

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Topics: Heat sinks , Optimization , Power converters , Topology , Design , Convection , Cooling , Computer simulation , Density , Filtration

Naturally-Cooled Heat Sinks for Next-Generation Battery Chargers

Callum Chhokar, G. Bamorovat Abadi, Nicholas McDaniel, Chris Botting, Majid Bahrami

InterPACK 2022; V001T09A010doi:https://doi.org/10.1115/IPACK2022-98077

Abstract

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Topics: Batteries , Fins , Heat sinks

Experimental Probing of the Bias Dependent Self-Heating in AlGaN/GaN HEMTs With a Transparent Indium Tin Oxide Gate

Anwarul Karim, Tae Kyoung Kim, Daniel Shoemaker, Yiwen Song, Joon Seop Kwak, Sukwon Choi

InterPACK 2022; V001T09A011doi:https://doi.org/10.1115/IPACK2022-98800

Abstract

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Topics: Gallium nitride , Gates (Closures) , Heating , Reliability , Temperature , Transparency

Reliability of Electronic Packages and Systems

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines

InterPACK 2022; V001T10A001doi:https://doi.org/10.1115/IPACK2022-92306

Abstract

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Topics: Aerosols , Drops , Electronics , Silver , Temperature , Testing , Water

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall

InterPACK 2022; V001T10A002doi:https://doi.org/10.1115/IPACK2022-93878

Abstract

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Topics: Creep , Damage , Lead-free solders , Solders

Anisotropic Plastic Constitutive Properties of SAC305 Single Crystal Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta

InterPACK 2022; V001T10A003doi:https://doi.org/10.1115/IPACK2022-94505

Abstract

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Topics: Anisotropy , Crystals , Electron backscatter diffraction , Shear (Mechanics) , Solder joints

RoHS – Compliant Indirectly Material Evaluation for Manufacturing Study

Fenny Liu, Sean Huang, Sheng Fong Yu, Chun Yen Li, Liang-Yih Hung, Yu Po Wang

InterPACK 2022; V001T10A004doi:https://doi.org/10.1115/IPACK2022-97175

Abstract

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Topics: Hazardous substances , Manufacturing , Phthalate plasticizers , Electronic equipment , Plasticizers , Risk , Semiconductor industry , Temperature , Weight (Mass)

A Study on Parameters That Impact the Thermal Fatigue Life of BGA Solder Joints

Karthik Arun Deo, Raymond-Noel Kono, Chongyang Cai, Junbo Yang, Yangyang Lai, Seungbae Park

InterPACK 2022; V001T10A005doi:https://doi.org/10.1115/IPACK2022-97253

Abstract

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Topics: Ball-Grid-Array packaging , Fatigue life , Solder joints , Surface mount devices

Thermomechanical Reliability of BGA Packages With Different Underfill Reinforcement Methods

Yangyang Lai, Chongyang Cai, Ke Pan, Junbo Yang, Jonghwan Ha, Pengcheng Yin, Karthik Deo, Seungbae Park

InterPACK 2022; V001T10A006doi:https://doi.org/10.1115/IPACK2022-97349

Abstract

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Topics: Ball-Grid-Array packages , Ball-Grid-Array packaging , Reliability , Thermomechanics , Cycles , Solders , Corners (Structural elements) , Bonding , Deformation , Stiffness

Impact of Immersion Cooling on Thermomechanical Properties of Non-Halogenated Substrate

Rabin Bhandari, Akshay Boovanahally Lakshminarayana, Krishna Bhavana Sivaraju, Pratik Vithoba Bansode, Ephrem Kejela, Dereje Agonafer

InterPACK 2022; V001T10A007doi:https://doi.org/10.1115/IPACK2022-97423

Abstract

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Topics: Cooling , Thermomechanics

Predictive Cohesive Zone Modeling for Delamination at PCB-Potting Material Interfaces Under Four-Point Bend Loading With Sustained High-Temperature Exposure

Pradeep Lall, Aathi Raja Ram Pandurangan, Ken Blecker

InterPACK 2022; V001T10A008doi:https://doi.org/10.1115/IPACK2022-97427

Abstract

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Topics: Delamination , Epoxy adhesives , Epoxy resins , High temperature , Modeling

Modeling Underfill Degradation and Its Effect on FCBGA Package Reliability Under High-Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Edward Davis

InterPACK 2022; V001T10A009doi:https://doi.org/10.1115/IPACK2022-97433

Abstract

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Topics: High temperature , Modeling , Reliability , Flip-chip , Solder joints , Ball-Grid-Array packaging , Electronics , Fatigue failure , Fatigue life , Materials degradation

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

InterPACK 2022; V001T10A010doi:https://doi.org/10.1115/IPACK2022-97438

Abstract

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Topics: Shock (Mechanics) , Solders , Temperature , Operating temperature , Alloys , High temperature , Stress , Stress-strain curves , Testing , Aerospace industry

Evolution of the Interface Critical Stress Intensity Factors Between TIM Copper Substrates due to High-Temperature Isothermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson

InterPACK 2022; V001T10A011doi:https://doi.org/10.1115/IPACK2022-97440

Abstract

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Topics: Copper , Delamination , Displacement , Fracture (Materials) , High temperature , Stress

Study of Interface Monotonic and Fatigue Fracture Measurements at the Substrate Potting Compound Interfaces Under Flexure Loading

Pradeep Lall, Padmanava Choudhury, Ken Blecker

InterPACK 2022; V001T10A012doi:https://doi.org/10.1115/IPACK2022-97448

Abstract

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Topics: Bending (Stress) , Cycles , Failure , Fatigue , Fracture (Materials) , Fracture (Process) , Stress

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

InterPACK 2022; V001T10A013doi:https://doi.org/10.1115/IPACK2022-97449

Abstract

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Topics: Mechanical properties , Solders , Temperature , Alloys , Storage , Aerospace industry , Automotive industry , Constitutive equations , Finite element analysis , Low temperature materials