Dependence of Bonding Temperature Conditions on Metal Thickness Effects in Bonded Dissimilar Materials

This study provides information on the dependence of bonding temperature conditions on metal thickness effects in bonded dissimilar materials as a composite material system. Effects of metal thickness on the bonding strength were confirmed each bonding temperature condition by using silicon-nitride and nickel to confirm for each joint manufactured by a bonding method, two stages bonding process. This process used in this experiment consists of two stages, first bonding process as the ceramic is bonded to thin layer metal at high temperature, and secondary process as thick metal is bonded to the thin metal layer of the joint at lower temperature than first stage’s one. Bonding tensile strength of the joint specimen was evaluated experimentally. The bonding strength was dominated by the residual stress near the edge of the interface on ceramic side. The maximum bonding strength appears at optimum metal thickness. It shows that the optimum metal thickness depends on the first temperature condition. Reduction of the residual stress was considered based on the experimental and numerical results. Two stages bonding process can be applied for high strength bonded dissimilar materials as useful engineering application by setting optimum metal thickness each bonding temperature condition.