We present an application of the digital image correlation (DIC) method to high-resolution transmission electron microscopy (HRTEM) images for nanoscale deformation analysis. The combination of DIC and HRTEM offers both the ultrahigh spatial resolution and high displacement detection sensitivity that are not possible with other microscope-based DIC techniques. We demonstrate the accuracy and utility of the HRTEM-DIC technique through displacement and strain analysis on amorphous silicon. Two types of error sources resulting from the transmission electron microscopy (TEM) image noise and electromagnetic-lens distortions are quantitatively investigated via rigid-body translation experiments. The local and global DIC approaches are applied for the analysis of diffusion- and reaction-induced deformation fields in electrochemically lithiated amorphous silicon. The DIC technique coupled with HRTEM provides a new avenue for the deformation analysis of materials at the nanometer length scales.
Nanoscale Deformation Analysis With High-Resolution Transmission Electron Microscopy and Digital Image Correlation
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
University of Pittsburgh,
Pittsburgh, PA 15261
Sandia National Laboratories,
Albuquerque, NM 87185
University of Pittsburgh,
Pittsburgh, PA 15261
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: shuman.xia@me.gatech.edu
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
University of Pittsburgh,
Pittsburgh, PA 15261
Sandia National Laboratories,
Albuquerque, NM 87185
University of Pittsburgh,
Pittsburgh, PA 15261
Georgia Institute of Technology,
Atlanta, GA 30332
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: shuman.xia@me.gatech.edu
Contributed by the Applied Mechanics Division of ASME for publication in the JOURNAL OF APPLIED MECHANICS. Manuscript received June 20, 2015; final manuscript received August 15, 2015; published online September 10, 2015. Editor: Yonggang Huang.
The United States Government retains, and by accepting the article for publication, the publisher acknowledges that the United States Government retains, a nonexclusive, paid-up, irrevocable, worldwide license to publish or reproduce the published form of this work, or allow others to do so, for United States government purposes.
Wang, X., Pan, Z., Fan, F., Wang, J., Liu, Y., Mao, S. X., Zhu, T., and Xia, S. (September 10, 2015). "Nanoscale Deformation Analysis With High-Resolution Transmission Electron Microscopy and Digital Image Correlation." ASME. J. Appl. Mech. December 2015; 82(12): 121001. https://doi.org/10.1115/1.4031332
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