The use of cellular substrates for stretchable electronics minimizes not only disruptions to the natural diffusive or convective flow of bio-fluids, but also the constraints on the natural motion of the skin. The existing analytic constitutive models for the equivalent medium of the cellular substrate under finite stretching are only applicable for stretching along the cell walls. This paper aims at establishing an analytic constitutive model for the anisotropic equivalent medium of the cellular substrate under finite stretching along any direction. The model gives the nonlinear stress–strain curves of the cellular substrate that agree very well with the finite element analysis (FEA) without any parameter fitting. For the applied strain <10%, the stress–strain curves are the same for different directions of stretching, but their differences become significant as the applied strain increases, displaying the deformation-induced anisotropy. Comparison of the results for linear and nonlinear elastic cell walls clearly suggests that the nonlinear stress–strain curves of the cellular substrate mainly result from the finite rotation of cell walls.
Skip Nav Destination
Article navigation
July 2018
Research-Article
Anisotropic Mechanics of Cellular Substrate Under Finite Deformation
Feng Zhu,
Feng Zhu
School of Logistics Engineering,
Wuhan University of Technology,
Wuhan 430063, China;
Departments of Civil and Environmental
Engineering,
Mechanical Engineering,
and Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Wuhan University of Technology,
Wuhan 430063, China;
Departments of Civil and Environmental
Engineering,
Mechanical Engineering,
and Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Search for other works by this author on:
Hanbin Xiao,
Hanbin Xiao
School of Logistics Engineering,
Wuhan University of Technology,
Wuhan 430063, China
Wuhan University of Technology,
Wuhan 430063, China
Search for other works by this author on:
Yeguang Xue,
Yeguang Xue
Departments of Civil and Environmental
Engineering, Mechanical Engineering,
and Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Engineering, Mechanical Engineering,
and Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Search for other works by this author on:
Xue Feng,
Xue Feng
Department of Engineering Mechanics,
Interdisciplinary Research Center for Flexible
Electronics Technology,
Tsinghua University,
Beijing 100084, China
Interdisciplinary Research Center for Flexible
Electronics Technology,
Tsinghua University,
Beijing 100084, China
Search for other works by this author on:
Yonggang Huang,
Yonggang Huang
Departments of Civil and Environmental
Engineering, Mechanical Engineering, and
Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Engineering, Mechanical Engineering, and
Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Search for other works by this author on:
Yinji Ma
Yinji Ma
Department of Engineering Mechanics,
Interdisciplinary Research Center for Flexible
Electronics Technology,
Tsinghua University,
Beijing 100084, China
e-mail: mayinji@gmail.com
Interdisciplinary Research Center for Flexible
Electronics Technology,
Tsinghua University,
Beijing 100084, China
e-mail: mayinji@gmail.com
Search for other works by this author on:
Feng Zhu
School of Logistics Engineering,
Wuhan University of Technology,
Wuhan 430063, China;
Departments of Civil and Environmental
Engineering,
Mechanical Engineering,
and Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Wuhan University of Technology,
Wuhan 430063, China;
Departments of Civil and Environmental
Engineering,
Mechanical Engineering,
and Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Hanbin Xiao
School of Logistics Engineering,
Wuhan University of Technology,
Wuhan 430063, China
Wuhan University of Technology,
Wuhan 430063, China
Yeguang Xue
Departments of Civil and Environmental
Engineering, Mechanical Engineering,
and Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Engineering, Mechanical Engineering,
and Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Xue Feng
Department of Engineering Mechanics,
Interdisciplinary Research Center for Flexible
Electronics Technology,
Tsinghua University,
Beijing 100084, China
Interdisciplinary Research Center for Flexible
Electronics Technology,
Tsinghua University,
Beijing 100084, China
Yonggang Huang
Departments of Civil and Environmental
Engineering, Mechanical Engineering, and
Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Engineering, Mechanical Engineering, and
Materials Science and Engineering,
Center for Bio-Integrated Electronics,
Northwestern University,
Evanston, IL 60208
Yinji Ma
Department of Engineering Mechanics,
Interdisciplinary Research Center for Flexible
Electronics Technology,
Tsinghua University,
Beijing 100084, China
e-mail: mayinji@gmail.com
Interdisciplinary Research Center for Flexible
Electronics Technology,
Tsinghua University,
Beijing 100084, China
e-mail: mayinji@gmail.com
1Corresponding author.
Contributed by the Applied Mechanics Division of ASME for publication in the JOURNAL OF APPLIED MECHANICS. Manuscript received March 25, 2018; final manuscript received April 11, 2018; published online May 8, 2018. Special Editor: Pradeep Sharma.
J. Appl. Mech. Jul 2018, 85(7): 071007 (7 pages)
Published Online: May 8, 2018
Article history
Received:
March 25, 2018
Revised:
April 11, 2018
Citation
Zhu, F., Xiao, H., Xue, Y., Feng, X., Huang, Y., and Ma, Y. (May 8, 2018). "Anisotropic Mechanics of Cellular Substrate Under Finite Deformation." ASME. J. Appl. Mech. July 2018; 85(7): 071007. https://doi.org/10.1115/1.4039964
Download citation file:
Get Email Alerts
Mechanics of a Tunable Bistable Metamaterial With Shape Memory Polymer
J. Appl. Mech (January 2025)
Phase Diagrams for Anticlastic and Synclastic Bending Curvatures of Hexagonal and Reentrant Honeycombs
J. Appl. Mech (January 2025)
Nucleation of Fracture: The First-Octant Evidence Against Classical Variational Phase-Field Models
J. Appl. Mech (January 2025)
Related Articles
Strain-Limiting Substrates Based on Nonbuckling, Prestrain-Free
Mechanics for Robust Stretchable Electronics
J. Appl. Mech (December,2017)
Irregular Hexagonal Cellular Substrate for Stretchable Electronics
J. Appl. Mech (March,2019)
A Nonlinear Mechanics Model of Zigzag Cellular Substrates for Stretchable Electronics
J. Appl. Mech (June,2020)
Related Proceedings Papers
Related Chapters
Health and Safety and Emergency Response
Pipeline Transportation of Carbon Dioxide Containing Impurities
Basic Features
Structural Shear Joints: Analyses, Properties and Design for Repeat Loading
Introduction to Stress and Deformation
Introduction to Plastics Engineering