In this part the heat, mass, and momentum transfer within a curing over that is commonly used in microelectronic manufacturing have been numerically analyzed. The local partial pressure of the vapor is a determining factor in the promotion of contamination. Based on the results of this study a new design is recommended. The significant features of the new design are: (i) ability to maintain the partial pressure of the vapor below the saturation pressure corresponding to the temperature at every location within the oven, and (ii) improved facility for scavenging of the vapor. Qualitative comparisons of results obtained here with flow visualizations (Part I) are excellent.

Zwick, K. J., Cohen, I. M., and Ayyaswamy, P. S., 1995, “Jet-Flow Scavenging of a Curing Oven, Part I: Flow Visualization. ASME JOURNAL OF ELECTRONIC PACKAGING, Vol. 117.
Patankar, S. K., 1989, Numerical Heat Transfer and Fluid Flow, McGraw-Hill, NY, pp. 554–557.
Weast, R. C., Ed., 1989/1990, CRC Handbook of Chemistry and Physics, 70th ed. CRC Press, Cleveland, p. F–50.
Tummala, R. R., and Rymaszewaski, E. J., 1989, Microelectronics Packaging Handbook, VanNostrand Reinhold, New York, pp. 554–557.
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