As electronic packaging technology moving to the CSP, wafer level packaging, fine pitch BGA (ball grid array) and high density interconnections, the wireability of the PCB/substrate and soldering technology are as important as reliability issues. In this work, a comparison of elliptical/round pads of area array type packages has been studied for soldering, reliability, and wireability requirements. The objective of this research is to develop numerical models for predicting reflow shapes of solder joint under elliptical/round pad boundary conditions and to study the reliability issue of the solder joint. In addition, a three-dimensional solder liquid formation model is developed for predicting the geometry, the restoring force, the wireability, and the reliability of solder joints in an area array type interconnections (e.g., ball grid array, flip chip) under elliptical and round pad configurations. In general, the reliability of the solder joints is highly dependent on the thermal-mechanical behaviors of the solder and the geometry configuration of the solder ball. These reliability factors include standoff height/contact angle of the solder joint, and the geometry layout/material properties of the package. An optimized solder pad design cannot only lead to a good reliability life of the solder joint but also can achieve a better wireability of the substrate. Furthermore, the solder reflow simulation used in this study is based on an energy minimization engine called Surface Evolver and the finite element software ABAQUS is used for thermal stress/strain nonlinear analysis.
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June 2001
Technical Papers
A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads
Kuo-Ning Chiang, Associate Professor,,
Kuo-Ning Chiang, Associate Professor,
Department of Power Mechanical Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-Fu Rd., HsinChu Taiwan 300
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Chang-Ming Liu, Graduate Assistant,
Chang-Ming Liu, Graduate Assistant,
Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan 300
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Kuo-Ning Chiang, Associate Professor,
Department of Power Mechanical Engineering, National Tsing Hua University, 101, Sec. 2, Kuang-Fu Rd., HsinChu Taiwan 300
Chang-Ming Liu, Graduate Assistant,
Department of Power Mechanical Engineering, National Tsing Hua University, Taiwan 300
Contributed by the Electrical and Electronic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EEPD August 19, 1999. Associate Editor: S. Heinrich.
J. Electron. Packag. Jun 2001, 123(2): 127-131 (5 pages)
Published Online: August 19, 1999
Article history
Received:
August 19, 1999
Citation
Chiang, K., and Liu, C. (August 19, 1999). "A Comparison of Thermal Stress/Strain Behavior of Elliptical/Round Solder Pads ." ASME. J. Electron. Packag. June 2001; 123(2): 127–131. https://doi.org/10.1115/1.1339196
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