Issue Section:
Technical Brief
1.
Ortega, A., 1996, “Conjugate Heat Transfer in Forced Air Cooling of Electronic Components,” Air Cooling Technology for Electronic Equipment, S. Kim and S. Lee, eds., CRC Press, New York, pp. 107–114.
2.
Zebib
, A.
, and Wo
, Y. K.
, 1989
, “A two-dimensional conjugate heat transfer model for forced air cooling of an electronic device
,” ASME J. Electron. Packag.
, 111
, pp. 41
–45
.3.
Gorobets
, V. G.
, 1995
, “Local and global heat transfer performance of a plate fin with a low thermal conductivity coating
,” Heat Transfer Research
, 26
, Nos. 3–8
, pp. 445
–461
.4.
Chen
, H.
, Lan
, Z.
, and Wang
, T. I.
, 1994
, “Study of conjugate conduction-laminar film condensation for a vertical plate fin
,” Int. J. Heat Mass Transf.
, 37
, No. 16
, pp. 2592
–2597
.5.
Palisoc
, A.
, and Lee
, C. C.
, 1988
, “Thermal properties of the multilayer infinite plate structure
,” J. Appl. Phys.
, 64
, No. 64
, pp. 410
–415
.6.
Lee
, C. C.
, Palisoc
, A.
, and Min
, Y.
, 1989
, “Thermal Analysis of Integrated Circuit Devices and Packages
,” IEEE Trans. Compon., Hybrids, Manuf. Technol.
, 12
, No. 4
, pp. 701
–709
.7.
Lee
, C. C.
, Min
, Y.
, and Palisoc
, A.
, 1989
, “A General Integration Algorithm for the Inverse Fourier Transform of Four-Layer Infinite Plate Structures
,” IEEE Trans. Compon., Hybrids, Manuf. Technol.
, 12
, No. 4
, pp. 710
–716
.8.
Lee, C. C., and Min, Y., 1991, “Thermal Modeling of Semiconductor Devices and Packages using Analytical Methods,” National Electronic Packaging and Production Conference, Anaheim, CA, Vol. 1, pp. 147–160.
9.
Cole
, K. D.
, 1997
, “Conjugate heat transfer from a small heated strip
,” Int. J. Heat Mass Transf.
, 40
, No. 11
, pp. 2709
–2719
.10.
Harman, S. A., 1998, “Conjugate heat transfer: the effects of axial conduction and the two component wall,” M. S. thesis, University of Nebraska, Lincoln, NE.
Copyright © 2001
by ASME
You do not currently have access to this content.
