This paper presents a mathematical model for a three-dimensional thermal analysis of a circuit board with multiple heat dissipating sources. The model considers the three-dimensional flat plate with discrete surface heat sources and integral transform technique is employed to determine the temperature distribution. The calculation procedure for the thermal characteristics of a circuit board, with surface mounted components, is presented and the solution is compared with those obtained from the finite element method. Also, the temperature distribution of a two-layered circuit board is presented in terms of Green’s function.
Issue Section:
Additional Technical Papers
Keywords:
printed circuits,
thermal management (packaging),
thermal analysis,
temperature distribution,
surface mount technology,
transforms,
Green's function methods
Topics:
Finite element methods,
Heat,
Heat transfer coefficients,
Manufacturing,
Mathematics,
Modeling,
Temperature,
Temperature distribution,
Thermal analysis,
Printed circuit boards,
Flat plates,
Circuits,
Packaging,
Thermal management,
Transistors,
Steady state,
Green's function methods,
Surface mount technology
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Copyright © 2001
by ASME
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