Plastic compressive deformation of the copper layer at high temperatures is a significant contributor for die cracking in the under-bump-metallurgy (UBM) area of flip chips.

Issue Section:
Technical Brief
Keywords:
flip-chip devices, thermal stress cracking, copper, plastic deformation, soldering
Topics:
Copper, Cracking (Materials), Deformation, Flip-chip devices, Fracture (Process), Metallurgy, High temperature
1.
Safranek, W. H., 1986, “The Properties of Electrodeposited Metals and Alloys,” Handbook, American Electroplaters and Surface Finishers Society.
Copyright © 2001
 by ASME
You do not currently have access to this content.