The effort described herein extends the use of least-material single rectangular plate-fin analysis to multiple fin arrays, using a composite Nusselt number correlation. The optimally spaced least-material array was also found to be the globally best thermal design. Comparisons of the thermal capability of these optimum arrays, on the basis of total heat dissipation, heat dissipation per unit mass, and space claim specific heat dissipation, are provided for several potential heat sink materials. The impact of manufacturability constraints on the design and performance of these heat sinks is briefly discussed.
Design of Optimum Plate-Fin Natural Convective Heat Sinks
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Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received by the EPPD Division June 22, 2001. Guest Editors: Y. Muzychka and R. Culham.
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Bar-Cohen, A., Iyengar, M., and Kraus, A. D. (June 10, 2003). "Design of Optimum Plate-Fin Natural Convective Heat Sinks ." ASME. J. Electron. Packag. June 2003; 125(2): 208–216. https://doi.org/10.1115/1.1568361
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