This paper reports the measurement of the thermal conductivity of particle-laden polymeric thermal interface materials for three different particle volume fractions. The experimental data are further compared with the percolation model and effective medium theory. We then introduce a method of obtaining the contact resistance between the particles and the polymeric matrix by a combination of percolation modeling and experimental data. We also discuss the dependence of the mechanical response of these particle-laden polymers for different filler or particle loading. A novel mechanical length scale is defined to understand the mechanical response of these materials, and is correlated to the viscosity of these materials.
Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received Sept. 2001; final revision, March 2002. Associate Editor: A. Y.-H. Hung.
Prasher, R. S., Koning , P., Shipley , J., and Devpura, A. (September 17, 2003). "Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction ." ASME. J. Electron. Packag. September 2003; 125(3): 386–391. https://doi.org/10.1115/1.1602703
Download citation file: