Knowledge of flow pattern and flow pattern transitions is essential to the development of reliable predictive tools for pressure drop and heat transfer in two-phase micro-channel heat sinks. In the present study, experiments were conducted with adiabatic nitrogen-water two-phase flow in a rectangular micro-channel having a cross-section. Superficial velocities of nitrogen and water ranged from 0.08 to 81.92 m/s and 0.04 to 10.24 m/s, respectively. Flow patterns were first identified using high-speed video imaging, and still photos were then taken for representative patterns. Results reveal the dominant flow patterns are slug and annular, with bubbly flow occurring only occasionally; stratified and churn flow were never observed. A flow pattern map was constructed and compared with previous maps and predictions of flow pattern transition models. Features unique to two-phase micro-channel flow were identified and employed to validate key assumptions of an annular flow boiling model that was previously developed to predict pressure drop and heat transfer in two-phase micro-channel heat sinks. This earlier model was modified based on new findings from the adiabatic two-phase flow study. The modified model shows good agreement with experimental data for water-cooled heat sinks.
Skip Nav Destination
e-mail: quw@purdue.edu
e-mail: smyoon@ecn.purdue.edu
e-mail: mudawar@ecn.purdue.edu
Article navigation
September 2004
Research Papers
Two-Phase Flow and Heat Transfer in Rectangular Micro-Channels
Weilin Qu, Graduate Research Assistant, Student Mem. ASME,
e-mail: quw@purdue.edu
Weilin Qu, Graduate Research Assistant, Student Mem. ASME
Purdue University International Electronic Cooling Alliance (PUIECA), Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
Search for other works by this author on:
Seok-Mann Yoon, Postdoctoral Research Associate,
e-mail: smyoon@ecn.purdue.edu
Seok-Mann Yoon, Postdoctoral Research Associate
Purdue University International Electronic Cooling Alliance (PUIECA), Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
Search for other works by this author on:
Issam Mudawar, Professor and Director, Fellow ASME
e-mail: mudawar@ecn.purdue.edu
Issam Mudawar, Professor and Director, Fellow ASME
Purdue University International Electronic Cooling Alliance (PUIECA), Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
Search for other works by this author on:
Weilin Qu, Graduate Research Assistant, Student Mem. ASME
Purdue University International Electronic Cooling Alliance (PUIECA), Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
e-mail: quw@purdue.edu
Seok-Mann Yoon, Postdoctoral Research Associate
Purdue University International Electronic Cooling Alliance (PUIECA), Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
e-mail: smyoon@ecn.purdue.edu
Issam Mudawar, Professor and Director, Fellow ASME
Purdue University International Electronic Cooling Alliance (PUIECA), Boiling and Two-Phase Flow Laboratory, School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907
e-mail: mudawar@ecn.purdue.edu
Contributed by the Electronic and Photonic Packaging Division for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received December 2003. Associate Editor: B. Sammakia.
J. Electron. Packag. Sep 2004, 126(3): 288-300 (13 pages)
Published Online: October 6, 2004
Article history
Received:
December 1, 2003
Online:
October 6, 2004
Citation
Qu, W., Yoon, S., and Mudawar, I. (October 6, 2004). "Two-Phase Flow and Heat Transfer in Rectangular Micro-Channels ." ASME. J. Electron. Packag. September 2004; 126(3): 288–300. https://doi.org/10.1115/1.1756589
Download citation file:
Get Email Alerts
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?
J. Electron. Packag (June 2025)
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability
J. Electron. Packag (June 2025)
Related Articles
Transport Phenomena in Two-Phase Micro-Channel Heat Sinks
J. Electron. Packag (June,2004)
Analytical Modeling of Annular Flow Boiling Heat Transfer in Mini- and Microchannel Heat Sinks
J. Heat Transfer (April,2010)
Single-Side Heated Monoblock, High Heat Flux Removal Using Water Subcooled Turbulent Flow Boiling
J. Heat Transfer (February,2004)
Experimental Investigation and Theoretical Model for Subcooled Flow Boiling Pressure Drop in Microchannel Heat Sinks
J. Electron. Packag (September,2009)
Related Proceedings Papers
Related Chapters
Liquid Cooled Systems
Thermal Management of Telecommunication Equipment, Second Edition
Liquid Cooled Systems
Thermal Management of Telecommunications Equipment
Thermal Design Guide of Liquid Cooled Systems
Thermal Design of Liquid Cooled Microelectronic Equipment