To give a proper and accurate estimation of the fatigue life of ball grid array (BGA) solder joints, a mechanical fatigue test method under mixed-mode loading is proposed. Experiments were conducted with and solder joints in room temperature. The mechanical low cycle fatigue tests were performed under several loading angles. The loading angle is controlled by several grips which have specific surface angle to the loading direction. Constant displacement controlled tests are performed using a micro-mechanical test apparatus. It was found that the normal deformation significantly affects the fatigue life of the solder joint. Throughout the whole test conditions at room temperature, solder alloy had longer fatigue life than alloy. Failure patterns of the fatigue tests were observed and discussed. A morrow energy model was examined and found to be a proper low cycle fatigue model for solder joints under mixed mode loading condition.
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e-mail: taesang.park@samsung.com
e-mail: sblee@kaist.ac.kr
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September 2005
Research Papers
Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions
Tae-Sang Park,
e-mail: taesang.park@samsung.com
Tae-Sang Park
Mechatronics & Manufacturing Technology Center
, Corporate Technology Operations, Samsung Electronics Co., LTD, 416, Maetan-3Dong, Yeongtong-Gu, Suwon-City, Gyeonggi-Do, 443-742, Korea
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Soon-Bok Lee
Soon-Bok Lee
CARE-Electronic Packaging Laboratory, Department of Mechanical Engineering,
e-mail: sblee@kaist.ac.kr
Korea Advanced Institute of Science and Technology
, 373-1 Guseong-dong, Yuseong-gu, Daejeon 305-701, Korea
Search for other works by this author on:
Tae-Sang Park
Mechatronics & Manufacturing Technology Center
, Corporate Technology Operations, Samsung Electronics Co., LTD, 416, Maetan-3Dong, Yeongtong-Gu, Suwon-City, Gyeonggi-Do, 443-742, Koreae-mail: taesang.park@samsung.com
Soon-Bok Lee
CARE-Electronic Packaging Laboratory, Department of Mechanical Engineering,
Korea Advanced Institute of Science and Technology
, 373-1 Guseong-dong, Yuseong-gu, Daejeon 305-701, Koreae-mail: sblee@kaist.ac.kr
J. Electron. Packag. Sep 2005, 127(3): 237-244 (8 pages)
Published Online: May 26, 2004
Article history
Received:
October 1, 2003
Revised:
May 26, 2004
Citation
Park, T., and Lee, S. (May 26, 2004). "Low Cycle Fatigue Testing of Ball Grid Array Solder Joints under Mixed-Mode Loading Conditions." ASME. J. Electron. Packag. September 2005; 127(3): 237–244. https://doi.org/10.1115/1.1871192
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