A complete vapor pressure model based on a micromechanics approach is developed in this paper. The model can be extended to calculate the initial vapor pressure as traction loading subjected to the interfaces after the delamination. The impact of the vapor pressure induced expanison on the material’s deformation is discussed.

1.
Ernst
,
L. J.
, 2000, “
Polymer Material Characterization and Modeling
,” in
Benefiting from Thermal and Mechanical Simulation in Microelectronics
,
G. Q.
Zhang
et al.
, (eds.),
Kluwer Academic
, Boston, MA, pp.
37
58
.
2.
Galloway
,
J. E.
, and
Miles
,
B. M.
, 1997, “
Moisture Absorption and Desorption Predictions for Plastic Ball Grid Array Packages
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
1070-9886,
20
(
3
), pp.
274
279
.
3.
Gebhart
,
B.
, 1993,
Heat Conduction and Mass Diffusion
,
McGraw Hill
, New York.
4.
Tay
,
A. A. O.
, and
Lin
,
T.
, 1996, “
Moisture Diffision and Heat Transfer in Plastic IC Packages
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
1070-9886,
19
(
2
), pp.
186
193
.
5.
Fan
,
X. J.
, and
Zhang
,
S. Y.
, 1995, “
Void Behavior Due to Internal Vapor Pressure Induced by Temperature Rise
,”
J. Mater. Sci.
0022-2461,
30
, pp.
3483
3489
.
6.
Fan
,
X. J.
, and
Lim
,
T. B.
, 1999, “
Mechanism Analysis for Moisture-Induced Failure in IC Packages
,”
ASME Int. Mechanical Engineering Congress and Exposition, 11th Symp. on Mechanics of Surface Mount Technology
, Nashville, Tennessee, November, 14–19, IMECE/EPE-14.
7.
Fan
,
X. J.
,
Zhang
,
G. Q.
, and
Ernst
,
L. J.
, 2002, “
A Micro-Mechanics Approach in Polymeric Material Failures in Microelectronic Packaging
,”
3rd Int. Conf. on Thermal and Thermo-Mechanical Simulation in Microelectronics
, pp.
154
164
, April, 15–17.
8.
Fan
,
X. J.
, 2000, “
Modeling of Vapor Pressure During Reflow for Electronic Packages
,“ in
Benefiting from Thermal and Mechanical Simulation in Micro-Electronics
,
G. Q.
Zhang
et al.
(eds.),
Kluwer Academic
, Boston, MA, pp.
75
92
.
9.
Tee
,
T. Y.
, and
Fan
,
X. J.
, 1999, “
Modeling of Whole Field Vapor Pressure During Reflow for Flip Chip BGA and Wire-Bond PBGA Packages
,”
1st Int. Workshop on Electronic Materials and Packaging
, Singapore, Sept. 29-Oct. 1, pp.
38
45
.
You do not currently have access to this content.