Abstract
An analytical model is developed for natural convection from a single circuit board in a sealed electronic equipment enclosure. The circuit card is modeled as a vertical isothermal plate located at the center of an isothermal, cuboid shaped enclosure. A composite model is developed based on asymptotic solutions for three limiting cases: pure conduction, laminar boundary layer convection, and transition flow convection. The conduction shape factor and natural convection models are validated using data from CFD simulations for a wide range of enclosure geometries and flow conditions. The model is shown to be in good agreement, to within 10% RMS, with the numerical data for all test configurations.
Issue Section:
Research
Papers
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Flomerics Inc.
, 2004, 257 Turnpike Rd. Suite 100, Southborough, MA.14.
Fluent Inc.
, 2004, 10 Cavendish Court, Lebanon, NH.Copyright © 2004
by IEEE
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