This paper presents the results of a comprehensive numerical study of the thermal performance of Tape Ball Grid Array package mounted on one side of a printed circuit board as well as packages mounted in back-to-back and offset configurations. A cover plate is attached to the back side of the chips to enhance heat transfer from the module. The assembled organic carrier is placed in a vertical channel. A conjugate heat transfer model is used which accounts for conduction in the packages and the card and convection in the surrounding air. The effect of location of the modules on a card with zero, one and two power planes is evaluated for thermal performance. Heat dissipation is studied for forced convection (2, 1, and 0.5m∕s⁠). Comparison is made for single sided and back-to-back cases.

Issue Section:
Research Papers
Keywords:
ball grid arrays, printed circuits, forced convection
Topics:
Air flow, Ball-Grid-Array packages, Energy dissipation, Forced convection, Heat, Heat transfer, Numerical analysis, Temperature, Junctions, Temperature distribution, Ball-Grid-Array packaging, Convection, Heat conduction
1.
Mulgaonker
,
S.
,
Chambers
,
B.
, and
Mahalingam
,
M.
, 1995, “
An Assessment of the Thermal Performance of the PBGA Family
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
1070-9886,
18
(
4
), pp.
739
–
748
.
Crossref
Search ADS
 
2.
Guenin
,
B. M.
,
Marrs
,
R. C.
, and
Molnar
,
R. J.
, 1995, “
Analysis of a Thermally Enhanced Ball Grid Array Package
,”
IEEE Trans. Compon., Packag. Manuf. Technol., Part A
1070-9886,
18
(
4
), pp.
749
–
757
.
Crossref
Search ADS
 
3.
Chyu
,
M. K.
, and
Aghazadeh
,
A.
, 1988, “
Modeling and Measurements of Heatspreader Thermal Performance in Molded Plastic Packages
,”
Cooling Technology for Electronic Equipment
, edited by
W.
Aung
,
Hemisphere
, Washington, DC, pp.
781
–
793
.
4.
Sathe
,
S. B.
, and
Joshi
,
Y.
, 1992, “
Natural Convection Liquid Cooling of a Substrate Mounted Protrusion in a Square Enclosure: A Parametric Study
,”
ASME J. Heat Transfer
0022-1481,
114
, pp.
401
–
409
.
Crossref
Search ADS
 
5.
Wroblewski
,
D.
, and
Joshi
,
Y.
, 1993, “
Computations of Liquid Immersion Cooling for a Protruding Heat Source in a Cubical Enclosure
”,
Int. J. Heat Mass Transfer
0017-9310,
36
, pp.
1201
–
1218
.
Crossref
Search ADS
 
6.
Joshi
,
Y.
,
Haukenes
,
L. O.
, and
Sathe
,
S. B.
, 1993, “
Natural Convection in a Rectangular Enclosure Due to a Flush Heat Source Mounted on a Vertical Surface
,”
Int. J. Heat Mass Transfer
0017-9310,
36
, pp.
249
–
263
.
Crossref
Search ADS
 
7.
Gebhart
,
B.
,
Jaluria
,
Y.
,
Mahajan
,
R. L.
, and
Sammakia
,
B. G.
, 1988,
Buoyancy Induced Flows and Transport
, Reference ed.,
Hemisphere
, Washington, DC.
8.
Buller
,
M. L.
, and
Kilburn
,
R. F.
, 1981, “
Evaluation of Surface Heat Transfer Coefficients for Electronic Module Packages
,”
HTD (Am. Soc. Mech. Eng.)
0272-5673,
20
, pp.
25
–
28
.
9.
Chang
,
M J.
. ,
Shyu
,
R. J.
, and
Fang
,
L. J.
, 1987, “
An Experimental Study of Heat Transfer From Surface Mounted Components to a Channel Airflow
,” ASME Paper No. 87-HT-75 presented at National Heat Transfer Conference, Pittsburgh, PA.
10.
Reynolds
,
S. D.
,
Sammakia
,
B. G.
, and
Carden
,
T. F.
, 1995, “
Thermal Enhancements for a Thin Film Chip Carrier
,”
IEEE Trans. Compon., Hybrids, Manuf. Technol.
0148-6411,
15
(
5
), pp.
699
–
706
.
Crossref
Search ADS
 
11.
Shaukatullah
,
H.
,
Gaynes
,
M.
, and
White
,
L. H.
, 1994, “
A Non-Dimensional Correlation for the External Thermal Characteristics of Surface Mount Metal Quad Flat Packs
,” Intersociety Conference on Thermal Phenomenon, IEEE I-THERM IV Proceedings, 1994,
Washington
DC, pp.
237
–
244
.
12.
Sathe
,
S.
, and
Sammakia
,
B. G.
, 1996, “
A Numerical Study of the Thermal Performance of a Tape Ball Grid Array Package
,” Proceedings of the National Heat Transfer Conference, Vol.
7
, pp.
83
–
92
.
13.
Sathe
,
S.
, and
Sammakia
,
B. G.
, 1998, “
Some Aspects of the Thermal Performance of a Tape Ball Grid Array Package
,” Proceedings of the ASME, Vol.
8
, pp.
747
–
756
.
14.
Tonapi
,
S.
,
Sathe
,
S.
,
Srihari
,
K.
, and
Sammakia
,
B.
, 2000, “
Parametric Studies of the Thermal Performance of a Tape Ball Grid Array Package
,” Proceedings of the ASME IMECE, Vol.
8
, pp.
475
–
483
.
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 by American Society of Mechanical Engineers
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