This study examines the spreading ability of rectangular plates numerically, analytically, and experimentally. The effect of aspect ratio, defined as an equivalent radius of a heater divided by that of a spreader plate, is investigated. The numerical results show a very good agreement with the analytical solutions. From the calculated results, the spreading resistance of the conduction plates with a small aspect ratio is higher than the one-dimensional conduction resistance. Calculated results also show that the spreading ability of a metal plate would be affected slightly by the external convective heat-transfer coefficient when the ratio of the longitudinal heat convection to the lateral heat spreading is less than 0.1. In addition to the numerical analysis, experimental comparisons between copper∕aluminum plates and a vapor chamber having the same thickness have been conducted. The experimental results show that the thermal resistance of the metal plates is independent of input power whereas that of the vapor chamber shows a noticeable drop with increased power. For the influence of concentrated heat source, the surface temperature distributions for the metal plates become concentrated with a reduced aspect ratio. However, the variations of the aspect ratio and the input power would yield minor effects to the surface temperature distribution of the vapor chamber. As compared with the conduction plates, the vapor chamber would offer a lower temperature rise and a more uniform temperature distribution. Thus, the vapor chamber provides a better choice as a heat spreader for concentrated heat sources.
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e-mail: d903102@oz.nthu.edu.tw
e-mail: khchien@itri.org.tw
e-mail: ccwang@itri.org.tw
e-mail: tchung@isu.edu.tw
e-mail: ymferng@mail.ess.nthu.edu.tw
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September 2007
Technical Papers
Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber
Yen-Shu Chen,
Yen-Shu Chen
Department of Engineering and System Science,
e-mail: d903102@oz.nthu.edu.tw
National Tsing Hua University
, Hsinchu 30013, Taiwan, Republic of China
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Kuo-Hsiang Chien,
Kuo-Hsiang Chien
Researcher
Energy & Environment Research Laboratories,
e-mail: khchien@itri.org.tw
Industrial Technology Research Institute
, Hsinchu 310, Taiwan, Republic of China
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Chi-Chuan Wang,
Chi-Chuan Wang
Senior Lead Researcher
Energy & Environment Research Laboratories,
e-mail: ccwang@itri.org.tw
Industrial Technology Research Institute
, Hsinchu 310, Taiwan, Republic of China
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Tzu-Chen Hung,
Tzu-Chen Hung
Professor
Department of Mechanical and Automation Engineering,
e-mail: tchung@isu.edu.tw
I-Shou University
, Kaohsiung County 840, Taiwan, Republic of China
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Yuh-Ming Ferng,
Yuh-Ming Ferng
Researcher
Nuclear Science and Technology Development Center,
e-mail: ymferng@mail.ess.nthu.edu.tw
National Tsing Hua University
, Hsinchu 30013, Taiwan, Republic of China
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Bau-Shei Pei
Bau-Shei Pei
Professor
Department of Engineering and System Science,
National Tsing Hua University
, Hsinchu 30013, Taiwan, Republic of China
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Yen-Shu Chen
Department of Engineering and System Science,
National Tsing Hua University
, Hsinchu 30013, Taiwan, Republic of Chinae-mail: d903102@oz.nthu.edu.tw
Kuo-Hsiang Chien
Researcher
Energy & Environment Research Laboratories,
Industrial Technology Research Institute
, Hsinchu 310, Taiwan, Republic of Chinae-mail: khchien@itri.org.tw
Chi-Chuan Wang
Senior Lead Researcher
Energy & Environment Research Laboratories,
Industrial Technology Research Institute
, Hsinchu 310, Taiwan, Republic of Chinae-mail: ccwang@itri.org.tw
Tzu-Chen Hung
Professor
Department of Mechanical and Automation Engineering,
I-Shou University
, Kaohsiung County 840, Taiwan, Republic of Chinae-mail: tchung@isu.edu.tw
Yuh-Ming Ferng
Researcher
Nuclear Science and Technology Development Center,
National Tsing Hua University
, Hsinchu 30013, Taiwan, Republic of Chinae-mail: ymferng@mail.ess.nthu.edu.tw
Bau-Shei Pei
Professor
Department of Engineering and System Science,
National Tsing Hua University
, Hsinchu 30013, Taiwan, Republic of ChinaJ. Electron. Packag. Sep 2007, 129(3): 348-355 (8 pages)
Published Online: December 19, 2006
Article history
Received:
August 28, 2006
Revised:
December 19, 2006
Citation
Chen, Y., Chien, K., Wang, C., Hung, T., Ferng, Y., and Pei, B. (December 19, 2006). "Investigations of the Thermal Spreading Effects of Rectangular Conduction Plates and Vapor Chamber." ASME. J. Electron. Packag. September 2007; 129(3): 348–355. https://doi.org/10.1115/1.2753970
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