An effective method for performing the thermal optimization of stationary and rotating multichip module (MCM) disks with an unconfined round-jet impingement under space limitation constraint has been successfully developed. The design variables of stationary and rotating MCM disks with an unconfined round-jet impingement include the ratio of jet separation distance to nozzle diameter, Grashof number, jet Reynolds number, and rotational Reynolds number. The total experimental cases for stationary and rotating MCM disks are statistically designed by the central composite design method. In addition, a sensitivity analysis, the so-called analysis of variance, for the design factors has been performed. Among the influencing parameters, the jet Reynolds number dominates the thermal performance, while the Grashof number is found to have the least effect on heat-transfer performance for both stationary and rotating cases. Furthermore, the comparisons between the predictions by using the quadratic response surface methodology and the experimental data for both stationary and rotating cases are made with a satisfactory agreement. Finally, with the sequential quadratic programming technique, a series of thermal optimizations under multiconstraints—such as space, jet Reynolds number, rotational Reynolds number, nozzle exit velocity, disk rotational speed, and various power consumptions—has been systematically explored and discussed.
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e-mail: yhhung@pme.nthu.edu.tw
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December 2007
Research Papers
Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement
Y. C. Lee,
Y. C. Lee
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.C
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C. J. Fang,
C. J. Fang
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.C
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M. C. Wu,
M. C. Wu
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.C
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C. H. Peng,
C. H. Peng
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.C
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Y. H. Hung
Y. H. Hung
Fellow ASME
Department of Power Mechanical Engineering,
e-mail: yhhung@pme.nthu.edu.tw
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.C
Search for other works by this author on:
Y. C. Lee
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.C
C. J. Fang
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.C
M. C. Wu
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.C
C. H. Peng
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.C
Y. H. Hung
Fellow ASME
Department of Power Mechanical Engineering,
National Tsing Hua University
, Hsinchu 30013, Taiwan, R.O.Ce-mail: yhhung@pme.nthu.edu.tw
J. Electron. Packag. Dec 2007, 129(4): 411-420 (10 pages)
Published Online: January 25, 2007
Article history
Received:
July 10, 2006
Revised:
January 25, 2007
Citation
Lee, Y. C., Fang, C. J., Wu, M. C., Peng, C. H., and Hung, Y. H. (January 25, 2007). "Heat-Transfer Optimization for Multichip Module Disks With an Unconfined Round Air Jet Impingement." ASME. J. Electron. Packag. December 2007; 129(4): 411–420. https://doi.org/10.1115/1.2804089
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