Comprehensive analysis of microelectronic cooling systems utilizing thermoelectric modules is time consuming because it involves solving many parametric equations, which require solving complex mathematical equations or the assistance of an expensive computation-fluid-dynamic software. In this study, a modified-graphical method (MGM) based on a previous study by Lineykin and Ben-Yaakov is proposed to analyze an active cooling system using thermoelectric modules. The MGM provides quicker visualization of the cooling requirement such as the optimum operating currents, temperature of the hot side, and coefficient of performance without the need of using any manufacturer’s proprietary data. In addition, the MGM is designed to analyze a multidimensional-heat-transfer-system utilizing thermoelectric modules (Phan, H., and Agonafer, D., 2010, “Experimental Analysis Model of an Active Cooling Method for 3D-ICs Utilizing Multidimensional Configured Thermoelectric Coolers,” ASME J. Electron. Packag. 132(2), p. 024501).
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September 2011
Research Papers
Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System
Huy N. Phan,
Huy N. Phan
Department of Mechanical and Aerospace Engineering,
University of Texas at Arlington
, Arlington, TX 76019
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Dereje Agonafer
Dereje Agonafer
Department of Mechanical and Aerospace Engineering,
University of Texas at Arlington
, Arlington, TX 76019
Search for other works by this author on:
Huy N. Phan
Department of Mechanical and Aerospace Engineering,
University of Texas at Arlington
, Arlington, TX 76019
Dereje Agonafer
Department of Mechanical and Aerospace Engineering,
University of Texas at Arlington
, Arlington, TX 76019J. Electron. Packag. Sep 2011, 133(3): 031003 (5 pages)
Published Online: September 14, 2011
Article history
Received:
May 18, 2010
Revised:
May 25, 2011
Online:
September 14, 2011
Published:
September 14, 2011
Citation
Phan, H. N., and Agonafer, D. (September 14, 2011). "Thermoelectric Cooling Analysis Using Modified-Graphical-Method for Multidimensional-Heat-Transfer-System." ASME. J. Electron. Packag. September 2011; 133(3): 031003. https://doi.org/10.1115/1.4004847
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