Design, fabrication, and test results of a novel 3-layer RF package using a commonly available high frequency laminate are presented in this paper. The developed package can be manufactured using standard multilayer printed circuit board (PCB) manufacturing techniques making it cost effective for commercial applications. The package exhibits excellent RF characteristics up to 6 GHz.
Issue Section:Technical Briefs
Keywords:multilayer, EM simulation, MS-strip-MS transition
Topics:Design, Laminates, Manufacturing, Simulation, Strip transmission lines, Strips
A High Performance Quartz Package for Millimetre Wave Applications,”
IEEE MTT-S International Microwave Symposium Digest, Boston, MA, June 10–14, Vol. 3, pp. 1063–1066.10.1109/MWSYM.1991.147197
E. J., and
Development of Plastic Encapsulated Multichip Technology for High Volume, Low Cost Commercial Electronics,”
IEEETransactions on Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, Vol. 18(1), pp. 59–65.10.1109/96.36549010.1109/96.365490
A New Low Cost Packaging Technique for SMT Insertion of Millimetre Wave MMICs,”
Proceedings of the 29th European Microwave Conference, Munich, October 5–7, Vol. 3, pp.
A Low Cost Packaging Solution for Microwave Applications,”
Proceedings of the 1st European Microwave Integrated Circuits Conference, Manchester, UK, September 10–13, pp.
A Time-Domain Approach for Wideband Modeling of Electronic Packages,”
Int. J. RF Microwave Comput.-Aided Eng.,
CST Microwave Studio, Computer Simulation Technology, GmbH, Darmstadt, Germany.
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