The improved efficiency of mineral oil may offer simplicity in facility design compared to traditional air cooling and provide a means for cost savings. Despite its improved cooling efficiency and cost savings, a mineral oil immersion cooling technique is still not widely implemented and original equipment manufacturers are reluctant to jeopardize sales of existing air-based cooling system equipment. Only compelling physics regarding thermal performance of direct immersion cooling is not enough for data center operators. Many uncertainties and concerns persist regarding the effects of mineral oil immersion cooling on the reliability of information technology (IT) equipment both at the component and chassis level. This paper is a first attempt at addressing this challenge by reviewing the changes in physical and chemical properties of IT equipment materials like polyvinyl chloride (PVC), printed circuit board (PCB), and capacitors and characterizes the interconnect reliability of materials. The changes in properties of a mineral oil like kinematic viscosity and dielectric strength are also cited as important factors and discussed briefly. The changes in mechanical properties like elasticity, hardness, swelling, and creep are being shown in the paper for thermoplastic materials. The chemical reaction between material and mineral oil as a function of time and temperature is also conferred. The literature gathered on the subject and quantifiable data gathered by the authors provide the primary basis for this research document.
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June 2019
Research-Article
Reliability Considerations for Oil Immersion-Cooled Data Centers
Jimil M. Shah,
Jimil M. Shah
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
e-mail: jimil.shah@mavs.uta.edu
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
e-mail: jimil.shah@mavs.uta.edu
1Corresponding author.
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Richard Eiland,
Richard Eiland
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
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Pavan Rajmane,
Pavan Rajmane
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
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Ashwin Siddarth,
Ashwin Siddarth
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
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Dereje Agonafer,
Dereje Agonafer
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
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Veerendra Mulay
Veerendra Mulay
Facebook, Inc.,
Menlo Park, CA 425081
Menlo Park, CA 425081
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Jimil M. Shah
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
e-mail: jimil.shah@mavs.uta.edu
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
e-mail: jimil.shah@mavs.uta.edu
Richard Eiland
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Pavan Rajmane
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Ashwin Siddarth
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Dereje Agonafer
Department of Mechanical and Aerospace
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Engineering,
University of Texas at Arlington,
P.O. Box 19023,
Arlington, TX 76013
Veerendra Mulay
Facebook, Inc.,
Menlo Park, CA 425081
Menlo Park, CA 425081
1Corresponding author.
Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the JOURNAL OF ELECTRONIC PACKAGING. Manuscript received June 20, 2018; final manuscript received February 15, 2019; published online April 10, 2019. Assoc. Editor: Baris Dogruoz.
J. Electron. Packag. Jun 2019, 141(2): 021007 (9 pages)
Published Online: April 10, 2019
Article history
Received:
June 20, 2018
Revised:
February 15, 2019
Citation
Shah, J. M., Eiland, R., Rajmane, P., Siddarth, A., Agonafer, D., and Mulay, V. (April 10, 2019). "Reliability Considerations for Oil Immersion-Cooled Data Centers." ASME. J. Electron. Packag. June 2019; 141(2): 021007. https://doi.org/10.1115/1.4042979
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