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Issues
June 1990
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Creep in Shear of Experimental Solder Joints
J. Electron. Packag. June 1990, 112(2): 87–93.
doi: https://doi.org/10.1115/1.2904363
Topics:
Creep
,
Shear (Mechanics)
,
Solder joints
,
Fatigue
,
Temperature
,
Fatigue failure
,
Solders
,
Tin
,
Alloys
,
Electronics
Isothermal Fatigue Behavior of Sn-Pb Solder Joints
J. Electron. Packag. June 1990, 112(2): 94–99.
doi: https://doi.org/10.1115/1.2904364
Topics:
Fatigue
,
Solder joints
,
Tin
,
Solders
,
Fatigue life
,
Copper
,
Displacement
,
Failure mechanisms
,
Shear (Mechanics)
,
Stress
The Creep-Fatigue Interaction in Solders and Solder Joints
J. Electron. Packag. June 1990, 112(2): 100–103.
doi: https://doi.org/10.1115/1.2904348
Topics:
Creep
,
Fatigue
,
Solder joints
,
Solders
,
Fatigue cracks
,
Failure
,
Fatigue life
,
Grain boundaries
,
Cycles
,
Grain size
A Mechanistic Model for Solder Joint Failure Prediction Under Thermal Cycling
J. Electron. Packag. June 1990, 112(2): 104–109.
doi: https://doi.org/10.1115/1.2904349
Topics:
Failure
,
Solder joints
,
Fracture (Materials)
,
Solders
,
Crack propagation
,
Surface mount packaging
,
Deformation
,
Resistors
,
Tin
Isothermal Fatigue of 63Sn-37Pb Solder
J. Electron. Packag. June 1990, 112(2): 110–114.
doi: https://doi.org/10.1115/1.2904350
Topics:
Fatigue
,
Solders
,
Fatigue life
,
Cycles
,
Temperature
,
Tension
,
Failure
,
Fracture (Process)
,
Tin
,
Compressive stress
Assembly Stiffness and Failure Criterion Considerations in Solder Joint Fatigue
J. Electron. Packag. June 1990, 112(2): 115–122.
doi: https://doi.org/10.1115/1.2904351
Topics:
Failure
,
Fatigue
,
Manufacturing
,
Solder joints
,
Stiffness
,
Damage
,
Displacement
,
Fatigue life
,
Deformation
,
Engineering simulation
High and Low Temperature Strain-Life Behavior of a Pb Rich Solder
J. Electron. Packag. June 1990, 112(2): 123–128.
doi: https://doi.org/10.1115/1.2904352
Topics:
Low temperature
,
Solders
,
Fatigue
,
Fatigue life
,
Temperature
Combined Vibrational and Thermal Solder Joint Fatigue—A Generalized Strain Versus Life Approach
J. Electron. Packag. June 1990, 112(2): 129–134.
doi: https://doi.org/10.1115/1.2904353
Topics:
Fatigue
,
Solder joints
,
Cycles
,
Stress
,
Fatigue life
,
Reliability
,
Solders
,
Approximation
,
Damage
,
Failure
Solder Joint Reliability — Design Implications From Finite Element Modeling and Experimental Testing
J. Electron. Packag. June 1990, 112(2): 135–146.
doi: https://doi.org/10.1115/1.2904354
Topics:
Design
,
Finite element analysis
,
Modeling
,
Reliability
,
Solder joints
,
Testing
,
Fatigue life
,
Stress
,
Fracture toughness
,
Temperature
Analysis of Parameters Influencing Stresses in the Solder Joints of Leadless Chip Capacitors
J. Electron. Packag. June 1990, 112(2): 147–153.
doi: https://doi.org/10.1115/1.2904355
Topics:
Capacitors
,
Solder joints
,
Stress
,
Design
,
Rotation
,
Solders
,
Ceramics
,
Manufacturing
,
Printed circuit boards
Determination of Stress Intensity Factors for Interfacial Cracks in Bimaterial Systems
J. Electron. Packag. June 1990, 112(2): 154–161.
doi: https://doi.org/10.1115/1.2904356
Topics:
Fracture (Materials)
,
Stress
,
Finite element methods
,
Geometry
,
Numerical analysis
,
Shear (Mechanics)
Fracture of Glass Seals in Surface Mount IC Packages
J. Electron. Packag. June 1990, 112(2): 162–167.
doi: https://doi.org/10.1115/1.2904357
Strength Analysis of Surface Mounted Assemblies Under Bending and Twisting Loads
J. Electron. Packag. June 1990, 112(2): 168–174.
doi: https://doi.org/10.1115/1.2904358
Topics:
Stress
,
Deflection
,
Deformation
,
Engineering simulation
,
Experimental analysis
,
Failure
,
Simulation
,
Simulation results
Oxidation of (Pb, Sn) and (Pb, In) Alloys
J. Electron. Packag. June 1990, 112(2): 175–178.
doi: https://doi.org/10.1115/1.2904359
Topics:
Alloys
,
Oxidation
,
Tin
,
Augers
,
Grain boundaries
,
Diffusion (Physics)
,
Electron spectroscopy
,
Eutectic alloys
,
Indium alloys
,
Temperature
Micromechanical Method to Predict Fatigue Life of Solder
J. Electron. Packag. June 1990, 112(2): 179–182.
doi: https://doi.org/10.1115/1.2904360
Topics:
Fatigue life
,
Solders
,
Fatigue
,
Tension
,
Constitutive equations
,
Hardening
,
Stress
Discussions
Discussion: Notes on Microelectronics Packaging Handbook by Rao Tummala and Eugene Rymaszewski, Van Nostrand, 1988
J. Electron. Packag. June 1990, 112(2): 183–184.
doi: https://doi.org/10.1115/1.2904361
Topics:
Microelectronic packaging
Book Reviews
Soldering in Electronics, Second Edition
J. Electron. Packag. June 1990, 112(2): 185–186.
doi: https://doi.org/10.1115/1.2904362
Topics:
Electronics
,
Soldering
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