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Issues
September 1990
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Research Papers
Sensor Technology for ZIF Connectors
J. Electron. Packag. September 1990, 112(3): 187–191.
doi: https://doi.org/10.1115/1.2904365
Analysis of Insertion Force in Elastic/Plastic Mating
J. Electron. Packag. September 1990, 112(3): 192–197.
doi: https://doi.org/10.1115/1.2904366
Topics:
Deformation
,
Electronic systems
,
Equilibrium (Physics)
,
Friction
,
Simulation
Damage Boundary Curves: A Computational (FEM) Approach
J. Electron. Packag. September 1990, 112(3): 198–203.
doi: https://doi.org/10.1115/1.2904367
Solder-Glass Attachment in Cerdip/Cerquad Packages: Thermally Induced Stresses and Mechanical Reliability
J. Electron. Packag. September 1990, 112(3): 204–209.
doi: https://doi.org/10.1115/1.2904368
Topics:
Glass
,
Reliability
,
Solders
,
Stress
Solder Joint Formation in Surface Mount Technology—Part I: Analysis
J. Electron. Packag. September 1990, 112(3): 210–218.
doi: https://doi.org/10.1115/1.2904369
Topics:
Solder joints
,
Surface mount technology
,
Solders
,
Density
,
Dimensions
,
Shapes
,
Surface mount packaging
,
Surface tension
Solder Joint Formation in Surface Mount Technology—Part II: Design
J. Electron. Packag. September 1990, 112(3): 219–222.
doi: https://doi.org/10.1115/1.2904370
Topics:
Design
,
Solder joints
,
Surface mount technology
,
Surface tension
,
Density
,
Dimensions
,
Solders
,
Surface mount packaging
A Comparison of the Solderability of Wrought and Plated Nickel Surfaces: The Selection of a Reliable Pin for Second Level Packaging
J. Electron. Packag. September 1990, 112(3): 223–233.
doi: https://doi.org/10.1115/1.2904371
Topics:
Nickel
,
Packaging
,
Intermetallic compounds
,
Tin
,
Gold plating
,
Alloys
,
Contamination
,
Nickel plating
,
Particulate matter
,
Pins (Engineering)
A Study of Forced Convection Direct Air Cooling in the Downstream Vicinity of Heat Sinks
J. Electron. Packag. September 1990, 112(3): 234–240.
doi: https://doi.org/10.1115/1.2904372
Topics:
Cooling
,
Forced convection
,
Heat sinks
,
Heat transfer coefficients
,
Channel flow
,
Convection
,
Electronic packaging
,
Flow (Dynamics)
,
Geometry
,
Heat transfer
Enhancement of Critical Heat Flux From High Power Microelectronic Heat Sources in a Flow Channel
J. Electron. Packag. September 1990, 112(3): 241–248.
doi: https://doi.org/10.1115/1.2904373
Topics:
Critical heat flux
,
Flow (Dynamics)
,
Heat
,
Subcooling
,
Boiling
,
Fins
,
Flux (Metallurgy)
Effects of Heat Intensity, Size, and Position of the Components on Temperature Distribution Within an Electronic PCB Enclosure
J. Electron. Packag. September 1990, 112(3): 249–254.
doi: https://doi.org/10.1115/1.2904374
Topics:
Air flow
,
Boundary-value problems
,
Flow (Dynamics)
,
Heat
,
Heat transfer
,
Laminar flow
,
Natural convection
,
Temperature
,
Temperature distribution
Holographic Interferometry Using Self-Developing Optical Crystals for Heat Flux Evaluation
J. Electron. Packag. September 1990, 112(3): 255–259.
doi: https://doi.org/10.1115/1.2904375
Topics:
Crystals
,
Heat flux
,
Holographic interferometry
,
Heat transfer
,
Fluids
,
Heating and cooling
,
Interferometry
,
Iron
,
Lithium
,
Steady state
A Zonal Decomposition Methodology for Detailed Temperature Field Evaluation
J. Electron. Packag. September 1990, 112(3): 260–266.
doi: https://doi.org/10.1115/1.2904376
Topics:
Temperature
,
Heat conduction
,
Electronics
,
Heat transfer
Packaging Architecture Considerations of High Density Multi-Chip Electronic Packages Via System Optimization
J. Electron. Packag. September 1990, 112(3): 267–271.
doi: https://doi.org/10.1115/1.2904377
Indentation Method to Measure Plating Ductility
J. Electron. Packag. September 1990, 112(3): 272–277.
doi: https://doi.org/10.1115/1.2904378
Topics:
Ductility
,
Plating
,
Fracture (Materials)
,
Displacement
,
Durability
,
Electron microscopy
,
X-rays
Book Reviews
Tribology and Mechanics of Magnetic Storage Devices
J. Electron. Packag. September 1990, 112(3): 278.
doi: https://doi.org/10.1115/1.2904379
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