Topics: Deformation , Modeling , Solder joints , Cycles , Fatigue life , Stress , Temperature , Constitutive equations , Failure , Finite element analysis

A New Model for Accelerated Thermal Cycle Testing With Application to TAB Leads and PCB PTHs

R. G. Bayer

J. Electron. Packag. March 1994, 116(1): 16–22. doi: https://doi.org/10.1115/1.2905487

Abstract

View articletitled, A New Model for Accelerated Thermal Cycle Testing With Application to TAB Leads and PCB PTHs

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Topics: Cycles , Fatigue , Lumber , Testing

A Numerical Lead Frame Compliance and Stress Model

Lewis S. Goldmann

J. Electron. Packag. March 1994, 116(1): 23–29. doi: https://doi.org/10.1115/1.2905489

Abstract

View articletitled, A Numerical Lead Frame Compliance and Stress Model

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Topics: Computers , Shapes , Splines , Stress , Surface mount packaging , Thermal stresses

Study of an Air Cooling Scheme for 3-D Packaging

H. Xie, Y. C. Lee

J. Electron. Packag. March 1994, 116(1): 30–36. doi: https://doi.org/10.1115/1.2905490

Abstract

View articletitled, Study of an Air Cooling Scheme for 3-D Packaging

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Topics: Cooling , Packaging , Energy dissipation , Flow (Dynamics) , Temperature , Circuits , Electrical measurement , Computer simulation , Flight , Heat sinks

Thermal Reliability of a Bilayer Slab Subjected to a Local Heat Source

T. Elperin, G. Rudin

J. Electron. Packag. March 1994, 116(1): 37–43. doi: https://doi.org/10.1115/1.2905491

Abstract

View articletitled, Thermal Reliability of a Bilayer Slab Subjected to a Local Heat Source

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Topics: Heat , Reliability , Slabs , Coating processes , Coatings , Temperature , Thermal stresses , Stress tensors

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy

J. Electron. Packag. March 1994, 116(1): 44–48. doi: https://doi.org/10.1115/1.2905492

Abstract

View articletitled, Heat Transfer in Wire Bonding Process

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Topics: Heat transfer , Wire bonding , Electrodes , Wire , Electric discharge , Electric fields , Electric potential , Engineering simulation , Flux (Metallurgy) , Heat

Convective Heat Transfer Distribution on the Surface of an Electronic Package

R. A. Wirtz, Ashok Mathur

J. Electron. Packag. March 1994, 116(1): 49–54. doi: https://doi.org/10.1115/1.2905493

Abstract

View articletitled, Convective Heat Transfer Distribution on the Surface of an Electronic Package

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Topics: Convection , Electronic packages , Heat transfer coefficients , Reynolds number , Coolants

The Thermal Wake Function for Rectangular Electronic Modules

S. S. Kang

J. Electron. Packag. March 1994, 116(1): 55–59. doi: https://doi.org/10.1115/1.2905494

Abstract

View articletitled, The Thermal Wake Function for Rectangular Electronic Modules

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Topics: Wakes , Flow (Dynamics) , Heat , Turbulence

A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks

I. Ahmed, R. J. Krane, J. R. Parsons

J. Electron. Packag. March 1994, 116(1): 60–67. doi: https://doi.org/10.1115/1.2905495

Abstract

View articletitled, A Preliminary Investigation of the Cooling of Electronic Components With Flat Plate Heat Sinks

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Topics: Cooling , Electronic components , Flat plates , Heat sinks , Computer simulation , Natural convection , Temperature , Algorithms , Coatings , Emissivity

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