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Issues
March 1998
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Editorial
The Future of Microelectronics and Photonics and the Role of Mechanics and Materials
J. Electron. Packag. March 1998, 120(1): 1–11.
doi: https://doi.org/10.1115/1.2792280
Topics:
Microelectronic devices
,
Photonics
Technical Papers
Effect of Component Heterogeneity on Global CTE Mismatch Displacement in Areal-Array Solder Interconnects
J. Electron. Packag. March 1998, 120(1): 12–17.
doi: https://doi.org/10.1115/1.2792278
Topics:
Displacement
,
Solders
,
Die cutting
,
Dimensions
,
Shearing (Deformation)
,
Thermal energy
,
Elastic moduli
,
High temperature
,
Manufacturing
,
Relaxation (Physics)
Shearing Deformation in Partial Areal Arrays: Analytical Results
J. Electron. Packag. March 1998, 120(1): 18–23.
doi: https://doi.org/10.1115/1.2792279
A Finite Element Procedure of a Cyclic Thermoviscoplasticity Model for Solder and Copper Interconnects
J. Electron. Packag. March 1998, 120(1): 24–34.
doi: https://doi.org/10.1115/1.2792281
Topics:
Copper
,
Finite element analysis
,
Solders
,
Thermomechanics
,
Constitutive equations
,
Electronic packaging
,
Simulation
,
Algorithms
,
Computation
,
Creep
Towards an Integrated Approach for Analysis and Design of Wafer Slicing by a Wire Saw
J. Electron. Packag. March 1998, 120(1): 35–40.
doi: https://doi.org/10.1115/1.2792283
Topics:
Design
,
Semiconductor wafers
,
Wire
,
Cutting
,
Algorithms
,
Feedback
,
Finishes
,
Finite element methods
,
Fracture (Materials)
,
Fracture (Process)
Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 1—Theory and Formulation
J. Electron. Packag. March 1998, 120(1): 41–47.
doi: https://doi.org/10.1115/1.2792284
Topics:
Electronic packaging
,
Finite element analysis
,
Thermomechanics
,
Constitutive equations
,
Cycles
,
Damage
,
Deformation
,
Design
,
Failure
,
Semiconductor devices
Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application
J. Electron. Packag. March 1998, 120(1): 48–53.
doi: https://doi.org/10.1115/1.2792285
Topics:
Electronic packaging
,
Finite element analysis
,
Thermomechanics
,
Alloys
,
Solders
,
Modeling
,
Surface mount technology
The Effect of Stencil Printing Optimization on Reliability of CBGA and PBGA Solder Joints
J. Electron. Packag. March 1998, 120(1): 54–60.
doi: https://doi.org/10.1115/1.2792286
Topics:
Optimization
,
Printing
,
Reliability
,
Solder joints
,
Solders
,
Ball-Grid-Array packaging
,
Ceramics
,
Fatigue life
,
Cycles
,
Design
Analysis of Tombstoning Phenomenon During Reflow
J. Electron. Packag. March 1998, 120(1): 61–67.
doi: https://doi.org/10.1115/1.2792287
Topics:
Algebra
,
Dynamic models
,
Equations of motion
,
Geometry
,
Gravity (Force)
,
Solders
Orifice and Impingement Flow Fields in Confined Jet Impingement
J. Electron. Packag. March 1998, 120(1): 68–72.
doi: https://doi.org/10.1115/1.2792288
Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid
J. Electron. Packag. March 1998, 120(1): 73–81.
doi: https://doi.org/10.1115/1.2792289
Topics:
Cavities
,
Cooling
,
Heat
,
Natural convection
,
Heat transfer
,
Ceramics
,
Flow (Dynamics)
,
Electrical wires
,
Electronic equipment
,
Heat conduction
Photothermal Reliability Testing of a Multilayer Coating—Substrate Assembly: A Theoretical Approach
J. Electron. Packag. March 1998, 120(1): 82–88.
doi: https://doi.org/10.1115/1.2792290
Topics:
Accelerated life testing
,
Coating processes
,
Coatings
,
Manufacturing
,
Deflection
,
Pumps
,
Laser beams
,
Probes
,
Temperature
,
Thermal stresses
Natural Convection Air Cooling of a Discrete Heat Source on a Conducting Board in a Shallow Horizontal Enclosure
J. Electron. Packag. March 1998, 120(1): 89–97.
doi: https://doi.org/10.1115/1.2792291
Topics:
Cooling
,
Heat
,
Natural convection
,
Heat transfer coefficients
,
Heat conduction
,
Plates (structures)
Advanced Heat Exchange Technology for Thermoelectric Cooling Devices
J. Electron. Packag. March 1998, 120(1): 98–105.
doi: https://doi.org/10.1115/1.2792292
A Finite-Element and Experimental Analysis of Stress Distribution in Various Shear Tests for Solder Joints
J. Electron. Packag. March 1998, 120(1): 106–113.
doi: https://doi.org/10.1115/1.2792277
Topics:
Experimental analysis
,
Finite element analysis
,
Shear (Mechanics)
,
Solder joints
,
Stress concentration
,
Creep
,
Simulation results
,
Stress
,
Alloys
,
Deformation
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