Volume 125 Issue 1 | J. Electron. Packag.

Topics: Finite element analysis , Modeling , Residual stresses , Stress , Stress analysis (Engineering) , Temperature , Thin films , Microelectromechanical systems

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Michael C. Larson, Mem. ASME, Melody A. Verges, Mem. ASME

J. Electron. Packag. March 2003, 125(1): 18–23. doi: https://doi.org/10.1115/1.1520430

Abstract

View articletitled, Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

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Topics: Compression , Die cutting , Fatigue cracks , Fatigue life , Fracture (Materials) , Printed circuit boards , Shear (Mechanics) , Shearing (Deformation) , Solders , Stress

Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

Timothy Ferguson, Mem. ASME, Jianmin Qu, Fellow ASME

J. Electron. Packag. March 2003, 125(1): 24–30. doi: https://doi.org/10.1115/1.1524132

Abstract

View articletitled, Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

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Topics: Absorption , Diffusion (Physics) , Fracture (Materials) , Fracture (Process) , Resins , Fracture toughness

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Toru Ikeda, Isao Arase, Yuya Ueno, Noriyuki Miyazaki, Nobutaka Ito, Mami Nagatake, Mitsuru Sato

J. Electron. Packag. March 2003, 125(1): 31–38. doi: https://doi.org/10.1115/1.1525244

Abstract

View articletitled, Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

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Topics: Absorption , Corners (Structural elements) , Fracture (Materials) , Molding resins , Reflow soldering , Stress , Vapor pressure , Diffusion (Physics) , Finite element methods

Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

Sheng Liu, I. Charles Ume, Mem. ASME

J. Electron. Packag. March 2003, 125(1): 39–43. doi: https://doi.org/10.1115/1.1525820

Abstract

View articletitled, Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

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Topics: Errors , Flip-chip devices , Inspection , Signal processing , Signals , Solder joints , Flip-chip , Data acquisition , Vibration

Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies

Ji Eun Park, Iwona Jasiuk, Mem. ASME,, Alek Zubelewicz

J. Electron. Packag. March 2003, 125(1): 44–52. doi: https://doi.org/10.1115/1.1527656

Abstract

View articletitled, Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies

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Topics: Fracture (Materials) , Fracture (Process) , Particulate matter , Stress , Strips , Flip-chip assemblies

Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending

Yibin Xue, Vivek A. Jairazbhoy, Xiaoting Niu, Jianmin Qu, Fellow ASME

J. Electron. Packag. March 2003, 125(1): 53–58. doi: https://doi.org/10.1115/1.1527892

Abstract

View articletitled, Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending

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Topics: Boundary-value problems , Deflection , Deformation , Finite element analysis , Plates (structures)

Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

Haruo Nose, Lecturer,, Masao Sakane, Professor,, Yutaka Tsukada, Researcher, Hideo Nishimura, Researcher

J. Electron. Packag. March 2003, 125(1): 59–66. doi: https://doi.org/10.1115/1.1533058

Abstract

View articletitled, Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

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Topics: Solders , Temperature , Tensile strength , Tin , Yield stress , Young's modulus , Creep , Stress

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling

Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. D. Davies

J. Electron. Packag. March 2003, 125(1): 67–75. doi: https://doi.org/10.1115/1.1533059

Abstract

View articletitled, An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling

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Topics: Computational fluid dynamics , Computer simulation , Flow (Dynamics) , Forced convection , Heat transfer , Junctions , Modeling , Temperature , Electronic components , Printed circuit boards

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Peter J. Rodgers, Vale´rie C. Eveloy, Mark R. Davies

J. Electron. Packag. March 2003, 125(1): 76–83. doi: https://doi.org/10.1115/1.1533060

Abstract

View articletitled, An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

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Topics: Computer software , Flow (Dynamics) , Forced convection , Heat transfer , Junctions , Modeling , Temperature , Thermal conductivity , Errors , Computational fluid dynamics

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Xia Cai, Liu Chen, Qun Zhang, Bulu Xu, Weidong Huang, Xiaoming Xie, Zhaonian Cheng

J. Electron. Packag. March 2003, 125(1): 84–92. doi: https://doi.org/10.1115/1.1533802

Abstract

View articletitled, Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

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Topics: Finite element analysis , Flip-chip assemblies , Simulation , Solder joints , Solders , Stress , Deformation , Cycles , Flip-chip packages , Thermal expansion

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung

J. Electron. Packag. March 2003, 125(1): 93–97. doi: https://doi.org/10.1115/1.1534842

Abstract

View articletitled, Impact Resistance of SM Joints Formed With ICA

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Topics: Adhesives , Copper , Fracture (Materials) , Impact testing , Shear (Mechanics) , Shear strength , Solders , Silver , Resistors , Alloys

Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips

Sergey Shkarayev, Mem. ASME,, Sergey Savastiouk, Oleg Siniaguine

J. Electron. Packag. March 2003, 125(1): 98–103. doi: https://doi.org/10.1115/1.1535932

Abstract

View articletitled, Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips

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Topics: Design , Reliability , Stress , Electronic packages , Corners (Structural elements) , Event history analysis , Solders

Heat Transfer and Flow Friction Characteristics for Compact Cold Plates

Chang-Yuan Liu, Graduate Student, Ying-Huei Hung, Professor and Chairman, Mem. ASME

J. Electron. Packag. March 2003, 125(1): 104–113. doi: https://doi.org/10.1115/1.1536170

Abstract

View articletitled, Heat Transfer and Flow Friction Characteristics for Compact Cold Plates

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Topics: Flow (Dynamics) , Heat transfer , Plates (structures) , Temperature , Thermal resistance , Heat flux , Pressure drop , Friction , Heat , Reynolds number

The Strength of the Silicon Die in Flip-Chip Assemblies

B. Cotterell, Z. Chen, J.-B. Han, N.-X. Tan

J. Electron. Packag. March 2003, 125(1): 114–119. doi: https://doi.org/10.1115/1.1535934

Abstract

View articletitled, The Strength of the Silicon Die in Flip-Chip Assemblies

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Topics: Fracture (Materials) , Fracture (Process) , Probability , Reliability , Silicon , Stress , Grinding , Flip-chip assemblies

A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

Hong Tang, Cemal Basaran, Mem. ASME, Associate Professor and Director,

J. Electron. Packag. March 2003, 125(1): 120–125. doi: https://doi.org/10.1115/1.1536171

Abstract

View articletitled, A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

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Topics: Cycles , Damage , Fatigue life , Finite element analysis , Simulation , Solder joints , Solders , Constitutive equations , Fatigue , Ball-Grid-Array packaging

Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging

Suman Chakraborty, Pradip Dutta, Mem. ASME,

J. Electron. Packag. March 2003, 125(1): 126–133. doi: https://doi.org/10.1115/1.1535445

Abstract

View articletitled, Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging

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Topics: Freezing , Heat transfer , Melting , Packaging , Solidification , Temperature distribution , Phase change materials , Convection

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

Yujun Wen, PhD candidate, Cemal Basaran, Assoc. Prof. and Director

J. Electron. Packag. March 2003, 125(1): 134–138. doi: https://doi.org/10.1115/1.1535446

Abstract

View articletitled, Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

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Topics: Delamination , Electronic packaging , Finite element analysis , Finite element methods , Laminates , Stress , Stress analysis (Engineering) , Thermal stresses , Materials properties , Thermomechanics

An Efficient Solution for Wire Sweep Analysis in IC Packaging

Jerry Su, Sheng-Jye Hwang, Associate Professor, Francis Su, Shou-Kang Chen

J. Electron. Packag. March 2003, 125(1): 139–143. doi: https://doi.org/10.1115/1.1535447

Abstract

View articletitled, An Efficient Solution for Wire Sweep Analysis in IC Packaging

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Topics: Wire , Flow (Dynamics) , Integrated circuits , Integrated circuit packaging

Finite Element Analysis of Mechanical Shock Responses of RF Connectors

Z. Y. Zhu, H. P. Lee, B. T. Cheok

J. Electron. Packag. March 2003, 125(1): 144–152. doi: https://doi.org/10.1115/1.1536950

Abstract

View articletitled, Finite Element Analysis of Mechanical Shock Responses of RF Connectors

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Topics: Finite element analysis , Shock (Mechanics)

Technical Briefs

The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints

Y. C. Chan, S. H. Fan, J. K. L. Lai

J. Electron. Packag. March 2003, 125(1): 153–156. doi: https://doi.org/10.1115/1.1537070

Abstract

View articletitled, The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints

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Topics: Cooling , Crystallization , Diffusion (Physics) , Intermetallic compounds , Solder joints , Solders , Tin , Temperature , Solidification , Ball-Grid-Array packaging

Open Defects in PBGA Assembly Solder Joints

S. H. Fan, Y. C. Chan, J. K. L. Lai

J. Electron. Packag. March 2003, 125(1): 157–161. doi: https://doi.org/10.1115/1.1536951

Abstract

View articletitled, Open Defects in PBGA Assembly Solder Joints

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Topics: Manufacturing , Solder joints , Solders , Soldering , Inspection , Thermal stability , Wetting , Printing

Thermoelectric Behavior of Solder

Taejin Kim and, D. D. L. Chung

J. Electron. Packag. March 2003, 125(1): 161–162. doi: https://doi.org/10.1115/1.1536952

Abstract

View articletitled, Thermoelectric Behavior of Solder

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Topics: Solders

Technical Papers

Statistical Aspects of Lifetime in the Presence of UV Radiation

Intrinsic Strain Modeling and Residual Stress Analysis for Thin-Film Processing of Layered Structures

Extending the Fatigue Life of Solder Grid Array (SGA) Electronic Packages

Moisture Absorption Analysis of Interfacial Fracture Test Specimens Composed of No-Flow Underfill Materials

Strength Evaluation of Plastic Packages During Solder Reflow Process Using Stress Intensity Factors of V-Notch

Digital Signal Processing in a Novel Flip Chip Solder Joint Defects Inspection System

Stresses and Fracture at the Chip/Underfill Interface in Flip-Chip Assemblies

Large Deflection of Thin Plates Under Certain Mixed Boundary Conditions—Cylindrical Bending

Temperature and Strain Rate Effects on Tensile Strength and Inelastic Constitutive Relationship of Sn-Pb Solders

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part I: Experimental Methods and Numerical Modeling

An Experimental Assessment of Numerical Predictive Accuracy for Electronic Component Heat Transfer in Forced Convection—Part II: Results and Discussion

Quantitative Mechanism of Significant Benefits of Underfill in Flip-Chip Assemblies

Impact Resistance of SM Joints Formed With ICA

Stress and Reliability Analysis of Electronic Packages With Ultra-Thin Chips

Heat Transfer and Flow Friction Characteristics for Compact Cold Plates

The Strength of the Silicon Die in Flip-Chip Assemblies

A Damage Mechanics-Based Fatigue Life Prediction Model for Solder Joints

Analytical Solutions for Heat Transfer During Cyclic Melting and Freezing of a Phase Change Material Used in Electronic or Electrical Packaging

Thermomechanical Stress Analysis of Multi-Layered Electronic Packaging

An Efficient Solution for Wire Sweep Analysis in IC Packaging

Finite Element Analysis of Mechanical Shock Responses of RF Connectors

Technical Briefs

The Effect of Cooling Rate on the Growth of Cu-Sn Intermetallics in Annealed PBGA Solder Joints

Open Defects in PBGA Assembly Solder Joints

Thermoelectric Behavior of Solder

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