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Volume 128, Issue 2

June 2006

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ISSN 1043-7398

EISSN 1528-9044

In this Issue

Foreword
Research Papers
Research Papers

Foreword

Special Issue With Contributions From ITherm 2004

K. Ramakrishna, Bahgat G. Sammakia, J. Richard Culham, Yogendra K. Joshi

J. Electron. Packag. June 2006, 128(2): 101. doi: https://doi.org/10.1115/1.2188607

Extract

View articletitled, Special Issue With Contributions From ITherm 2004

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Topics: Electronic packaging , Packaging , Thermal management , Heat transfer

Research Papers

Thermal Phenomena in Nanoscale Transistors

Eric Pop, Kenneth E. Goodson

J. Electron. Packag. June 2006, 128(2): 102–108. doi: https://doi.org/10.1115/1.2188950

Abstract

View articletitled, Thermal Phenomena in Nanoscale Transistors

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Topics: Phonons , Silicon , Transistors , Heat , Nanoscale phenomena , Electrons , Nanowires

Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications

Yongho “Sungtaek” Ju

J. Electron. Packag. June 2006, 128(2): 109–114. doi: https://doi.org/10.1115/1.2165215

Abstract

View articletitled, Nanoscale Thermal Phenomena in Tunnel Junctions for Spintronics Applications

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Topics: Electrodes , Heat , Junctions , Thermal resistance , Tunnels , Spintronics , Electrons , Heat conduction , Tunnel construction , Phonons

Rapid Thermal Characterization of the High Thermal Conductivity Film Layers by the Film-on Substrate Technique

Sadegh M. Sadeghipour, Mehdi Asheghi

J. Electron. Packag. June 2006, 128(2): 125–129. doi: https://doi.org/10.1115/1.2165213

Abstract

View articletitled, Rapid Thermal Characterization of the High Thermal Conductivity Film Layers by the Film-on Substrate Technique

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Topics: Thermal characterization , Thermal conductivity , Temperature , Manufacturing

Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

Arun Gowda, David Esler, Sandeep Tonapi, Annita Zhong, K. Srihari, Florian Schattenmann

J. Electron. Packag. June 2006, 128(2): 130–136. doi: https://doi.org/10.1115/1.2188952

Abstract

View articletitled, Micron and Submicron-Scale Characterization of Interfaces in Thermal Interface Material Systems

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Topics: Acoustics , Adhesives , Aluminum , Computerized tomography , Contact resistance , Fillers (Materials) , Magnification , Microscopy , Scanning electron microscopy , Silicon

Viability of Dynamic Cooling Control in a Data Center Environment

Timothy D. Boucher, David M. Auslander, Cullen E. Bash, Clifford C. Federspiel, Chandrakant D. Patel

J. Electron. Packag. June 2006, 128(2): 137–144. doi: https://doi.org/10.1115/1.2165214

Abstract

View articletitled, Viability of Dynamic Cooling Control in a Data Center Environment

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Topics: Cooling , Data centers , Flow (Dynamics) , Temperature , Vents , Thermal management , Tiles , Energy consumption , Heat

Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet

Steven W. Tillery, Samuel N. Heffington, Marc K. Smith, Ari Glezer

J. Electron. Packag. June 2006, 128(2): 145–149. doi: https://doi.org/10.1115/1.2188954

Abstract

View articletitled, Boiling Heat Transfer Enhancement Using a Submerged, Vibration-Induced Jet

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Topics: Boiling , Bubbles , Heat transfer , Temperature , Vibration , Vapors , Water , Diaphragms (Mechanical devices) , Diaphragms (Structural) , Heat flux

Investigation of Flow and Heat Transfer of an Impinging Jet in a Cross-Flow For Cooling of a Heated Cube

D. Rundström, B. Moshfegh

J. Electron. Packag. June 2006, 128(2): 150–156. doi: https://doi.org/10.1115/1.2188948

Abstract

View articletitled, Investigation of Flow and Heat Transfer of an Impinging Jet in a Cross-Flow For Cooling of a Heated Cube

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Topics: Channel flow , Cooling , Cross-flow , Flow (Dynamics) , Heat transfer , Temperature , Boundary-value problems , Heat transfer coefficients , Jets

“Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink

Suzana Prstic, Avram Bar-Cohen

J. Electron. Packag. June 2006, 128(2): 172–176. doi: https://doi.org/10.1115/1.2188955

Abstract

View articletitled, “Heat Shield”—An Enhancement Device for an Unshrouded, Forced Convection Heat Sink

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Topics: Heat shielding , Heat sinks , Flow (Dynamics) , Pressure drop

Research Papers

Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices

Rodrigo Escobar, Brian Smith, Cristina Amon

J. Electron. Packag. June 2006, 128(2): 115–124. doi: https://doi.org/10.1115/1.2188951

Abstract

View articletitled, Lattice Boltzmann Modeling of Subcontinuum Energy Transport in Crystalline and Amorphous Microelectronic Devices

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Topics: Phonons , Silicon , Temperature , Thermal conductivity , Thin films , Lattice Boltzmann methods , Mean free path , Microelectronic devices , Electrical conductivity

Modeling of Natural Convection in Electronic Enclosures

Peter M. Teertstra, M. Michael Yovanovich, J. Richard Culham

J. Electron. Packag. June 2006, 128(2): 157–165. doi: https://doi.org/10.1115/1.2188953

Abstract

View articletitled, Modeling of Natural Convection in Electronic Enclosures

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Topics: Boundary layers , Computational fluid dynamics , Convection , Engineering simulation , Heat conduction , Natural convection , Shapes , Simulation , Flow (Dynamics) , Model validation