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Issues
September 2013
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Guest Editorial
Introduction for Journal of Electronic Packaging Special Section on Data Centers
J. Electron. Packag. September 2013, 135(3): 030301.
doi: https://doi.org/10.1115/1.4024993
Topics:
Data centers
,
Electronic packaging
Research Papers
Improved Computational Fluid Dynamics Model for Open-Aisle Air-Cooled Data Center Simulations
J. Electron. Packag. September 2013, 135(3): 030901.
doi: https://doi.org/10.1115/1.4024766
Topics:
Computational fluid dynamics
,
Data centers
,
Flow (Dynamics)
,
Temperature
,
Tiles
,
Simulation
Rack Level Modeling of Air Flow Through Perforated Tile in a Data Center
J. Electron. Packag. September 2013, 135(3): 030902.
doi: https://doi.org/10.1115/1.4024994
Topics:
Air flow
,
Flow (Dynamics)
,
Tiles
,
Data centers
Computational and Experimental Validation of a Vortex-Superposition-Based Buoyancy Approximation for the COMPACT Code in Data Centers
J. Electron. Packag. September 2013, 135(3): 030903.
doi: https://doi.org/10.1115/1.4024302
Topics:
Buoyancy
,
Computational fluid dynamics
,
Data centers
,
Flow (Dynamics)
,
Temperature
,
Vortices
,
Server racks
,
Approximation
Inviscid and Viscous Numerical Models Compared to Experimental Data in a Small Data Center Test Cell
J. Electron. Packag. September 2013, 135(3): 030904.
doi: https://doi.org/10.1115/1.4024944
Topics:
Computer simulation
,
Data centers
,
Flow (Dynamics)
,
Temperature
,
Tiles
,
Turbulence
,
Computational fluid dynamics
,
Uncertainty
A Comparison of Parametric and Multivariable Optimization Techniques in a Raised-Floor Data Center
J. Electron. Packag. September 2013, 135(3): 030905.
doi: https://doi.org/10.1115/1.4023214
Topics:
Ceilings
,
Data centers
,
Optimization
,
Temperature
,
Tiles
,
Flow (Dynamics)
,
Turning vanes
Thermally Aware, Energy-Based Load Placement in Open-Aisle, Air-Cooled Data Centers
J. Electron. Packag. September 2013, 135(3): 030906.
doi: https://doi.org/10.1115/1.4024946
Topics:
Data centers
,
Stress
,
Temperature
,
Cooling
,
Optimization
,
Air flow
Expanded Assessment of a Practical Thermally Aware Energy-Optimized Load Placement Strategy for Open-Aisle, Air-Cooled Data Centers
J. Electron. Packag. September 2013, 135(3): 030907.
doi: https://doi.org/10.1115/1.4024945
Topics:
Data centers
,
Stress
,
Temperature
,
Air flow
,
Cooling
Two-Phase Flow Control of Electronics Cooling With Pseudo-CPUs in Parallel Flow Circuits: Dynamic Modeling and Experimental Evaluation
J. Electron. Packag. September 2013, 135(3): 030908.
doi: https://doi.org/10.1115/1.4024590
Topics:
Cooling
,
Flow (Dynamics)
,
Heat
,
Simulation
,
Transients (Dynamics)
,
Vapors
,
Two-phase flow
,
Temperature
,
Pipes
,
Steady state
High-Efficiency Transient Temperature Calculations for Applications in Dynamic Thermal Management of Electronic Devices
J. Electron. Packag. September 2013, 135(3): 031001.
doi: https://doi.org/10.1115/1.4024747
Topics:
Filters
,
Modeling
,
Temperature
,
Thermal management
,
Transfer functions
,
Transients (Dynamics)
,
Geometry
,
Filtration
Advanced Methodologies for Developing Improved Potted Smart Munitions for High-G Applications
J. Electron. Packag. September 2013, 135(3): 031002.
doi: https://doi.org/10.1115/1.4024301
Topics:
Polymers
,
Density
,
Munitions
,
Temperature
An Improved Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface Materials
J. Electron. Packag. September 2013, 135(3): 031003.
doi: https://doi.org/10.1115/1.4024392
Investigation of Dual Electrical Paths for Off-Chip Compliant Interconnects
J. Electron. Packag. September 2013, 135(3): 031004.
doi: https://doi.org/10.1115/1.4024112
Topics:
Manufacturing
,
Reliability
,
Stress
,
Thermomechanics
,
Displacement
,
Semiconductor wafers
,
Copper
,
Simulation
,
Solders
Thermal Performance of an Al2O3–Water Nanofluid Pulsating Heat Pipe
J. Electron. Packag. September 2013, 135(3): 031005.
doi: https://doi.org/10.1115/1.4024145
Topics:
Displacement
,
Fluids
,
Heat pipes
,
Heat transfer
,
Latent heat
,
Nanofluids
,
Nanoparticles
,
Particulate matter
,
Pressure
,
Slug flows
3D Compact Model of Packaged Thermoelectric Coolers
J. Electron. Packag. September 2013, 135(3): 031006.
doi: https://doi.org/10.1115/1.4024653
Topics:
Thermoelectric coolers
,
Cooling
,
Electronic packages
,
Steady state
,
Flat heat pipes
Geometric Optimization of C-Shaped Cavities According to Bejan's Theory: General Review and Comparative Study
J. Electron. Packag. September 2013, 135(3): 031007.
doi: https://doi.org/10.1115/1.4024113
Topics:
Cavities
,
Optimization
,
Shapes
,
Thermal resistance
Technical Briefs
Heat Conduction in Mobile Electronic Equipment: Study on the Effects of Some Key Parameters on Heat Source Temperature Based on a Three-Layer Model
J. Electron. Packag. September 2013, 135(3): 034501.
doi: https://doi.org/10.1115/1.4024367
Topics:
Heat
,
Heat conduction
,
Temperature
,
Thermal conductivity
,
Electronic equipment
Email alerts
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