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Issues
June 2021
ISSN 1043-7398
EISSN 1528-9044
Guest Editorial
Special Section on Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging
J. Electron. Packag. June 2021, 143(2): 020301.
doi: https://doi.org/10.1115/1.4050407
Topics:
Electronic packaging
,
Microscale devices
,
Nanoscale phenomena
,
Storage
Review Articles
Review of Methodologies for Structural Integrity Evaluation of Power Modules
J. Electron. Packag. June 2021, 143(2): 020801.
doi: https://doi.org/10.1115/1.4048038
Topics:
Cracking (Materials)
,
Creep
,
Cycles
,
Density
,
Failure
,
Fatigue
,
Fracture (Materials)
,
Fracture (Process)
,
Temperature
,
Wire
A Review on United States Patents to Prevent Mechanical Failures in Foldable Smartphones
J. Electron. Packag. June 2021, 143(2): 020802.
doi: https://doi.org/10.1115/1.4048011
Topics:
Buckling
,
Deformation
,
Delamination
,
Failure
,
Fracture (Materials)
,
Fracture (Process)
,
Patents
,
Stress
,
Coatings
State of the Art of Lead-Free Solder Joint Reliability
J. Electron. Packag. June 2021, 143(2): 020803.
doi: https://doi.org/10.1115/1.4048037
Topics:
Alloys
,
Creep
,
Failure
,
Reliability
,
Solder joints
,
Solders
,
Temperature
,
Viscoplasticity
,
Lead-free solders
,
Stress
Special Section: Nanoscale/Microscale Energy Transport, Conversion and Storage in Electronics Packaging
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging
Ronald J. Warzoha, Adam A. Wilson, Brian F. Donovan, Nazli Donmezer, Ashutosh Giri, Patrick E. Hopkins, Sukwon Choi, Darshan Pahinkar, Jingjing Shi, Samuel Graham, Zhiting Tian, Laura Ruppalt
J. Electron. Packag. June 2021, 143(2): 020804.
doi: https://doi.org/10.1115/1.4049293
Topics:
Electronics
,
Gallium nitride
,
Heat
,
Nanoscale phenomena
,
Phonons
,
Temperature
,
Thermal conductivity
,
Electromagnetic scattering
,
Energy gap
,
Diamonds
Detection of Unusual Thermal Activities in a Semiconductor Chip Using Backside Infrared Thermal Imaging
J. Electron. Packag. June 2021, 143(2): 020901.
doi: https://doi.org/10.1115/1.4049291
Topics:
Algorithms
,
Circuits
,
Hardware
,
Heating
,
Image processing
,
Imaging
,
Resistors
,
Semiconductors (Materials)
,
Temperature
,
Integrated circuits
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging
J. Electron. Packag. June 2021, 143(2): 020902.
doi: https://doi.org/10.1115/1.4049292
Modular Heat Sinks for Enhanced Thermal Management of Electronics
Muhammad Jahidul Hoque, Alperen Günay, Andrew Stillwell, Yashraj Gurumukhi, Robert C. N. Pilawa-Podgurski, Nenad Miljkovic
J. Electron. Packag. June 2021, 143(2): 020903.
doi: https://doi.org/10.1115/1.4049294
Topics:
Electronics
,
Gallium nitride
,
Heat sinks
,
Thermal management
,
Power density
,
Design
,
Temperature
,
Power converters
,
Manufacturing
Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid
Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia
J. Electron. Packag. June 2021, 143(2): 020904.
doi: https://doi.org/10.1115/1.4049928
Topics:
Boiling
,
Coolants
,
Cooling
,
Data centers
,
Density
,
Flow (Dynamics)
,
Fluids
,
Heat flux
,
Heat transfer coefficients
,
Plates (structures)
Research Papers
Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers
J. Electron. Packag. June 2021, 143(2): 021001.
doi: https://doi.org/10.1115/1.4047843
Topics:
Heat
,
Heat recovery
,
Organic Rankine cycle
,
Temperature
,
Data centers
,
Pumps
Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique
J. Electron. Packag. June 2021, 143(2): 021002.
doi: https://doi.org/10.1115/1.4048034
Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multistress Operating Conditions
J. Electron. Packag. June 2021, 143(2): 021003.
doi: https://doi.org/10.1115/1.4048035
Topics:
Damage
,
Failure
,
Reliability
,
Stress
,
Electronics
Numerical Modeling and Simulation of a Volumetric Resistance Blower Using Porous Rotor
J. Electron. Packag. June 2021, 143(2): 021004.
doi: https://doi.org/10.1115/1.4048036
Topics:
Computer simulation
,
Flow (Dynamics)
,
Pressure
,
Rotors
,
Porous materials
,
Simulation
,
Modeling
Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys
J. Electron. Packag. June 2021, 143(2): 021005.
doi: https://doi.org/10.1115/1.4048181
Topics:
Alloys
,
Solders
,
Temperature
,
Stress
,
Solder joints
,
Operating temperature
Aging and Fatigue of Aerosol Jet-Printed Nano-Ag Traces on Flexible Substrate
Arun Raj, Rajesh Sharma Sivasubramony, Manu Yadav, Sanoop Thekkut, Gurvinder Singh Khinda, Mohammed Alhendi, Mark D. Poliks, Peter Borgesen
J. Electron. Packag. June 2021, 143(2): 021006.
doi: https://doi.org/10.1115/1.4048591
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks
Yaser Hadad, Vahideh Radmard, Srikanth Rangarajan, Mahdi Farahikia, Gamal Refai-Ahmed, Paul R. Chiarot, Bahgat Sammakia
J. Electron. Packag. June 2021, 143(2): 021007.
doi: https://doi.org/10.1115/1.4048590
Topics:
Design
,
Electrical resistivity
,
Flow (Dynamics)
,
Pumps
,
Temperature
,
Optimization
,
Microchannels
,
Coolants
,
Pareto optimization
,
Heat flux
