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Issues
June 2023
ISSN 1043-7398
EISSN 1528-9044
In this Issue
Editorial
Reviewer's Recognition
J. Electron. Packag. June 2023, 145(2): 020201.
doi: https://doi.org/10.1115/1.4056725
Review Article
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
J. Electron. Packag. June 2023, 145(2): 020801.
doi: https://doi.org/10.1115/1.4055774
Topics:
Failure
,
Fatigue
,
Reliability
,
Stress
,
Temperature
,
Fatigue life
,
Electronics
,
Failure mechanisms
,
Corrosion
,
Modeling
Research Papers
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
J. Electron. Packag. June 2023, 145(2): 021001.
doi: https://doi.org/10.1115/1.4054972
Topics:
Computers
,
Cooling
,
Copper
,
Corrosion
,
Nickel plating
,
Plates (structures)
,
Pressure drop
,
Temperature
,
Thermal resistance
,
Flow (Dynamics)
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions
J. Electron. Packag. June 2023, 145(2): 021002.
doi: https://doi.org/10.1115/1.4055024
Topics:
Electrodiffusion
,
Failure
,
Solder joints
,
Solders
,
Stress
,
Temperature
,
Tension
,
Testing
,
Current density
,
Tin
An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging
J. Electron. Packag. June 2023, 145(2): 021003.
doi: https://doi.org/10.1115/1.4055125
Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
J. Electron. Packag. June 2023, 145(2): 021004.
doi: https://doi.org/10.1115/1.4055094
Topics:
Climate
,
Design
,
Solar energy
,
Temperature
,
Thermal management
,
Transients (Dynamics)
,
Solar radiation
,
Smart cities
,
Computer simulation
,
Cycles
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
J. Electron. Packag. June 2023, 145(2): 021005.
doi: https://doi.org/10.1115/1.4055591
Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density
J. Electron. Packag. June 2023, 145(2): 021006.
doi: https://doi.org/10.1115/1.4055469
Topics:
Current density
,
Silver
,
Wire
,
Temperature gradient
,
Electrodiffusion
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis
Xin Wei, Mohamed El Amine Belhadi, Sa'd Hamasha, Ali Alahmer, Rong Zhao, Bart Prorok, A. R. Nazmus Sakib
J. Electron. Packag. June 2023, 145(2): 021007.
doi: https://doi.org/10.1115/1.4055318
Topics:
Alloys
,
Fatigue
,
Shear (Mechanics)
,
Shear strength
,
Solders
,
Tin
,
Stress
,
Solder joints
,
Fatigue testing
,
Fatigue life
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers
Tiwei Wei, Sougata Hazra, Yujui Lin, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Kenneth E. Goodson
J. Electron. Packag. June 2023, 145(2): 021008.
doi: https://doi.org/10.1115/1.4055468
Topics:
Flow (Dynamics)
,
Manifolds
,
Microchannels
,
Silicon
,
Pressure
,
Temperature
,
Intake manifolds
,
Pressure drop
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
J. Electron. Packag. June 2023, 145(2): 021009.
doi: https://doi.org/10.1115/1.4055987
Topics:
Heat
,
Transients (Dynamics)
,
Temperature
,
Anisotropy
Effective Constitutive Relations for Sintered Nano Copper Joints
Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
J. Electron. Packag. June 2023, 145(2): 021010.
doi: https://doi.org/10.1115/1.4056113
Topics:
Constitutive equations
,
Copper
,
Creep
,
Deformation
,
Diffusion (Physics)
,
Oxidation
,
Stress
,
Temperature
,
Transients (Dynamics)
,
Sintering
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
J. Electron. Packag. June 2023, 145(2): 021011.
doi: https://doi.org/10.1115/1.4055986
Topics:
Copper
,
Sintering
,
Surface mount devices
,
Electrical resistivity
,
Printing
,
Drops
,
Electronics
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Anand Model Constants of Sn-Ag-Cu Solders: What Do They Actually Mean?
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Special Issue on InterPACK2023
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