Search Results | J. Electron. Packag. | ASME Digital Collection

1-20 of 27

Sort by

Sort Order Select

Journal Articles

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nathaniel J. O'Connor, Alexander J. Castaneda, Pavolas N. Christidis, Nicolas Vayas Tobar, Michal Talmor, Jamal Yagoobi

J. Electron. Packag. December 2020, 142(4): 041105.

Paper No: EP-20-1021

DOI: https://doi.org/10.1115/1.4047459

Published Online: June 23, 2020

View Article

Topics: Computer cooling, Electrohydrodynamics, Flow (Dynamics), Fluids, Heat conduction, Pumps, Electrodes, Design, Electric fields

Journal Articles

Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling

Sandesh S. Chougule, S. K. Sahu

J. Electron. Packag. June 2015, 137(2): 021004.

Paper No: EP-14-1024

DOI: https://doi.org/10.1115/1.4028994

Published Online: June 1, 2015

View Article

Topics: Computer cooling, Cooling, Heat pipes, Nanofluids, Phase change materials, Water, Temperature, Paraffin wax, Heating, Test facilities

Journal Articles

Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

Satish G. Kandlikar

J. Electron. Packag. June 2014, 136(2): 024001.

Paper No: EP-13-1081

DOI: https://doi.org/10.1115/1.4027175

Published Online: April 29, 2014

View Article

Topics: Cooling, Cooling systems, Design, Flow (Dynamics), Heat, Microchannels, Pressure drop, Computer cooling, Temperature, Coolants

Journal Articles

Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes

Kambiz Jahani, Maziar Mohammadi, Mohammad Behshad Shafii, Zahra Shiee

J. Electron. Packag. June 2013, 135(2): 021005.

Paper No: EP-12-1070

DOI: https://doi.org/10.1115/1.4023847

Published Online: March 28, 2013

View Article

Topics: Computer cooling, Ferrofluids, Fluids, Heat pipes, Heating, Magnetic fields, Nanofluids, Thermal resistance, Water, Heat transfer

Journal Articles

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

A. F. M. Arif, Syed M. Zubair, S. Pashah

J. Electron. Packag. December 2012, 134(4): 041005.

DOI: https://doi.org/10.1115/1.4007258

Published Online: October 30, 2012

View Article

Topics: Composite materials, Computer cooling, Flow (Dynamics), Geometry, Heat, Heat sinks, Stress, Temperature, Thermal analysis, Epoxy adhesives

Journal Articles

Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling

Ercan M. Dede

J. Electron. Packag. December 2012, 134(4): 041001.

DOI: https://doi.org/10.1115/1.4007159

Published Online: August 29, 2012

View Article

Topics: Cooling, Design, Fluids, Optimization, Microchannels, Topology, Heat sinks, Temperature, Computer cooling, Heat transfer

Journal Articles

Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal

Peipei Li, Jing Liu

J. Electron. Packag. December 2011, 133(4): 041009.

DOI: https://doi.org/10.1115/1.4005297

Published Online: December 9, 2011

View Article

Topics: Convection, Cooling, Heat, Liquid metals, Temperature, Thermal resistance, Water, Stress, Coolants, Computer cooling

Journal Articles

Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

David Newport, Colin Forno, Maurice Whelan

J. Electron. Packag. September 2010, 132(3): 031001.

DOI: https://doi.org/10.1115/1.4002161

Published Online: September 8, 2010

View Article

Topics: Cylinders, Interferometers, Interferometry, Temperature, Flow (Dynamics), Cooling, Thermal conductivity, Natural convection, Computer cooling

Journal Articles

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

K. Lafdi, O. Mesalhy, A. Elgafy

J. Electron. Packag. June 2008, 130(2): 021004.

DOI: https://doi.org/10.1115/1.2912185

Published Online: April 25, 2008

View Article

Topics: Cooling, Design, Fins, Heat, Heat sinks, Phase change materials, Porosity, Shapes, Temperature, Thermal conductivity

Journal Articles

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

Yung-Shin Tseng, Tzu-Chen Hung, Bau-Shei Pei

J. Electron. Packag. March 2008, 130(1): 011006.

DOI: https://doi.org/10.1115/1.2837524

Published Online: January 31, 2008

View Article

Topics: Computational fluid dynamics, Cooling, Heat transfer, Natural convection, Temperature, Flow (Dynamics), Thermal resistance, Computer cooling, Simulation

Journal Articles

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Kun-Nan Chen

J. Electron. Packag. December 2006, 128(4): 449–455.

DOI: https://doi.org/10.1115/1.2353281

Published Online: February 15, 2006

View Article

Topics: Computer cooling, Cooling, Design, Finite element analysis, Finite element model, Optimization, Printed circuit boards, Screws, Testing, Materials properties

Journal Articles

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

A. Bhattacharya, R. L. Mahajan

J. Electron. Packag. September 2006, 128(3): 259–266.

DOI: https://doi.org/10.1115/1.2229225

Published Online: September 23, 2005

View Article

Topics: Aluminum, Buoyancy, Computer cooling, Convection, Heat sinks, Metal foams, Porous materials

Journal Articles

Meso Scale Pulsating Jets for Electronics Cooling

Jivtesh Garg, Mehmet Arik, Stanton Weaver, Todd Wetzel, Seyed Saddoughi

J. Electron. Packag. December 2005, 127(4): 503–511.

DOI: https://doi.org/10.1115/1.2065727

Published Online: April 20, 2005

View Article

Topics: Heat, Heat flux, Heat transfer, Heat transfer coefficients, Jets, Natural convection, Temperature, Temperature measurement, Thermal management, Cooling

Journal Articles

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Jeffrey Rambo, Yogendra Joshi

J. Electron. Packag. December 2005, 127(4): 452–459.

DOI: https://doi.org/10.1115/1.2056575

Published Online: February 11, 2005

View Article

Topics: Air flow, Blades, Computational fluid dynamics, Cooling, Energy dissipation, Entropy, Flow (Dynamics), Temperature, Thermal management, Heat

Journal Articles

Foreword

Bahgat Sammakia, Dereje Agonafer

J. Electron. Packag. December 2004, 126(4): 409.

DOI: https://doi.org/10.1115/1.1827273

Published Online: January 24, 2005

View Article

Topics: Heat sinks, Packaging, Thermal engineering, Thermal management, Cooling, Computer cooling, Computers, Inventions, Design, Heat transfer

Journal Articles

h adiabatic and u max ′

Robert J. Moffat

J. Electron. Packag. December 2004, 126(4): 501–509.

DOI: https://doi.org/10.1115/1.1827265

Published Online: January 24, 2005

View Article

Topics: Computational fluid dynamics, Flow (Dynamics), Heat transfer, Temperature, Turbulence, Heat transfer coefficients, Heat conduction, Heating, Coolants, Computer cooling

Journal Articles

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Prabhu Sathyamurthy, Manoj Nagulapally, Rajesh Nair

J. Electron. Packag. December 2004, 126(4): 472–476.

DOI: https://doi.org/10.1115/1.1827263

Published Online: January 24, 2005

View Article

Topics: Capacitance, Computer cooling, Heat, Junctions, Linear systems, Simulation, Steady state, Temperature, Topology, Transients (Dynamics)

Journal Articles

Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems

D. Agonafer, A. Vimba

J. Electron. Packag. June 1997, 119(2): 138–143.

DOI: https://doi.org/10.1115/1.2792220

Published Online: June 1, 1997

View Article

Topics: Computational fluid dynamics, Computer cooling, Solid models, Computer-aided design, Boundary-value problems, Fluids, Geometry, Materials properties, Mesh generation, Turbulence

Journal Articles

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

S. M. You, T. W. Simon, A. Bar-Cohen

J. Electron. Packag. March 1997, 119(1): 17–25.

DOI: https://doi.org/10.1115/1.2792195

Published Online: March 1, 1997

View Article

Topics: Heat transfer, Pool boiling, Boiling, Bubbles, Fluids, Heat, Heating, Aluminum, Computer cooling, Platinum

Journal Articles

Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

S. Sathe, K. M. Kelkar, K. C. Karki, C. Tai, C. Lamb, S. V. Patankar

J. Electron. Packag. March 1997, 119(1): 58–63.

DOI: https://doi.org/10.1115/1.2792201

Published Online: March 1, 1997

View Article

Topics: Flow (Dynamics), Heat sinks, Heat transfer, Ceramics, Fins, Nozzles, Cooling, Heat, Temperature, Air flow

Journal citation

NARROW

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Thermal Performance of Nanofluid Charged Heat Pipe With Phase Change Material for Electronics Cooling

Review and Projections of Integrated Cooling Systems for Three-Dimensional Integrated Circuits

Promising Technology for Electronic Cooling: Nanofluidic Micro Pulsating Heat Pipes

Thermal-Structural Performance of Orthotropic Pin Fin in Electronics Cooling Applications

Optimization and Design of a Multipass Branching Microchannel Heat Sink for Electronics Cooling

Self-Driven Electronic Cooling Based on Thermosyphon Effect of Room Temperature Liquid Metal

Digital Moiré Subtraction Interferometry (DMS) for Electronics Cooling Applications in Enclosures

Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

Enhancement of Cooling Characteristics for Electronic Cooling by Modifying Substrate Under Natural Convection

Optimal Support Locations for a Printed Circuit Board Loaded With Heavy Components

Metal Foam and Finned Metal Foam Heat Sinks for Electronics Cooling in Buoyancy-Induced Convection

Meso Scale Pulsating Jets for Electronics Cooling

Thermal Performance Metrics for Arranging Forced Air Cooled Servers in a Data Processing Cabinet

Foreword

h adiabatic and u max ′

Development of Compact Models for Electronics Cooling: Using the Multigrid Operator to Generate Reduced-Order Description of Devices

Solid Model Based Preprocessor to CFD Code for Applications to Electronic Cooling Systems

Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only