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Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
https://doi.org/10.1115/1.4054972
Published Online: August 8, 2022
View Article titled, Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Article titled, Special Issue on InterPACK2020
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

Wataru Nakayama
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2017, 139(1): 010801.
Paper No: EP-16-1092
https://doi.org/10.1115/1.4035019
Published Online: November 23, 2016
View Article titled, Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management
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Topics: Circuits, Computers, Printed circuit boards, Hardware
Journal Articles

Surface and Indoor Temperature Effects on User Thermal Responses to Holding a Simulated Tablet Computer

Han Zhang, Alan Hedge, Beiyuan Guo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2016, 138(3): 031003.
Paper No: EP-16-1003
https://doi.org/10.1115/1.4033415
Published Online: May 16, 2016
View Article titled, Surface and Indoor Temperature Effects on User Thermal Responses to Holding a Simulated Tablet Computer
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Topics: Temperature, Computers
Journal Articles

Letter From the Editors

Bahgat G. Sammakia, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. September 2014, 136(3): 030201.
Paper No: EP-14-1067
https://doi.org/10.1115/1.4028063
Published Online: July 24, 2014
View Article titled, Letter From the Editors
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Topics: Actuators, Biomedicine, Computers, Data centers, Design, Electronic packaging, Electronics, Energy / power systems, Engineering teachers, Feedback
Journal Articles

Computational Monolayer for Tertiary Nanoparticles Using Supercomputer

Kyungdeok Jang, Nubia Zuverza, Tae Eui Jeong, Sung Suk Kim, Nam Soo Kim
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2013, 135(1): 011003.
Paper No: EP-12-1004
https://doi.org/10.1115/1.4023527
Published Online: March 26, 2013
View Article titled, Computational Monolayer for Tertiary Nanoparticles Using Supercomputer
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Topics: Packing (Shipments), Packings (Cushioning), Particulate matter, Simulation, Computers, Nanoparticles
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
View Article titled, Editorial
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

The Exergy Cost of Information Processing: A Comparison of Computer-Based Technologies and Biological Systems

V. P. Carey, A. J. Shah
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 346–352.
https://doi.org/10.1115/1.2351899
Published Online: December 6, 2005
View Article titled, The Exergy Cost of Information Processing: A Comparison of Computer-Based Technologies and Biological Systems
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Topics: Brain, Computers, Exergy, Energy efficiency
Journal Articles

Foreword

Bahgat Sammakia, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Foreword
J. Electron. Packag. December 2004, 126(4): 409.
https://doi.org/10.1115/1.1827273
Published Online: January 24, 2005
View Article titled, Foreword
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Topics: Heat sinks, Packaging, Thermal engineering, Thermal management, Cooling, Computer cooling, Computers, Inventions, Design, Heat transfer
Journal Articles

Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System

Yasin Makwana, Dereje Agonafer, Fellow ASME, Dan Manole
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 554–559.
https://doi.org/10.1115/1.1827272
Published Online: January 24, 2005
View Article titled, Impact of TXV and Compressor in the Stability of a High-End Computer Refrigeration System
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Topics: Compressors, Refrigeration, Temperature, Stress, Computers, Stability, Vapors, Valves
Journal Articles

Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures

Roger Schmidt, Ethan Cruz
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 510–518.
https://doi.org/10.1115/1.1827266
Published Online: January 24, 2005
View Article titled, Cluster of High-Powered Racks Within a Raised-Floor Computer Data Center: Effect of Perforated Tile Flow Distribution on Rack Inlet Air Temperatures
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Topics: Data centers, Flow (Dynamics), Temperature, Tiles, Computers
Journal Articles

Industrial Electonics: Devices and Systems, Second Edition

Dale R. Patrick, Stephen W. Fardo, Anthony J. Rafanelli
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2001, 123(3): 319.
https://doi.org/10.1115/1.1387243
Published Online: September 1, 2001
View Article titled, Industrial Electonics: Devices and Systems, Second Edition
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Topics: Engineers, Transistors, Computers, Junctions, Electronics, Electronics engineers, Energy resources, Gates (Closures), Generators, Mechanical engineering
Journal Articles

Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling

J. Y. Chang, C. W. Yu, R. L. Webb
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 225–231.
https://doi.org/10.1115/1.1348012
Published Online: October 11, 2000
View Article titled, Identification of Minimum Air Flow Design for a Desktop Computer Using CFD Modeling
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Topics: Air flow, Computational fluid dynamics, Computers, Design, Heat sinks, Temperature, Ducts, Vents, Modeling, Computer simulation
Journal Articles

Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens

W. Ren, Z. Qian, M. Lu, S. Liu, D. Shangguan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1999, 121(4): 271–274.
https://doi.org/10.1115/1.2793851
Published Online: December 1, 1999
View Article titled, Investigation of a New Lead Free Solder Alloy Using Thin Strip Specimens
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Topics: Alloys, Lead-free solders, Strips, Fatigue, Computers, Creep, Electronic packaging, Solders, Testing, Thermomechanics
Journal Articles

Thermal Management Strategies for Embedded Electronic Components of Wearable Computers

Eric Egan, Cristina H. Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2000, 122(2): 98–106.
https://doi.org/10.1115/1.483140
Published Online: September 15, 1999
View Article titled, Thermal Management Strategies for Embedded Electronic Components of Wearable Computers
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Topics: Computer simulation, Computers, Design, Electronics, Flat heat pipes, Heat, Polymer composites, Temperature, Thermal conductivity, Thermal management
Journal Articles

J-Lead Solder Joint Thermal Fatigue Life Model

T. E. Wong, L. A. Kachatorian, H. M. Cohen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1999, 121(3): 186–190.
https://doi.org/10.1115/1.2792682
Published Online: September 1, 1999
View Article titled, J-Lead Solder Joint Thermal Fatigue Life Model
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Topics: Fatigue life, Solder joints, Cycles, Finite element analysis, NASA, Damage, Failure, Fracture (Materials), Probability, Computers
Journal Articles

OMPAC Package C5 Reliability—Parametric Study

B. Nagaraj
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 18–22.
https://doi.org/10.1115/1.2792655
Published Online: March 1, 1999
View Article titled, OMPAC Package C5 Reliability—Parametric Study
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Topics: Reliability, Cycles, Design, Solders, Failure, Temperature, Ball-Grid-Array packaging, Simulation, Computers, Creep
Journal Articles

Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)

S. A. Taylor, K. Chen, R. Mahajan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 85–88.
https://doi.org/10.1115/1.2792224
Published Online: June 1, 1997
View Article titled, Moisture Migration and Cracking in Plastic Quad Flat Packages (PQFPs)
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Topics: Acoustics, Computers, Cracking (Materials), Equilibrium (Physics), Fracture (Process), Heat, Heating, High temperature, Lumber, Microscopy
Journal Articles

Optimal Three-Dimensional Placement of Heat Generating Electronic Components

M. I. Campbell, C. H. Amon, J. Cagan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1997, 119(2): 106–113.
https://doi.org/10.1115/1.2792210
Published Online: June 1, 1997
View Article titled, Optimal Three-Dimensional Placement of Heat Generating Electronic Components
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Topics: Electronic components, Heat, Algorithms, Simulated annealing, Computers, Heat transfer, Temperature
Journal Articles

Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink

S. Sathe, K. M. Kelkar, K. C. Karki, C. Tai, C. Lamb, S. V. Patankar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1997, 119(1): 58–63.
https://doi.org/10.1115/1.2792201
Published Online: March 1, 1997
View Article titled, Numerical Prediction of Flow and Heat Transfer in an Impingement Heat Sink
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Topics: Flow (Dynamics), Heat sinks, Heat transfer, Ceramics, Fins, Nozzles, Cooling, Heat, Temperature, Air flow