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Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman

J. Electron. Packag. September 2023, 145(3): 031004.

Paper No: EP-22-1072

DOI: https://doi.org/10.1115/1.4056530

Published Online: January 11, 2023

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Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging

Journal Articles

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. December 2022, 144(4): 041012.

Paper No: EP-21-1136

DOI: https://doi.org/10.1115/1.4053365

Published Online: January 28, 2022

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Topics: Damage, Density, Electric current, Inks, Nanoparticles, Reliability, Lasers, Diffusion (Physics), Atoms, Grain boundaries

Journal Articles

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Abhishek Deshpande, Qian Jiang, Abhijit Dasgupta, Ulrich Becker

J. Electron. Packag. September 2022, 144(3): 031006.

Paper No: EP-21-1025

DOI: https://doi.org/10.1115/1.4051647

Published Online: September 15, 2021

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Topics: Damage, Durability, Fatigue, Shear (Mechanics), Solder joints, Solders, Stress, Finite element analysis, Fatigue damage, Hydrostatics

Journal Articles

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Rajesh Sharma Sivasubramony, Maan Zaid Kokash, Sanoop Thekkut, Ninad Shahane, Patrick Thompson, Kabir Mirpuri, Yuki Kawana, Christopher M. Greene, Peter Borgesen

J. Electron. Packag. March 2022, 144(1): 011007.

Paper No: EP-20-1120

DOI: https://doi.org/10.1115/1.4050871

Published Online: August 6, 2021

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Topics: Annealing, Cycles, Damage, Deformation, Dislocations, Fatigue, Fatigue life, Nanoparticles, Particulate matter, Shear strength

Journal Articles

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Vishnu V. B. Reddy, Saurabh Gupta, Jaimal Williamson, Suresh K. Sitaraman

J. Electron. Packag. March 2022, 144(1): 011009.

Paper No: EP-20-1126

DOI: https://doi.org/10.1115/1.4050898

Published Online: August 6, 2021

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Topics: Cycles, Damage, Finite element analysis, Inspection, Lasers, Modeling, Natural language interfaces, Solders, Accelerated life testing, Density

Journal Articles

Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multistress Operating Conditions

Alex Davila-Frias, Shah Limon, Val Marinov, Om Prakash Yadav

J. Electron. Packag. June 2021, 143(2): 021003.

Paper No: EP-20-1042

DOI: https://doi.org/10.1115/1.4048035

Published Online: August 27, 2020

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Topics: Damage, Failure, Reliability, Stress, Electronics

Journal Articles

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Daiki Saito, Kazuhiko Sasagawa, Takeshi Moriwaki, Kazuhiro Fujisaki

J. Electron. Packag. September 2020, 142(3): 031107.

Paper No: EP-19-1129

DOI: https://doi.org/10.1115/1.4046849

Published Online: April 24, 2020

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Topics: Circuits, Damage, Electrodiffusion, Failure analysis, Flexible electronics, Inks, Metals, Nanoparticles, Reliability, Density

Journal Articles

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Chia-Cheng Chang, Kuo-Ning Chiang

J. Electron. Packag. March 2020, 142(1): 011005.

Paper No: EP-19-1027

DOI: https://doi.org/10.1115/1.4044278

Published Online: September 19, 2019

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Topics: Design, Fatigue life, High cycle fatigue, Microelectromechanical systems, Silicon-on-insulator, Simulation, Stress, Torsion, Cycles, Damage

Journal Articles

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

Mahsa Montazeri, Cody J. Marbut, David Huitink

J. Electron. Packag. September 2019, 141(3): 031011.

Paper No: EP-18-1099

DOI: https://doi.org/10.1115/1.4043480

Published Online: May 24, 2019

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Topics: Cycles, Damage, Reliability, Shear (Mechanics), Solders, Stress, Temperature, Fatigue life, Failure, Finite element analysis

Journal Articles

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Sinan Su, Francy John Akkara, Ravinder Thaper, Atif Alkhazali, Mohammad Hamasha, Sa'd Hamasha

J. Electron. Packag. December 2019, 141(4): 040802.

Paper No: EP-18-1117

DOI: https://doi.org/10.1115/1.4043405

Published Online: May 17, 2019

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Topics: Creep, Cycles, Damage, Failure, Fatigue, Fatigue life, Solder joints, Stress, Fracture (Materials), Solders

Journal Articles

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Yasuhiro Kimura, Masumi Saka

J. Electron. Packag. June 2019, 141(2): 021008.

Paper No: EP-18-1073

DOI: https://doi.org/10.1115/1.4042980

Published Online: April 10, 2019

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Topics: Current density, Electrodiffusion, Finite element analysis, Flow (Dynamics), Electric potential, Anodes, Damage, Density, Solders, Atoms

Journal Articles

Edge Trimming Induced Defects on Direct Bonded Wafers

Fumihiro Inoue, Anne Jourdain, Lan Peng, Alain Phommahaxay, Daisuke Kosemura, Ingrid De Wolf, Kenneth June Rebibis, Andy Miller, Erik Sleeckx, Eric Beyne

J. Electron. Packag. September 2018, 140(3): 031004.

Paper No: EP-17-1127

DOI: https://doi.org/10.1115/1.4040002

Published Online: May 11, 2018

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Topics: Damage, Grinding, Semiconductor wafers, Stress, Bonding

Journal Articles

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Karumbu Meyyappan, Milena Vujosevic, Qifeng Wu, Pramod Malatkar, Charles Hill, Ryan Parrott

J. Electron. Packag. June 2018, 140(2): 020905.

Paper No: EP-17-1083

DOI: https://doi.org/10.1115/1.4039301

Published Online: May 9, 2018

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Topics: Damage, Electronics, Engineering standards, Failure, Failure mechanisms, Reliability, Solder joints, Vibration, Transportation systems, Fatigue

Journal Articles

Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope

Jimil M. Shah, Oluwaseun Awe, Betsegaw Gebrehiwot, Dereje Agonafer, Prabjit Singh, Naveen Kannan, Mike Kaler

J. Electron. Packag. June 2017, 139(2): 020903.

Paper No: EP-16-1143

DOI: https://doi.org/10.1115/1.4036363

Published Online: April 24, 2017

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Topics: Contamination, Corrosion, Data centers, Particulate matter, Temperature, Cooling, Reliability, Damage, Failure

Journal Articles

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

David A. Roberson, Ryan B. Wicker, Eric MacDonald

J. Electron. Packag. September 2015, 137(3): 031004.

Paper No: EP-13-1041

DOI: https://doi.org/10.1115/1.4030286

Published Online: September 1, 2015

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Topics: Electronics, Hardening (Curing), Inks, Temperature, Additive manufacturing, Silver, Manufacturing, Damage

Journal Articles

Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter

Pradeep Lall, Hao Zhang

J. Electron. Packag. June 2015, 137(2): 021002.

Paper No: EP-14-1002

DOI: https://doi.org/10.1115/1.4028957

Published Online: June 1, 2015

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Topics: Filters, Light-emitting diodes, Particulate matter, Damage, Failure, Temperature, Physics

Journal Articles

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Awni Qasaimeh, Sa’d Hamasha, Younis Jaradat, Peter Borgesen

J. Electron. Packag. June 2015, 137(2): 021012.

Paper No: EP-14-1077

DOI: https://doi.org/10.1115/1.4029441

Published Online: June 1, 2015

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Topics: Cycles, Damage, Displacement, Fatigue, Fracture (Materials), Lead-free solders, Solders, Stiffness, Stress, Temperature

Journal Articles

Stress–Strain Behavior of SAC305 at High Strain Rates

Pradeep Lall, Sandeep Shantaram, Jeff Suhling, David Locker

J. Electron. Packag. March 2015, 137(1): 011010.

Paper No: EP-14-1001

DOI: https://doi.org/10.1115/1.4028641

Published Online: March 1, 2015

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Topics: Deformation, Displacement, Failure, Finite element analysis, Finite element model, Lead-free solders, Manufacturing, Solders, Stress, Trusses (Building)

Journal Articles

Special Section on InterPACK 2013

Satish Chaparala, Ashish Gupta, Nils Hoivik, Y. C. Lee

J. Electron. Packag. December 2014, 136(4): 040201.

Paper No: EP-14-1070

DOI: https://doi.org/10.1115/1.4028390

Published Online: September 19, 2014

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Topics: Copper, Design, Electronic packaging, Engineering mechanics, Manufacturing, Packaging, Reliability, Sensors, Silicon, Thermal management

Journal Articles

UCPD Model for Pb-Free Solder

Michael K. Neilsen, Paul T. Vianco

J. Electron. Packag. December 2014, 136(4): 041006.

Paper No: EP-13-1101

DOI: https://doi.org/10.1115/1.4026851

Published Online: September 19, 2014

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Topics: Cycles, Damage, Fracture (Materials), Lead-free solders, Solder joints, Solders, Failure, Fatigue, Simulation

Journal citation

NARROW

Mandrel Bend Test of Screen-Printed Silver Conductors

Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current

Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints

Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds

Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages

Reliability Evaluation of Flexible Hybrid Electronics Systems Considering Degradation Behavior Under Multistress Operating Conditions

Electromigration Damage of Flexible Electronic Lines Printed With Ag Nanoparticle Ink

Empirical High Cycle Fatigue Assessment Model of MEMS Devices

Interconnect Fatigue Failure Parameter Isolation for Power Device Reliability Prediction in Alternative Accelerated Mechanical Cycling Test

A State-of-the-Art Review of Fatigue Life Prediction Models for Solder Joint

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Edge Trimming Induced Defects on Direct Bonded Wafers

Vibration-Induced Failures in Automotive Electronics: Knowledge-Based Qualification Perspective

Qualitative Study of Cumulative Corrosion Damage of Information Technology Equipment in a Data Center Utilizing Air-Side Economizer Operating in Recommended and Expanded ASHRAE Envelope

Ohmic Curing of Three-Dimensional Printed Silver Interconnects for Structural Electronics

Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter

Damage Evolution in Lead Free Solder Joints in Isothermal Fatigue

Stress–Strain Behavior of SAC305 at High Strain Rates

Special Section on InterPACK 2013

UCPD Model for Pb-Free Solder

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