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Journal Articles

Optimal Design of Thermal Cycling Reliability For PBGA Assembly via FEM and Taguchi Method

Accepted Manuscript
Chao Gao, Chunyue Huang, Ying Liang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1023
https://doi.org/10.1115/1.4064097
Published Online: November 20, 2023
View Article titled, Optimal Design of Thermal Cycling Reliability For PBGA Assembly via FEM and Taguchi Method
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Topics: Design, Finite element methods, Finite element model, Manufacturing, Reliability, Taguchi methods, Solder joints, Stress, Fatigue life, Constitutive equations
Journal Articles

Heat Dissipation Design Based On Topology Optimization And Auxiliary Materials

Accepted Manuscript
JiaWei Chen, Zhongming Yan, Yang Qiao, Feihong Lin, Yu Wang, Hongcheng Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1062
https://doi.org/10.1115/1.4064099
Published Online: November 20, 2023
View Article titled, Heat Dissipation Design Based On Topology Optimization And Auxiliary Materials
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Topics: Design, Energy dissipation, Heat, Topology optimization, Conductive coatings, Density, Electronics, Engineering simulation, Phase change materials, Simulation
Journal Articles

Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application

Utsav Gupta, Andras Vass-Varnai, Voon Hon Wong, Ayman Fayed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041106.
Paper No: EP-23-1031
https://doi.org/10.1115/1.4063883
Published Online: November 1, 2023
View Article titled, Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application
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Topics: Design, Electric vehicles, Silicon carbide, Simulation, Modeling, Temperature
Journal Articles

Numerical And Experimental Investigation Of A Volumetric Resistance Blower Performance And Its Optimization For Portable Computing Device Applications

Accepted Manuscript
Amit Kumar, Ayan Majumder, Ruander Cardenas, Mark MacDonald, Anandaroop Bhattacharya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1043
https://doi.org/10.1115/1.4063917
Published Online: October 30, 2023
View Article titled, Numerical And Experimental Investigation Of A Volumetric Resistance Blower Performance And Its Optimization For Portable Computing Device Applications
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Topics: Optimization, Flow (Dynamics), Rotors, Acoustics, Pressure, Blades, Noise (Sound), Computer simulation, Cooling, Design
Journal Articles

Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink

Accepted Manuscript
Ammar Osman, Gilberto Moreno, Steve Myers, Joshua Major, Xuhui Feng, Sreekant Narumanchi, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1026
https://doi.org/10.1115/1.4062869
Published Online: June 29, 2023
View Article titled, Automotive Silicon Carbide Power Module Cooling With A Novel Modular Manifold And Embedded Heat Sink
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Topics: Cooling, Heat sinks, Manifolds, Silicon, Electronics, Reliability, Thermal management, Additive manufacturing, Algorithms, Copper
Journal Articles

Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging

John H. Lau
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2024, 146(1): 010801.
Paper No: EP-23-1022
https://doi.org/10.1115/1.4062529
Published Online: June 23, 2023
View Article titled, Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging
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Topics: Bonding, Bridges (Structures), Design, Packaging
Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
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Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

Giuseppe Mauromicale, Michele Calabretta, Giuseppe Scarcella, Giacomo Scelba, Alessandro Sitta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031003.
Paper No: EP-22-1049
https://doi.org/10.1115/1.4056413
Published Online: December 23, 2022
View Article titled, Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
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Topics: Power semiconductor devices, Simulation, Design, Automotive industry, System-in-package, Thermomechanics, Cycles
Journal Articles

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies

Ralf Döring, R. Dudek, S. Rzepka, L. Scheiter, E. Noack, B. Seiler
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011107.
Paper No: EP-22-1020
https://doi.org/10.1115/1.4056445
Published Online: December 23, 2022
View Article titled, Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies
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Topics: Design, Reliability, Simulation, Thermomechanics, Manufacturing, Solders, Computer simulation, Creep, Stress, Cycles
Journal Articles

Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities

Paul Paret, Donal Finegan, Sreekant Narumanchi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034501.
Paper No: EP-22-1053
https://doi.org/10.1115/1.4056306
Published Online: December 9, 2022
View Article titled, Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities
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Topics: Artificial intelligence, Design, Electric vehicles, Electronics, Thermal management, Semiconductor devices, Reliability, Manufacturing, Semiconductors (Materials)
Journal Articles

Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft

Joshua Kasitz, Aniket Ajay Lad, Muhammad Jahidul Hoque, Nenad Miljkovic, David Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011101.
Paper No: EP-22-1023
https://doi.org/10.1115/1.4055464
Published Online: September 27, 2022
View Article titled, Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft
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Topics: Aircraft, Cooling, Cooling systems, Flight, Heat exchangers, Stress, Temperature, Thermal management, Transients (Dynamics), Motors
Journal Articles

Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices

Shuv Dey, Luis Diego Monge Jimenez, J. Michael Brown, Yogendra Joshi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021004.
Paper No: EP-22-1038
https://doi.org/10.1115/1.4055094
Published Online: August 18, 2022
View Article titled, Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices
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Topics: Climate, Design, Solar energy, Temperature, Thermal management, Transients (Dynamics), Solar radiation, Smart cities, Computer simulation, Cycles
Journal Articles

Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate

Vahideh Radmard, Ahmad R. Gharaibeh, Mohammad I. Tradat, Cong. H. Hoang, Yaman Yaseen Manaserh, Kourosh Nemati, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021001.
Paper No: EP-22-1003
https://doi.org/10.1115/1.4054972
Published Online: August 8, 2022
View Article titled, Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate
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Topics: Computers, Cooling, Copper, Corrosion, Nickel plating, Plates (structures), Pressure drop, Temperature, Thermal resistance, Flow (Dynamics)
Journal Articles

Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling

Abel Misrak, Rabin Bhandari, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011204.
Paper No: EP-21-1110
https://doi.org/10.1115/1.4054784
Published Online: August 3, 2022
View Article titled, Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling
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Topics: Glass transition, Reliability, Semiconductor wafers, Storage, Stress, Temperature, Testing, Viscoelasticity, Solders, Failure
Journal Articles

Electrothermal Analysis of System in Package for Aerospace Application

Hao-hang Su, Shuai Fu, Su-yuan Li, Jiang Bian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011202.
Paper No: EP-22-1014
https://doi.org/10.1115/1.4054462
Published Online: July 7, 2022
View Article titled, Electrothermal Analysis of System in Package for Aerospace Application
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Topics: Aerospace industry, Design, Heat, Joules, Reliability, Simulation, System-in-package, Temperature, Vacuum, Errors
Journal Articles

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink

Ahmad R. Gharaibeh, Yaman M. Manaserh, Mohammad I. Tradat, Firas W. AlShatnawi, Scott N. Schiffres, Bahgat G. Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031017.
Paper No: EP-21-1164
https://doi.org/10.1115/1.4054461
Published Online: May 19, 2022
View Article titled, Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink
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Topics: Flow (Dynamics), Heat sinks, Manifolds, Pressure drop, Thermal resistance, Design, Computer simulation, Fluids, Temperature, Heat transfer
Journal Articles

Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology

Pradeep Lall, Kartik Goyal, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021119.
Paper No: EP-21-1057
https://doi.org/10.1115/1.4054131
Published Online: April 22, 2022
View Article titled, Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology
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Topics: Aerosols, Sintering, Metals, Inks, Stress, Shear (Mechanics), Failure, Design, Temperature
Journal Articles

Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging

Shiva Farzinazar, Zongqing Ren, Jungyun Lim, Jae Choon Kim, Jaeho Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021118.
Paper No: EP-21-1038
https://doi.org/10.1115/1.4053948
Published Online: March 28, 2022
View Article titled, Thermomechanical Topology Optimization of Three-Dimensional Heat Guiding Structures for Electronics Packaging
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Topics: Heat, Optimization, Thermomechanics, Topology, Design, Electronic packaging, Heat sinks
Journal Articles

A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime

Louis Schuler, Ludovic Chamoin, Zoubir Khatir, Mounira Berkani, Merouane Ouhab, Nicolas Degrenne
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2022, 144(3): 031013.
Paper No: EP-21-1138
https://doi.org/10.1115/1.4053767
Published Online: March 7, 2022
View Article titled, A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime
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Topics: Design, Solder joints, Temperature, Thermomechanics, Geometry, Finite element analysis, Convection, Cycles, Sensitivity analysis