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Journal Articles

Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect

Yasuhiro Kimura, Masumi Saka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021008.
Paper No: EP-18-1073
https://doi.org/10.1115/1.4042980
Published Online: April 10, 2019
View Article titled, Prediction of Electromigration Critical Current Density in Passivated Arbitrary-Configuration Interconnect
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Topics: Current density, Electrodiffusion, Finite element analysis, Flow (Dynamics), Electric potential, Anodes, Damage, Density, Solders, Atoms
Journal Articles

Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects

Subramanya Sadasiva, Ganesh Subbarayan, Lei Jiang, Daniel Pantuso
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Photo Gallery
J. Electron. Packag. June 2012, 134(2): 020907.
https://doi.org/10.1115/1.4006707
Published Online: June 11, 2012
View Article titled, Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects
Open the PDF for Numerical Simulations of Electromigration and Stressmigration Driven Void Evolution in Solder Interconnects in another window
Topics: Diffusion (Physics), Electrodiffusion, Solder joints, Solders, Stress, Flip-chip, Finite element analysis, Grain boundary diffusion, Electric potential, Surface energy
Journal Articles

Heat Transfer in Wire Bonding Process

M. A. Jog, I. M. Cohen, P. S. Ayyaswamy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 1994, 116(1): 44–48.
https://doi.org/10.1115/1.2905492
Published Online: March 1, 1994
View Article titled, Heat Transfer in Wire Bonding Process
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Topics: Heat transfer, Wire bonding, Electrodes, Wire, Electric discharge, Electric fields, Electric potential, Engineering simulation, Flux (Metallurgy), Heat
Journal Articles

Enhanced Boiling on Microconfigured Surfaces

N. Wright, B. Gebhart
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1989, 111(2): 112–120.
https://doi.org/10.1115/1.3226515
Published Online: June 1, 1989
View Article titled, Enhanced Boiling on Microconfigured Surfaces
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Topics: Boiling, Electric potential, Heat transfer, Heating, Natural convection, Nucleate pool boiling, Pool boiling, Silicon, Subcooling, Water