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Journal Articles

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Inderjot Kaur, Shiraz Mujahid, YubRaj Paudel, Hongjoo Rhee, Prashant Singh

J. Electron. Packag. September 2023, 145(3): 031002.

Paper No: EP-22-1051

DOI: https://doi.org/10.1115/1.4056305

Published Online: December 21, 2022

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Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Topology, Temperature

Journal Articles

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Wei Tong, Alireza Ganjali, Omidreza Ghaffari, Chady al Sayed, Luc Fréchette, Julien Sylvestre

J. Electron. Packag. December 2022, 144(4): 041011.

Paper No: EP-21-1119

DOI: https://doi.org/10.1115/1.4053310

Published Online: January 28, 2022

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Topics: Boiling, Cooling, Heat, Heat transfer coefficients, Temperature, Critical heat flux, Temperature distribution, Flat heat pipes

Journal Articles

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Raffaele L. Amalfi, Todd Salamon, Filippo Cataldo, Jackson B. Marcinichen, John R. Thome

J. Electron. Packag. June 2022, 144(2): 021110.

Paper No: EP-21-1048

DOI: https://doi.org/10.1115/1.4052767

Published Online: November 22, 2021

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Topics: Condensers (steam plant), Cooling, Flow (Dynamics), Heat, Heat exchangers, Refrigerants, Stress, Temperature, Pressure drop, Test facilities

Journal Articles

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

Kidus Guye, De Dong, Yunseo Kim, Hyoungsoon Lee, Baris Dogruoz, Damena Agonafer

J. Electron. Packag. December 2021, 143(4): 041106.

Paper No: EP-21-1120

DOI: https://doi.org/10.1115/1.4052465

Published Online: October 13, 2021

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Topics: Design, Drops, Evaporation, Heat conduction, Heat transfer, Heat transfer coefficients, Optimization, Particle swarm optimization, Shapes, Vapors

Journal Articles

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Rinaldo Miorini, Darin Sharar, Arun Gowda, Cathleen Hoel, Bryan Whalen, Peter de Bock

J. Electron. Packag. June 2022, 144(2): 021105.

Paper No: EP-21-1012

DOI: https://doi.org/10.1115/1.4052071

Published Online: September 24, 2021

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Topics: Additive manufacturing, Bubbles, Ceramics, Cooling, Critical heat flux, Design, Electronics, Flow (Dynamics), Fluids, Heat

Journal Articles

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Rahul Upreti, Siddarth Chintamani, Sandeep Patil, Ashkan Akbariyeh, Brian H. Dennis

J. Electron. Packag. March 2022, 144(1): 011003.

Paper No: EP-20-1083

DOI: https://doi.org/10.1115/1.4050696

Published Online: August 6, 2021

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Topics: Ball-Grid-Array packages, Design, Failure, Finite element analysis, Finite element methods, Heat, Probability, Reliability, Temperature, Thermal analysis

Journal Articles

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Bharath Ramakrishnan, Cong Hiep Hoang, Sadegh Khalili, Yaser Hadad, Srikanth Rangarajan, Arvind Pattamatta, Bahgat Sammakia

J. Electron. Packag. June 2021, 143(2): 020904.

Paper No: EP-20-1119

DOI: https://doi.org/10.1115/1.4049928

Published Online: March 5, 2021

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Topics: Boiling, Coolants, Cooling, Data centers, Density, Flow (Dynamics), Fluids, Heat flux, Heat transfer coefficients, Plates (structures)

Journal Articles

Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Prabhakar Subrahmanyam, B. K. Gnanavel

J. Electron. Packag. September 2021, 143(3): 031009.

Paper No: EP-20-1104

DOI: https://doi.org/10.1115/1.4049579

Published Online: February 19, 2021

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Topics: Flow (Dynamics), Heat transfer, Heat transfer coefficients, Jets, Nozzles, Reynolds-averaged Navier–Stokes equations, Silicon, Reynolds number, Turbulence, Temperature

Journal Articles

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Bharath Ramakrishnan, Yaser Hadad, Sami Alkharabsheh, Paul R. Chiarot, Bahgat Sammakia

J. Electron. Packag. December 2019, 141(4): 041005.

Paper No: EP-18-1069

DOI: https://doi.org/10.1115/1.4044130

Published Online: July 12, 2019

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Topics: Computer simulation, Coolants, Cooling, Flow (Dynamics), Pressure drop, Temperature, Thermal resistance, Heat, Heat transfer coefficients, Heat transfer

Journal Articles

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Raphael K. Mandel, Daniel G. Bae, Michael M. Ohadi

J. Electron. Packag. September 2018, 140(3): 031003.

Paper No: EP-17-1081

DOI: https://doi.org/10.1115/1.4039264

Published Online: May 11, 2018

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Topics: Coolers, Cooling, Electronics, Flow (Dynamics), Fluids, Flux (Metallurgy), Heat, Heat flux, Manifolds, Microchannels

Journal Articles

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Hyoungsoon Lee, Tanmoy Maitra, James Palko, Daeyoung Kong, Chi Zhang, Michael T. Barako, Yoonjin Won, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. June 2018, 140(2): 020906.

Paper No: EP-18-1003

DOI: https://doi.org/10.1115/1.4040088

Published Online: May 9, 2018

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Topics: Copper, Critical heat flux, Heat transfer, Pool boiling, Boiling, Heat transfer coefficients, Bubbles

Journal Articles

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

C. Falsetti, M. Magnini, J. R. Thome

J. Electron. Packag. September 2017, 139(3): 031008.

Paper No: EP-17-1023

DOI: https://doi.org/10.1115/1.4037152

Published Online: July 10, 2017

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Topics: Boiling, Flow (Dynamics), Heat flux, Heat transfer, Heat transfer coefficients, Pressure drop, Temperature, Vapors, Fins, Heat

Journal Articles

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

Pablo A. de Oliveira, Jader R. Barbosa, Jr.

J. Electron. Packag. September 2017, 139(3): 031005.

Paper No: EP-17-1008

DOI: https://doi.org/10.1115/1.4036817

Published Online: June 28, 2017

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Topics: Compressors, Cooling, Heat, Heat sinks, Heat transfer, Refrigeration, Stress, Temperature, Flow (Dynamics), Refrigerants

Journal Articles

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Houxue Huang, Nicolas Lamaison, John R. Thome

J. Electron. Packag. March 2017, 139(1): 011005.

Paper No: EP-16-1083

DOI: https://doi.org/10.1115/1.4035386

Published Online: January 5, 2017

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Topics: Boiling, Flow (Dynamics), Fluids, Heat conduction, Heat flux, Heat transfer, Heat transfer coefficients, Microchannels, Pressure drop, Temperature

Journal Articles

Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

Xuefei Han, Andrei Fedorov, Yogendra Joshi

J. Electron. Packag. December 2016, 138(4): 040801.

Paper No: EP-16-1013

DOI: https://doi.org/10.1115/1.4034317

Published Online: August 24, 2016

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Topics: Boiling, Flow (Dynamics), Heat flux, Water, Temperature, Pressure, Heat transfer coefficients, Heat sinks

Journal Articles

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Xuchen Zhang, Xuefei Han, Thomas E. Sarvey, Craig E. Green, Peter A. Kottke, Andrei G. Fedorov, Yogendra Joshi, Muhannad S. Bakir

J. Electron. Packag. March 2016, 138(1): 010910.

Paper No: EP-15-1107

DOI: https://doi.org/10.1115/1.4032496

Published Online: March 10, 2016

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Topics: Cooling, Design, Fins, Flow (Dynamics), Heat flux, Heat sinks, Heat transfer coefficients, Microfluidics, Temperature, Testing

Journal Articles

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Hyoungsoon Lee, Damena D. Agonafer, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson

J. Electron. Packag. March 2016, 138(1): 010907.

Paper No: EP-15-1104

DOI: https://doi.org/10.1115/1.4032655

Published Online: March 10, 2016

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Topics: Boiling, Computational fluid dynamics, Flow (Dynamics), Flux (Metallurgy), Gallium nitride, Heat conduction, Heat transfer coefficients, Microchannels, Microcoolers, Simulation

Journal Articles

Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

John F. Maddox, Roy W. Knight, Sushil H. Bhavnani

J. Electron. Packag. September 2015, 137(3): 031015.

Paper No: EP-15-1041

DOI: https://doi.org/10.1115/1.4030953

Published Online: September 1, 2015

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Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Nozzles, Reynolds number, Jets, Temperature, Heat flux

Journal Articles

Thermal Management of Time-Varying High Heat Flux Electronic Devices

T. David, D. Mendler, A. Mosyak, A. Bar-Cohen, G. Hetsroni

J. Electron. Packag. June 2014, 136(2): 021003.

Paper No: EP-13-1064

DOI: https://doi.org/10.1115/1.4027325

Published Online: April 29, 2014

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Topics: Flow (Dynamics), Heat flux, Heat sinks, Microchannels, Temperature, Fluids, Steady state, Vapors, Wall temperature, Boiling

Journal Articles

Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution

Jun Jie Liu, Hua Zhang, S. C. Yao, Yubai Li

J. Electron. Packag. June 2014, 136(2): 021008.

Paper No: EP-13-1129

DOI: https://doi.org/10.1115/1.4027420

Published Online: April 29, 2014

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Topics: Boiling, Cooling, Flow (Dynamics), Heat flux, Heat transfer, Microchannels, Modeling, Porous materials, Pressure drop, Temperature

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Journal citation

NARROW

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics

Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers

Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer

A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics

Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid

Influences of Small Jet-to-Wall Spacings on Heat Transfer Characteristics and Flow-Field Entrainment Effects of Microscale Jets

Thermal Analysis of Cold Plate for Direct Liquid Cooling of High Performance Servers

Embedded Two-Phase Cooling of High Flux Electronics Via Press-Fit and Bonded FEEDS Coolers

Enhanced Heat Transfer Using Microporous Copper Inverse Opals

Flow Boiling Heat Transfer and Pressure Drops of R1234ze(E) in a Silicon Micro-pin Fin Evaporator

Performance Assessment of Single and Multiple Jet Impingement Configurations in a Refrigeration-Based Compact Heat Sink for Electronics Cooling

Transient Data Processing of Flow Boiling Local Heat Transfer in a Multi-Microchannel Evaporator Under a Heat Flux Disturbance

Flow Boiling in Microgaps for Thermal Management of High Heat Flux Microsystems

Three-Dimensional Integrated Circuit With Embedded Microfluidic Cooling: Technology, Thermal Performance, and Electrical Implications

Thermal Modeling of Extreme Heat Flux Microchannel Coolers for GaN-on-SiC Semiconductor Devices

Liquid Jet Impingement With an Angled Confining Wall for Spent Flow Management for Power Electronics Cooling With Local Thermal Measurements

Thermal Management of Time-Varying High Heat Flux Electronic Devices

Porous Media Modeling of Two-Phase Microchannel Cooling of Electronic Chips With Nonuniform Power Distribution

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