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Journal Articles

Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation

Hsien-Chie Cheng, Yan-Cheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021005.
Paper No: EP-22-1012
https://doi.org/10.1115/1.4055591
Published Online: September 28, 2022
View Article titled, Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation
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Topics: Capacitance, Circuits, Computational fluid dynamics, Energy dissipation, Heat conduction, Junctions, Modeling, MOSFET transistors, Network models, Power conversion systems
Journal Articles

System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile

Bakhtiyar Mohammad Nafis, Mohammad Mahmud, Zhongjing Wang, Yuheng Wu, David Huitink, Yue Zhao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2022, 144(2): 021107.
Paper No: EP-21-1056
https://doi.org/10.1115/1.4052408
Published Online: October 6, 2021
View Article titled, System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile
Open the PDF for System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile in another window
Topics: Capacitance, Coolants, Gates (Closures), MOSFET transistors, Reliability, Temperature, Traction, Roads, Thermal resistance
Journal Articles

Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules

Emre Gurpinar, Burak Ozpineci, Shajjad Chowdhury
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041107.
Paper No: EP-19-1131
https://doi.org/10.1115/1.4047409
Published Online: June 26, 2020
View Article titled, Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules
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Topics: Design, Energy gap, Heat, Junctions, Metals, MOSFET transistors, Steady state, Temperature, Thermal analysis, Transients (Dynamics)
Journal Articles

Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger

Omri Tayyara, Carlos Da Silva, Miad Nasr, Amir Assadi, Kshitij Gupta, Olivier Trescases, Cristina H. Amon
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2020, 142(4): 041102.
Paper No: EP-20-1020
https://doi.org/10.1115/1.4047226
Published Online: June 4, 2020
View Article titled, Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger
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Topics: Design, Electric vehicles, Engineering simulation, Simulation, Heat, Temperature, MOSFET transistors, Inductors, Cooling, Circuits
Journal Articles

Parameter Calibrations on MOSFET Stress Sensors

Ren-Tzung Tan, Hsien Chung, Ben-Je Lwo, Chun-Pai Tang, Kun-Fu Tseng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2012, 134(3): 031004.
https://doi.org/10.1115/1.4006888
Published Online: July 18, 2012
View Article titled, Parameter Calibrations on MOSFET Stress Sensors
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Topics: Calibration, MOSFET transistors, Sensors, Stress, Temperature
Journal Articles

CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device

Varghese Panthalookaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2010, 132(3): 031007.
https://doi.org/10.1115/1.4002009
Published Online: September 9, 2010
View Article titled, CFD-Assisted Optimization of Chimneylike Flows to Cool an Electronic Device
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Topics: Computational fluid dynamics, Cooling, Energy dissipation, Flow (Dynamics), Heat, Temperature, Natural convection, MOSFET transistors, Separation (Technology), Optimization
Journal Articles

Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling

Hua Ye, Harry Efstathiadis, Pradeep Haldar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2006, 128(3): 267–272.
https://doi.org/10.1115/1.2229226
Published Online: August 15, 2005
View Article titled, Numerical Thermal Simulation of Cryogenic Power Modules Under Liquid Nitrogen Cooling
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Topics: Cooling, Heat, MOSFET transistors, Nitrogen, Simulation, Temperature, Critical heat flux, Junctions, Energy dissipation, Boiling