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Journal Articles

Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging

Yuan Chen, Zhongyang Wang, Yuhui Fan, Ming Dong, Dengxue Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2024, 146(3): 030801.
Paper No: EP-23-1037
https://doi.org/10.1115/1.4064361
Published Online: March 8, 2024
View Article titled, Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging
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Topics: Imaging, Inspection, Lasers, Microelectronic packaging, Resolution (Optics), Nondestructive evaluation, Microscopy
Journal Articles

Special Issue on InterPACK2020

Jin Yang, Sukwon Choi, Jaeho Lee, Saket Karajgikar
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. June 2022, 144(2): 020301.
Paper No: EP-21-1158
https://doi.org/10.1115/1.4053122
Published Online: January 4, 2022
View Article titled, Special Issue on InterPACK2020
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Topics: Additive manufacturing, Cloud computing, Computers, Data centers, Electric vehicles, Electronic packaging, Electronics, Engineering teachers, Microelectronic packaging, Modeling
Journal Articles

Special Section of Review Articles From Intel Corporation

Jin Yang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Guest Editorial
J. Electron. Packag. March 2019, 141(1): 010301.
Paper No: EP-18-1120
https://doi.org/10.1115/1.4042803
Published Online: March 6, 2019
View Article titled, Special Section of Review Articles From Intel Corporation
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Topics: Data centers, Electronic packaging, Cooling, Design, Engineering teachers, Microelectronic packaging, Packaging, Semiconductor industry
Journal Articles

Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]

K. S. Siow, Y. T. Lin
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Errata
J. Electron. Packag. September 2016, 138(3): 037001.
Paper No: EP-16-1057
https://doi.org/10.1115/1.4033633
Published Online: May 25, 2016
View Article titled, Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ]
Open the PDF for Erratum: “Identifying the Development State of Sintered Silver (Ag) as a Bonding Material in the Microelectronic Packaging Via a Patent Landscape Study” [ASME J. Electron. Packag., 2016, 138(2), p. 020804; DOI: 10.1115/1.4033069 ] in another window
Topics: Bonding, Electrons, Microelectronic packaging, Packaging, Patents, Silver, Solders
Journal Articles

Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging

Melida Chin, S. Jack Hu, James R. Barber
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2008, 130(2): 021006.
https://doi.org/10.1115/1.2912180
Published Online: May 8, 2008
View Article titled, Design Guidelines for Anisotropic Conductive Adhesive Assemblies in Microelectronics Packaging
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Topics: Adhesion, Adhesives, Anisotropy, Bonding, Contact resistance, Delamination, Design, Elastic moduli, Particulate matter, Resins
Journal Articles

On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging

Ben-Je Lwo, Ching-Hsing Kao, Tung-Sheng Chen, Yao-Shing Chen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2002, 124(1): 22–26.
https://doi.org/10.1115/1.1414134
Published Online: February 21, 2000
View Article titled, On the Study of Piezoresistive Stress Sensors for Microelectronic Packaging
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Topics: Calibration, Sensors, Stress, Temperature, Manufacturing, Microelectronic packaging
Journal Articles

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory

C. Basaran, R. Chandaroy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 8–11.
https://doi.org/10.1115/1.2792663
Published Online: March 1, 1999
View Article titled, Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory
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Topics: Dynamic analysis, Surface mount packaging, Solder joints, Failure mechanisms, Constitutive equations, Cycles, Defense industry, Failure, Fatigue, Fatigue life
Journal Articles

Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods

B. Han, Y. Guo, C. K. Lim, D. Caletka
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 157–163.
https://doi.org/10.1115/1.2792146
Published Online: September 1, 1996
View Article titled, Verification of Numerical Models Used in Microelectronics Packaging Design by Interferometric Displacement Measurement Methods
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Topics: Computer simulation, Design, Displacement measurement, Microelectronic packaging, Interferometry, Displacement, Cycles, Electronic packaging, Geometry, Modeling
Journal Articles

Influence of Polymer Viscoelasticity on a Bending Bilayer

B. D. Harper
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 191–197.
https://doi.org/10.1115/1.2905685
Published Online: September 1, 1994
View Article titled, Influence of Polymer Viscoelasticity on a Bending Bilayer
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Topics: Polymers, Viscoelasticity, Polymer films, Thermal stresses, Epoxy adhesives, Epoxy resins, Microelectronic packaging, Molding, Temperature, Viscoelastic materials
Journal Articles

Factors Affecting the Adhesion of Fluoropolymer Composites to Commercial Copper Foils

L. J. Jimarez, L. J. Matienzo, A. A. Mehta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1993, 115(3): 256–263.
https://doi.org/10.1115/1.2909326
Published Online: September 1, 1993
View Article titled, Factors Affecting the Adhesion of Fluoropolymer Composites to Commercial Copper Foils
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Topics: Adhesion, Composite materials, Copper foil, Fillers (Materials), Glass, Manufacturing, Lamination, Metals, Microelectronic packaging, Polymers
Journal Articles

Thermal Stress and Strain in Microelectronics Packaging

John H. Lau, Editor, Peter A. Engel, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1993, 115(3): 343.
https://doi.org/10.1115/1.2909339
Published Online: September 1, 1993
View Article titled, Thermal Stress and Strain in Microelectronics Packaging
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Topics: Microelectronic packaging, Thermal stresses
Journal Articles

Discussion: Notes on Microelectronics Packaging Handbook by Rao Tummala and Eugene Rymaszewski, Van Nostrand, 1988

Boris Mirman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Discussions
J. Electron. Packag. June 1990, 112(2): 183–184.
https://doi.org/10.1115/1.2904361
Published Online: June 1, 1990
View Article titled, Discussion: Notes on Microelectronics Packaging Handbook by Rao Tummala and Eugene Rymaszewski, Van Nostrand, 1988
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Topics: Microelectronic packaging
Journal Articles

Microelectronics Packaging Handbook

Rao R. Tummala, editor, Eugene J. Rymaszewski, editor, Y. C. Lee, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 1989, 111(3): 241–242.
https://doi.org/10.1115/1.3226540
Published Online: September 1, 1989
View Article titled, Microelectronics Packaging Handbook
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Topics: Microelectronic packaging