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Journal Articles

Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging

Accepted Manuscript
Pradeep Lall, Hyesoo Jang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-24-1003
https://doi.org/10.1115/1.4067266
Published Online: November 27, 2024
View Article titled, Electrochemical Linked to Mechanical Simulation for an Assessment of State-Of-Health of Thin-flexible Li-ion Batteries on Dynamic Flexing and Calendar Aging
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Topics: Engineering simulation, Lithium-ion batteries, Batteries, Simulation, Stress, Durability, Electronics, Operating temperature, Physics, Storage
Journal Articles

Failure Mechanisms Driven Reliability Models for Power Electronics: A Review

Okafor Ekene Gabriel, David Ryan Huitink
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. June 2023, 145(2): 020801.
Paper No: EP-22-1045
https://doi.org/10.1115/1.4055774
Published Online: October 22, 2022
View Article titled, Failure Mechanisms Driven Reliability Models for Power Electronics: A Review
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Topics: Failure, Fatigue, Reliability, Stress, Temperature, Fatigue life, Electronics, Failure mechanisms, Corrosion, Modeling
Journal Articles

Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter

Pradeep Lall, Hao Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021002.
Paper No: EP-14-1002
https://doi.org/10.1115/1.4028957
Published Online: June 1, 2015
View Article titled, Assessment of Lumen Degradation and Remaining Life of Light-Emitting Diodes Using Physics-Based Indicators and Particle Filter
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Topics: Filters, Light-emitting diodes, Particulate matter, Damage, Failure, Temperature, Physics
Journal Articles

Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock

A. D. Laws, R. Borwick, III, P. Stupar, J. DeNatale, Y. C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2009, 131(4): 041005.
https://doi.org/10.1115/1.4000211
Published Online: October 21, 2009
View Article titled, Thermal and Structural Analysis of a Suspended Physics Package for a Chip-Scale Atomic Clock
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Topics: Design, Physics, Atomic clocks, Temperature, Thermal resistance, Shock (Mechanics), Finite element analysis, Structural analysis
Journal Articles

Editorial

Bahgat Sammakia, Mohamed-Nabil Sabry
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Editorial
J. Electron. Packag. December 2008, 130(4): 040201.
https://doi.org/10.1115/1.3039759
Published Online: November 17, 2008
View Article titled, Editorial
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Topics: Biomedical engineering, Computers, Cooling, Data centers, Electronic packaging, Electronic systems, Electronics, Engineering teachers, Experimental methods, Fuel cells
Journal Articles

Multi-Physics Simulation of a Microprocessor Package Under Water Cooling

Liu Bao-Min, Mui Y. C.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2004, 126(3): 384–389.
https://doi.org/10.1115/1.1774197
Published Online: October 6, 2004
View Article titled, Multi-Physics Simulation of a Microprocessor Package Under Water Cooling
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Topics: Cooling, Flow (Dynamics), Simulation, Thermal stresses, Water, Thermal resistance, Temperature, Physics
Journal Articles

Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme

Masoud Darbandi, Assistant Professor,, Gerry E. Schneider, Professor,
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 2003, 125(2): 244–250.
https://doi.org/10.1115/1.1569508
Published Online: June 10, 2003
View Article titled, Thermobuoyancy Treatment for Electronic Packaging Using an Improved Advection Scheme
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Topics: Approximation, Buoyancy, Cavities, Electronic packaging, Flow (Dynamics), Fluid dynamics, Heat transfer, Modeling, Natural convection, Rayleigh number
Journal Articles

Simulation of the Influence of Manufacturing Quality on Reliability of Vias

A. Dasgupta, V. Ramappan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1995, 117(2): 141–146.
https://doi.org/10.1115/1.2792081
Published Online: June 1, 1995
View Article titled, Simulation of the Influence of Manufacturing Quality on Reliability of Vias
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Topics: Manufacturing, Reliability, Simulation, Plating, Buckling, Cycles, Design, Design engineering, Electronic packages, Failure
Journal Articles

A Physics of Failure Approach to Component Placement

M. D. Osterman
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1992, 114(3): 305–309.
https://doi.org/10.1115/1.2905455
Published Online: September 1, 1992
View Article titled, A Physics of Failure Approach to Component Placement
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Topics: Failure, Physics, Temperature, Hazards, Printed circuit boards, Reliability, Cooling, Cycles, Forced convection, Manufacturing
Journal Articles

A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging

R. G. Ross, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 121–128.
https://doi.org/10.1115/1.2905377
Published Online: June 1, 1991
View Article titled, A Systems Approach to Solder Joint Fatigue in Spacecraft Electronic Packaging
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Topics: Electronic packaging, Fatigue, Solder joints, Space vehicles, Cycles, Hardware, Failure, Flight, Solders, Design