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Journal Articles

Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test

Ming-Hwa R. Jen, Lee-Cheng Liu, Jenq-Dah Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2005, 127(4): 446–451.
https://doi.org/10.1115/1.2070090
Published Online: January 13, 2005
View Article titled, Flip-Chip Ball Grid Array Lead-Free Solder Joint Under Reliability Test
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Topics: Ball-Grid-Array packaging, Flip-chip, High temperature, Lead-free solders, Reliability, Shear (Mechanics), Failure mechanisms, Solders, Shear strength, Adhesion
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
https://doi.org/10.1115/1.1534842
Published Online: March 14, 2003
View Article titled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
https://doi.org/10.1115/1.1502666
Published Online: December 12, 2002
View Article titled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Reliability, Shear (Mechanics), Shear strength, Solders, Silver, Resistors
Journal Articles

Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles

S. Kamiya, H. Takahashi, M. Saka, H. Abe´
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Special Section Technical Papers
J. Electron. Packag. December 1998, 120(4): 367–371.
https://doi.org/10.1115/1.2792648
Published Online: December 1, 1998
View Article titled, Direct Measurement of the Adhesive Fracture Resistance of CVD Diamond Particles
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Topics: Adhesives, Fracture (Materials), Fracture (Process), Particulate matter, Synthetic diamonds, Chemical vapor deposition, Diamond films, Nucleation (Physics), Stress, Electronics
Journal Articles

Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack

R. K. Govila, Y.-H. Pao, C. Larner, J. Lau, S. Twerefour, S. Erasmus, S. Dolot
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1994, 116(3): 184–190.
https://doi.org/10.1115/1.2905684
Published Online: September 1, 1994
View Article titled, Failure Analysis of No-Clean and Water-Clean Solder Joints 0.4 mm Pitch, 256-Pin Plastic Quad Flat Pack
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Topics: Failure analysis, Solder joints, Water, Solders, Cycles, Crack propagation, Cracking (Materials), Failure, Failure mechanisms, Fatigue damage
Journal Articles

Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors

R. K. Govila, E. Jih, Y.-H. Pao, C. Larner
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 83–88.
https://doi.org/10.1115/1.2905509
Published Online: June 1, 1994
View Article titled, Thermal Fatigue Damage in the Solder Joints of Leadless Chip Resistors
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Topics: Fatigue damage, Resistors, Solder joints, Solders, Damage, Stress concentration, Corners (Structural elements), Cracking (Materials), Cycles, Design