1-20 of 36
Soldering
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
Open the PDF for A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components in another window
Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
Open the PDF for Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications in another window
Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation

Zuraihana Bachok, Mohamad Aizat Abas, Muhammad Zaim Hanif Nazarudin, Saifulmajdy A. Zahiri, Mohamad Fikri Mohd Sharif, Fakhrozi Che Ani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041018.
Paper No: EP-21-1157
https://doi.org/10.1115/1.4054132
Published Online: April 22, 2022
View Article titled, Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation
Open the PDF for Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation in another window
Topics: Lasers, Soldering, Solders
Journal Articles

Influence of Laser Soldering Temperatures on Through-Hole Component

Saifulmajdy A. Zahiri, Aizat Abas, M. F. M. Sharif, Fakhrozi Che Ani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041006.
Paper No: EP-21-1075
https://doi.org/10.1115/1.4052175
Published Online: November 22, 2021
View Article titled, Influence of Laser Soldering Temperatures on Through-Hole Component
Open the PDF for Influence of Laser Soldering Temperatures on Through-Hole Component in another window
Topics: Flow (Dynamics), Lasers, Soldering, Solders, Temperature, Lead-free solders, Finite volume methods, Pressure
Journal Articles

Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals

Xiaoping Wang, Jun Yang, Xiaogang Liu, Panpan Zheng, Qinglin Song, Bin Song, Sheng Liu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011005.
Paper No: EP-20-1097
https://doi.org/10.1115/1.4049813
Published Online: August 6, 2021
View Article titled, Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals
Open the PDF for Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Signals in another window
Topics: Cycles, Microelectromechanical systems, Modeling, Pressure sensors, Signals, Stress, Temperature, Vibration, Solder joints, Soldering
Journal Articles

Numerical Modeling of the Wave Soldering Process and Experimental Validation

Violeta Carvalho, Bruno Arcipreste, Delfim Soares, Luís Ribas, Nelson Rodrigues, Senhorinha F. C. F. Teixeira, José Carlos Teixeira
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2022, 144(1): 011011.
Paper No: EP-21-1002
https://doi.org/10.1115/1.4050981
Published Online: August 6, 2021
View Article titled, Numerical Modeling of the Wave Soldering Process and Experimental Validation
Open the PDF for Numerical Modeling of the Wave Soldering Process and Experimental Validation in another window
Topics: Computer simulation, Soldering, Solders, Wave soldering, Waves, Strain measurement, Fluids
Journal Articles

Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques

Aleksander Sesek, Olga Chambers, Janez Trontelj
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2019, 141(2): 021005.
Paper No: EP-18-1040
https://doi.org/10.1115/1.4042804
Published Online: March 4, 2019
View Article titled, Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
Open the PDF for Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques in another window
Topics: Image processing, Image segmentation, X-rays, Shapes, Soldering, Edge detection
Journal Articles

Reactive Joining of Thermally and Mechanically Sensitive Materials

Bastian Rheingans, Roman Furrer, Jürg Neuenschwander, Irina Spies, Axel Schumacher, Stephan Knappmann, Lars P. H. Jeurgens, Jolanta Janczak-Rusch
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
https://doi.org/10.1115/1.4040978
Published Online: September 10, 2018
View Article titled, Reactive Joining of Thermally and Mechanically Sensitive Materials
Open the PDF for Reactive Joining of Thermally and Mechanically Sensitive Materials in another window
Topics: Borosilicate glasses, Joining, Solders, Soldering, Tin, Aluminum, Heat, Temperature, Glass, Thermal shock
Journal Articles

Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies

Ye Tian, Ning Ren, Xiaoxia Jian, Tie Geng, Yiping Wu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031007.
Paper No: EP-18-1009
https://doi.org/10.1115/1.4040298
Published Online: June 11, 2018
View Article titled, Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies
Open the PDF for Interfacial Compounds Characteristic and Its Reliability Effects on SAC305 Microjoints in Flip Chip Assemblies in another window
Topics: Flip-chip assemblies, Reliability, Soldering, Tin, Solders, Finite element analysis, Fracture (Materials), Intermetallic compounds
Journal Articles

Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation

Leila Ladani, Ousama Abdelhadi
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2015, 137(1): 014501.
Paper No: EP-13-1116
https://doi.org/10.1115/1.4027992
Published Online: October 6, 2014
View Article titled, Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation
Open the PDF for Structural Size Effect on Mechanical Behavior of Intermetallic Material in Solder Joints: Experimental Investigation in another window
Topics: Intermetallic compounds, Mechanical properties, Nanoindentation, Solder joints, Tin, Mechanical behavior, Size effect, Elastic moduli, Yield strength, Stress
Journal Articles

Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints

Ousama M. Abdelhadi, Leila Ladani
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021004.
Paper No: EP-12-1069
https://doi.org/10.1115/1.4023846
Published Online: March 28, 2013
View Article titled, Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints
Open the PDF for Effect of Joint Size on Microstructure and Growth Kinetics of Intermetallic Compounds in Solid-Liquid Interdiffusion Sn3.5Ag/Cu-Substrate Solder Joints in another window
Topics: Solder joints, Soldering, Solders, Temperature, Tin, Intermetallic compounds
Journal Articles

40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding

Chu-Hsuan Sha, Chin C. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 2011, 133(3): 031012.
https://doi.org/10.1115/1.4004660
Published Online: September 30, 2011
View Article titled, 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding
Open the PDF for 40 μm Silver Flip-Chip Interconnect Technology With Solid-State Bonding in another window
Topics: Bonding, Flip-chip, Silicon chips, Silver, Soldering, Thermal expansion, Pressure, Copper
Journal Articles

Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders

Zongjie Han, Songbai Xue, Jianxin Wang, Xin Zhang, Shenglin Yu, Liang Zhang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2009, 131(2): 021004.
https://doi.org/10.1115/1.3103932
Published Online: April 1, 2009
View Article titled, Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders
Open the PDF for Laser Soldering of Fine Pitch QFP Devices Using Lead-Free Solders in another window
Topics: Lasers, Lead-free solders, Mechanical properties, Soldering, Solders, Tin, Reflow soldering
Journal Articles

Design for Reliability Applied to Packaging of a MOEMS Switch

Abiodun A. Fasoro, Manoj Mittal, Dan O. Popa, Dereje A. Agonafer, Harry E. Stephanou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2008, 130(4): 041003.
https://doi.org/10.1115/1.2993142
Published Online: November 17, 2008
View Article titled, Design for Reliability Applied to Packaging of a MOEMS Switch
Open the PDF for Design for Reliability Applied to Packaging of a MOEMS Switch in another window
Topics: Design, Fibers, Microelectromechanical systems, Microoptoelectromechanical systems, Packaging, Reliability, Sealing (Process), Switches, Shear (Mechanics), Solders
Journal Articles

Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering

Wei Zhang, Chunqing Wang, Yanhong Tian
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011009.
https://doi.org/10.1115/1.2837518
Published Online: February 12, 2008
View Article titled, Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering
Open the PDF for Numerical and Experimental Analysis of Solder Joint Self-Alignment in Fiber Attachment Soldering in another window
Topics: Fibers, Solder joints, Soldering, Solders, Surface tension, Geometry, Shapes, Equilibrium (Physics), Yaw
Journal Articles

Environment-Friendly Electronics: Lead-Free Technology

ANTHONY J. RAFANELLI
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. December 2005, 127(4): 537–538.
https://doi.org/10.1115/1.2070093
Published Online: December 1, 2005
View Article titled, Environment-Friendly Electronics: Lead-Free Technology
Open the PDF for Environment-Friendly Electronics: Lead-Free Technology in another window
Topics: Alloys, Electronics, Lead-free solders, Solders, Electronic packaging, Soldering, Tin, Low cycle fatigue
Journal Articles

Hygrothermal Cracking Analysis of Plastic IC Package

Ji Hyuck Yang, Kang Yong Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 2005, 127(2): 164–171.
https://doi.org/10.1115/1.1870016
Published Online: June 8, 2004
View Article titled, Hygrothermal Cracking Analysis of Plastic IC Package
Open the PDF for Hygrothermal Cracking Analysis of Plastic IC Package in another window
Topics: Delamination, Fracture (Materials), Fracture (Process), Fracture mechanics, High temperature, Reflow soldering, Vapor pressure, Viscoelasticity, Low temperature, Design
Journal Articles

CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering

Ismail Fidan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2004, 126(1): 173–176.
https://doi.org/10.1115/1.1646422
Published Online: April 30, 2004
View Article titled, CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering
Open the PDF for CAPP for Electronics Manufacturing Case Study: Fine Pitch SMT Laser Soldering in another window
Topics: Electronics, Lasers, Manufacturing, Printed circuit board assemblies, Reliability, Soldering, Solders, Computer-aided engineering, Production planning, Solder joints
Journal Articles

Open Defects in PBGA Assembly Solder Joints

S. H. Fan, Y. C. Chan, J. K. L. Lai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 157–161.
https://doi.org/10.1115/1.1536951
Published Online: March 14, 2003
View Article titled, Open Defects in PBGA Assembly Solder Joints
Open the PDF for Open Defects in PBGA Assembly Solder Joints in another window
Topics: Manufacturing, Solder joints, Solders, Soldering, Inspection, Thermal stability, Wetting, Printing
Journal Articles

Solders and Soldering

Howard H. Manko,, Author, Anthony J. Rafanelli,, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. September 2002, 124(3): 314.
https://doi.org/10.1115/1.1503063
Published Online: July 26, 2002
View Article titled, Solders and Soldering
Open the PDF for Solders and Soldering in another window
Topics: Soldering, Solders, Alloys, Materials properties