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Journal Articles

Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation

Cemal Basaran, Associate Professor, Yujun Wen, Ph.D. Candidate
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2003, 125(3): 426–430.
https://doi.org/10.1115/1.1602707
Published Online: September 17, 2003
View Article titled, Coarsening in BGA Solder Balls: Modeling and Experimental Evaluation
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Topics: Ball-Grid-Array packaging, Finite element analysis, Modeling, Reliability, Solder joints, Solders, Temperature, Tin, Surface mount technology, Diffusion (Physics)
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 93–97.
https://doi.org/10.1115/1.1534842
Published Online: March 14, 2003
View Article titled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Shear (Mechanics), Shear strength, Solders, Silver, Resistors, Alloys
Journal Articles

Impact Resistance of SM Joints Formed With ICA

C. M. Lawrence Wu, Robert K. Y. Li, N. H. Yeung
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 2002, 124(4): 374–378.
https://doi.org/10.1115/1.1502666
Published Online: December 12, 2002
View Article titled, Impact Resistance of SM Joints Formed With ICA
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Topics: Adhesives, Copper, Fracture (Materials), Impact testing, Reliability, Shear (Mechanics), Shear strength, Solders, Silver, Resistors
Journal Articles

Thermal Math Modeling and Analysis of an Electronic Assembly

K. N. Shukla
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Additional Technical Papers
J. Electron. Packag. December 2001, 123(4): 372–378.
https://doi.org/10.1115/1.1388561
Published Online: May 5, 2000
View Article titled, Thermal Math Modeling and Analysis of an Electronic Assembly
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Topics: Finite element methods, Heat, Heat transfer coefficients, Manufacturing, Mathematics, Modeling, Temperature, Temperature distribution, Thermal analysis, Printed circuit boards
Journal Articles

Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading

R. Chandaroy, C. Basaran
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1999, 121(2): 61–68.
https://doi.org/10.1115/1.2792669
Published Online: June 1, 1999
View Article titled, Damage Mechanics of Surface Mount Technology Solder Joints Under Concurrent Thermal and Dynamic Loading
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Topics: Damage mechanics, Dynamic testing (Materials), Solder joints, Surface mount technology, Fatigue life, Failure mechanisms, Reliability, Stress, Vibration, Constitutive equations
Journal Articles

Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory

C. Basaran, R. Chandaroy
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1999, 121(1): 8–11.
https://doi.org/10.1115/1.2792663
Published Online: March 1, 1999
View Article titled, Nonlinear Dynamic Analysis of Surface Mount Interconnects: Part I—Theory
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Topics: Dynamic analysis, Surface mount packaging, Solder joints, Failure mechanisms, Constitutive equations, Cycles, Defense industry, Failure, Fatigue, Fatigue life
Journal Articles

Fatigue Life Estimation of Solder Joints in SMT-PGA Packages

M. Mukai, T. Kawakami, Y. Hiruta, K. Takahashi, K. Kishimoto, T. Shibuya
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. June 1998, 120(2): 207–212.
https://doi.org/10.1115/1.2792623
Published Online: June 1, 1998
View Article titled, Fatigue Life Estimation of Solder Joints in SMT-PGA Packages
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Topics: Fatigue life, Solder joints, Constitutive equations, Creep, Solders, Cycles, Electronic components, Failure, Stress analysis (Engineering), Surface mount technology
Journal Articles

Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application

C. Basaran, C. S. Desai, T. Kundu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 1998, 120(1): 48–53.
https://doi.org/10.1115/1.2792285
Published Online: March 1, 1998
View Article titled, Thermomechanical Finite Element Analysis of Problems in Electronic Packaging Using the Disturbed State Concept: Part 2—Verification and Application
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Topics: Electronic packaging, Finite element analysis, Thermomechanics, Alloys, Solders, Modeling, Surface mount technology
Journal Articles

Life Prediction of Solder Joints by Damage and Fracture Mechanics

S. H. Ju, B. I. Sandor, M. E. Plesha
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. December 1996, 118(4): 193–200.
https://doi.org/10.1115/1.2792152
Published Online: December 1, 1996
View Article titled, Life Prediction of Solder Joints by Damage and Fracture Mechanics
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Topics: Damage, Fracture mechanics, Solder joints, Fracture (Materials), Damage mechanics, Fatigue life, Computers, Fatigue, Finite element methods, Anisotropy
Journal Articles

Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver

D. C. Whalley, P. P. Conway
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1996, 118(3): 134–141.
https://doi.org/10.1115/1.2792143
Published Online: September 1, 1996
View Article titled, Simulation and Interpretation of Wetting Balance Tests Using the Surface Evolver
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Topics: Simulation, Wetting, Solders, Surface tension, Electromagnetic scattering, Errors, Modeling, Shapes, Solder joints, Soldering
Journal Articles

Study of Print Release Process in Solder Paste Printing

C. Sahay, L. M. Head, R. Shereen, P. Dujari, J. H. Constable, G. Westby
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 1995, 117(3): 230–234.
https://doi.org/10.1115/1.2792097
Published Online: September 1, 1995
View Article titled, Study of Print Release Process in Solder Paste Printing
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Topics: Printing, Solders, Shear strength, Boundary layers, Density, Dimensions, Reflow soldering, Separation (Technology), Shear (Mechanics), Surface mount technology
Journal Articles

Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff

M. K. Schwiebert
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1994, 116(2): 89–91.
https://doi.org/10.1115/1.2905510
Published Online: June 1, 1994
View Article titled, Effects of Solder Joint Voiding and Seating Plane Stability on Surface Mount Lead Standoff
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Topics: Solder joints, Stability, Surface mount packaging, Solders, Rocks, Surface mount technology
Journal Articles

An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards

G. G. Stefani, N. S. Goel, D. B. Jenks
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 1993, 115(4): 366–372.
https://doi.org/10.1115/1.2909345
Published Online: December 1, 1993
View Article titled, An Efficient Numerical Technique for Thermal Characterization of Printed Wiring Boards
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Topics: Printed circuit boards, Thermal characterization, Modeling, Computers, Finite element analysis, Microelectronic devices, Plates (structures), Surface mount technology, Thermal conductivity
Journal Articles

The "Smeared" Property Technique for the FE Vibration Analysis of Printed Circuit Cards

J. M. Pitarresi, D. V. Caletka, R. Caldwell, D. E. Smith
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1991, 113(3): 250–257.
https://doi.org/10.1115/1.2905403
Published Online: September 1, 1991
View Article titled, The "Smeared" Property Technique for the FE Vibration Analysis of Printed Circuit Cards
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Topics: Approximation, Boundary-value problems, Circuits, Finite element analysis, Finite element model, Mechanical properties, Modal assurance criterion, Mode shapes, Printed circuit boards, Surface mount technology
Journal Articles

Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints

D. T. Read, G. K. Lucey, Jr.
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. June 1991, 113(2): 178–185.
https://doi.org/10.1115/1.2905384
Published Online: June 1, 1991
View Article titled, Automated Finite-Element Mesh Generation for Surface Mount Technology Solder Joints
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Topics: Finite element analysis, Mesh generation, Solder joints, Surface mount technology, X-rays, Computer software, Failure, Inspection, Machinery, Modeling
Journal Articles

Surface Mount Technology Materials, Processes, and Equipment

Carmen Capillo, Author, A. J. Rafanelli, Reviewer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Book Reviews
J. Electron. Packag. June 1991, 113(2): 200.
https://doi.org/10.1115/1.2905388
Published Online: June 1, 1991
View Article titled, Surface Mount Technology Materials, Processes, and Equipment
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Topics: Surface mount technology
Journal Articles

Solder Joint Formation in Surface Mount Technology—Part II: Design

S. M. Heinrich, N. J. Nigro, A. F. Elkouh, P. S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 219–222.
https://doi.org/10.1115/1.2904370
Published Online: September 1, 1990
View Article titled, Solder Joint Formation in Surface Mount Technology—Part II: Design
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Topics: Design, Solder joints, Surface mount technology, Surface tension, Density, Dimensions, Solders, Surface mount packaging
Journal Articles

Solder Joint Formation in Surface Mount Technology—Part I: Analysis

S. M. Heinrich, A. F. Elkouh, N. J. Nigro, Ping S. Lee
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. September 1990, 112(3): 210–218.
https://doi.org/10.1115/1.2904369
Published Online: September 1, 1990
View Article titled, Solder Joint Formation in Surface Mount Technology—Part I: Analysis
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Topics: Solder joints, Surface mount technology, Solders, Density, Dimensions, Shapes, Surface mount packaging, Surface tension