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Journal Articles

A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage

Chongyang Cai, Huayan Wang, Junbo Yang, Pengcheng Yin, S. B Park
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021006.
Paper No: EP-23-1060
https://doi.org/10.1115/1.4063919
Published Online: November 23, 2023
View Article titled, A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage
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Topics: Stress, Warping, Temperature, Silicon
Journal Articles

Heat Dissipation Design Based On Topology Optimization And Auxiliary Materials

Accepted Manuscript
JiaWei Chen, Zhongming Yan, Yang Qiao, Feihong Lin, Yu Wang, Hongcheng Zhou
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-23-1062
https://doi.org/10.1115/1.4064099
Published Online: November 20, 2023
View Article titled, Heat Dissipation Design Based On Topology Optimization And Auxiliary Materials
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Topics: Design, Energy dissipation, Heat, Topology optimization, Conductive coatings, Density, Electronics, Engineering simulation, Phase change materials, Simulation
Journal Articles

Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling

R. Khalid, E. Youssef, R. L. Amalfi, A. Ortega, A. P. Wemhoff
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021005.
Paper No: EP-23-1016
https://doi.org/10.1115/1.4063252
Published Online: November 10, 2023
View Article titled, Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling
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Topics: Flow (Dynamics), Heat exchangers, Refrigerants, Temperature, Heat, Cooling, Fluids, Pressure
Journal Articles

Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2024, 146(2): 021004.
Paper No: EP-22-1026
https://doi.org/10.1115/1.4062868
Published Online: November 10, 2023
View Article titled, Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method
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Topics: Solders, Temperature, Shock (Mechanics), Alloys
Journal Articles

Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application

Utsav Gupta, Andras Vass-Varnai, Voon Hon Wong, Ayman Fayed
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041106.
Paper No: EP-23-1031
https://doi.org/10.1115/1.4063883
Published Online: November 1, 2023
View Article titled, Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application
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Topics: Design, Electric vehicles, Silicon carbide, Simulation, Modeling, Temperature
Journal Articles

Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits

Beihan Zhao, Aniket Bharamgonda, Edwin Quinn, George Stackhouse, Jason Fleischer, Michael Osterman, Michael H. Azarian, Daniel R. Hines, Siddhartha Das, Abhijit Dasgupta
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041105.
Paper No: EP-23-1012
https://doi.org/10.1115/1.4063541
Published Online: November 1, 2023
View Article titled, Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits
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Topics: Aerosols, Failure, Failure mechanisms, Modeling, Reliability, Silver, Temperature, Testing, Circuits, Printing
Journal Articles

Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska

Jewoo Park, Nhi V. Quach, Yonghwi Kim, Ruey-Hwa Cheng, Michal Jenco, Chenxi Yin, Alex K. Lee, Yoonjin Won
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. December 2023, 145(4): 044501.
Paper No: EP-23-1039
https://doi.org/10.1115/1.4063486
Published Online: October 5, 2023
View Article titled, Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska
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Topics: Autonomous vehicles, Drops, Machine learning, Sensors, Temperature, Vehicles
Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031010.
Paper No: EP-22-1063
https://doi.org/10.1115/1.4062530
Published Online: June 23, 2023
View Article titled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
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Topics: Convection, Cooling, Cycles, Heat, Temperature, Heat conduction, Optimization, Thermal resistance, Matlab, Energy dissipation
Journal Articles

Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit

Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
https://doi.org/10.1115/1.4062531
Published Online: June 6, 2023
View Article titled, Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit
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Topics: Flow (Dynamics), Heat transfer, Microchannels, Shapes, Temperature, Fins, Circuits, Cooling, Integrated circuits
Journal Articles

Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling

Jimil M. Shah, Thomas Crandall, Phillip E. Tuma
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2023, 145(4): 041101.
Paper No: EP-22-1089
https://doi.org/10.1115/1.4062403
Published Online: May 15, 2023
View Article titled, Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
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Topics: Boilers, Boiling, Bose-Einstein condensates, Cooling, Fluids, Junctions, Slug flows, Temperature, Thermal resistance, Vehicles
Journal Articles

Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package

Ke Zhong, Huanpeng Wang, Jingrou Wang, Yuehang Xu
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011002.
Paper No: EP-22-1090
https://doi.org/10.1115/1.4062344
Published Online: May 2, 2023
View Article titled, Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
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Topics: Ball-Grid-Array packaging, Fatigue life, Heat, Heating, Reliability, Solders, Stress, Temperature, Thermal shock, Cycles
Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yun-Ze Li, Weishu Wang
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031011.
Paper No: EP-22-1097
https://doi.org/10.1115/1.4062108
Published Online: March 30, 2023
View Article titled, Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
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Topics: Fibers, Heat, Satellites, Temperature, Temperature control, Thermoelectric coolers, Temperature controls
Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
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Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications

Pradeep Lall, Padmanava Choudhury, Scott Miller
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011109.
Paper No: EP-22-1035
https://doi.org/10.1115/1.4056477
Published Online: January 11, 2023
View Article titled, Interaction of Surface Preparation and Cure Parameters on the Interface Reliability of Flexible Encapsulation in Flexible Hybrid Electronics Applications
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Topics: Adhesives, Electronics, Reliability, Surface preparation, Temperature, Stress, Inks, Silver
Journal Articles

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Inderjot Kaur, Shiraz Mujahid, YubRaj Paudel, Hongjoo Rhee, Prashant Singh
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031002.
Paper No: EP-22-1051
https://doi.org/10.1115/1.4056305
Published Online: December 21, 2022
View Article titled, Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
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Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Topology, Temperature
Journal Articles

Module-Level Thermal Interface Material Degradation in HALT

Joshua Tompkins, Alicia Medina Garcia, David Huitink, Haitao Liao
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011106.
Paper No: EP-22-1021
https://doi.org/10.1115/1.4056030
Published Online: November 23, 2022
View Article titled, Module-Level Thermal Interface Material Degradation in HALT
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Topics: Cycles, Life testing, Stress, Temperature, Testing, Thermal resistance, Vibration, Electronics, Reliability, Heating
Includes: Supplementary data
Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
https://doi.org/10.1115/1.4056113
Published Online: November 11, 2022
View Article titled, Effective Constitutive Relations for Sintered Nano Copper Joints
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Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering
Journal Articles

HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions

Ange Christian Iradukunda, David Huitink, Kevin Kayijuka, Tarek Gebrael, Nenad Miljkovic
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2023, 145(1): 011105.
Paper No: EP-22-1022
https://doi.org/10.1115/1.4056031
Published Online: November 11, 2022
View Article titled, HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions
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Topics: Coolants, Electrodes, Flow (Dynamics), Fluids, Temperature, Cooling
Journal Articles

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Soumya Bandyopadhyay, Justin A. Weibel
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021009.
Paper No: EP-22-1047
https://doi.org/10.1115/1.4055987
Published Online: November 1, 2022
View Article titled, A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
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Topics: Heat, Transients (Dynamics), Temperature, Anisotropy