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Keywords: 3D IC
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Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024001.
Paper No: EP-13-1081
Published Online: April 29, 2014
.... 30 07 2013 15 02 2014 In an effort to increase processor speeds, 3D IC architecture is being aggressively pursued by researchers and chip manufacturers. This architecture allows extremely high level of integration with enhanced electrical performance and expanded functionality...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021007.
Paper No: EP-13-1082
Published Online: April 29, 2014
... behaviors for the variable-fin-density configurations help to homogenize the temperature distribution, which is a desired feature for the thermal management of 3D ICs. The objective of analyzing these designs is to find a balanced configuration in terms of heat transfer and pressure drop. The effect...