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Keywords: Cu-Sn Intermetallics
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. March 2003, 125(1): 153–156.
Published Online: March 14, 2003
...Y. C. Chan; S. H. Fan; J. K. L. Lai In this study, the diffusion behavior and microstructural evolution of Cu-Sn intermetallics at eutectic Sn-Pb solder/copper substrate interface of PBGA solder joints was studied. The PBGA solder joints were formed by different profiles, which was devised to have...
