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Keywords: Heat Spreader
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Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
... pool boiling microporous enhancement electronics cooling heat spreader experimental Historically the power dissipated from a microprocessor has increased with its computing performance. To slow this trend, microprocessor architectures are being designed with multiple processor cores...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 427–431.
Published Online: November 15, 2005
... tension with increased operating temperature. One way to circumvent this problem is to design the vapor chamber heat spreader with a boiling limit significantly higher than the maximum thermal load expected, including thermal transients. Boiling limit dependency on fluid thermal properties versus...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
... April 2004 22 June 2004 24 01 2005 integrated circuit packaging semiconductor device packaging heat exchangers heat transfer temperature control rods (structures) flow simulation IC Cooling Heat Spreader Mathematical Thermal Model 1D Non-Uniform Rod Once a first...
Journal Articles
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 189–195.
Published Online: April 1, 2000
... heat pipes heat sinks forced convection thermal resistance integrated circuit packaging Passive Cooling Heat Pipe Heat Spreader This paper is concerned with heat pipes used to cool electronic devices—particularly notebook computers. Heat pipes are typically used to transport...