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Keywords: Heat Spreader
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Journal Articles
Article Type: Research Papers
J. Electron. Packag. March 2008, 130(1): 011007.
Published Online: February 4, 2008
... 2007 04 02 2008 coatings cooling electronics packaging evaporation heat conduction microprocessor chips pool boiling microporous enhancement electronics cooling heat spreader experimental Historically the power dissipated from a microprocessor has increased with its...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 427–431.
Published Online: November 15, 2005
... W ∕ cm 2 , since the maximum allowed pressure drop is ∼ 1600 Pa . 30 09 2005 15 11 2005 cooling integrated circuit packaging thermal conductivity thermal resistance graphite vapor chamber graphite foam heat spreader chip cooling As a result...
Journal Articles
Article Type: Research Papers
J. Electron. Packag. December 2004, 126(4): 435–439.
Published Online: January 24, 2005
...% over the entire temperature and power ranges. IC Cooling Heat Spreader Mathematical Thermal Model 1D Non-Uniform Rod Once a first silicon device is fabricated, “real world” validation of the design begins. About 40% of first silicon designs 3 go through this design-debug validation step...
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 189–195.
Published Online: April 1, 2000
... heat pipes heat sinks forced convection thermal resistance integrated circuit packaging Passive Cooling Heat Pipe Heat Spreader This paper is concerned with heat pipes used to cool electronic devices—particularly notebook computers. Heat pipes are typically used to transport...