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Keywords: MEMS
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Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2018, 140(4): 041006.
Paper No: EP-18-1016
Published Online: September 10, 2018
... technology for flexible and benign joining of heat-sensitive materials, e.g., for microelectromechanical systems (MEMS) applications. However, for successful reactive joining, precise control of heat production and heat distribution is mandatory in order to avoid damaging of the components during the process...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2018, 140(3): 031008.
Paper No: EP-18-1004
Published Online: June 26, 2018
...Chia-Cheng Chang; Sheng-Da Lin; Kuo-Ning Chiang The fatigue characteristics of microelectromechanical systems (MEMS) material, such as silicon or polysilicon, have become very important. Many studies have focused on this topic, but none have defined a good methodology for extracting the applied...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. September 2017, 139(3): 030801.
Paper No: EP-16-1146
Published Online: June 14, 2017
...Kaysar Rahim; Ahsan Mian The packaging of electronic and microelectromechanical systems (MEMS) devices is an important part of the overall manufacturing process as it ensures mechanical robustness as well as required electrical/electromechanical functionalities. The packaging integration process...
Topics: Lasers, Packaging
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. September 2017, 139(3): 031001.
Paper No: EP-15-1102
Published Online: June 14, 2017
... of an SMT microelectromechanical system (MEMS) component) in an SMT assembly is close to a natural frequency of the PWB, an amplified response is expected in the miniature structure. Components which are regarded as reliable under conventional qualification test methods may still pose a failure risk when...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2017, 139(1): 011006.
Paper No: EP-16-1097
Published Online: January 5, 2017
... temperature variation. MEMS Microsystems Thermal analysis 12 08 2016 30 11 2016 Contributed by the Electronic and Photonic Packaging Division of ASME for publication in the J OURNAL OF E LECTRONIC P ACKAGING . Manuscript received August 12, 2016; final manuscript received...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2016, 138(1): 010914.
Paper No: EP-15-1101
Published Online: March 10, 2016
.... The resonant response in the thickness direction of printed wiring boards (PWBs) (termed the dynamic “breathing mode” of response, in this study) acts as a mechanical bandpass filter and places miniature internal structures in some components (such as microelectromechanical systems (MEMS)) at risk of failure...
Journal Articles
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021001.
Paper No: EP-14-1059
Published Online: June 1, 2015
... transfer for microchip cooling applications as well as for applications involving micrototal analysis systems ( μ TAS). Electronic MEMS Most of the EOF micropumps used for the thermal management of microelectronic devices are silicon based [ 10–15 ]. While silicon has high thermal...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2015, 137(2): 021009.
Paper No: EP-14-1073
Published Online: June 1, 2015
...-tooth over which the bubble interface resides. MEMS Thermal analysis Self-propulsion or pump-less flow of liquid by a variety of means lends significant advantages to form factor and power reduction in microelectronic cooling applications and microfluidic systems. In the past, net flow...
Journal Articles
Publisher: ASME
Article Type: Review Articles
J. Electron. Packag. March 2015, 137(1): 010801.
Paper No: EP-14-1069
Published Online: November 14, 2014
... a start-up company named Pi-MEMS led by Payam Bozorgi. The UCSB TGP is fabricated using multiscale UCSB Titanium (Ti) and Titania (TiO 2 ) processing technology including nanostructured titania (NST). The UCSB TGP features NST (a super-hydrophilic wick material) on microscale, deep etched Ti grooves...
Journal Articles
Publisher: ASME
Article Type: Technology Review
J. Electron. Packag. June 2014, 136(2): 024002.
Paper No: EP-14-1006
Published Online: April 29, 2014
... and reliability problems concerning fan-out WLPs are introduced in the third part. Typical applications of WLP technologies are discussed in the last part, which include the application of fan-out WLP, 3D packaging integrating with WLP technologies and its application in microelectromechanical systems (MEMS...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2014, 136(2): 021001.
Paper No: EP-13-1044
Published Online: April 29, 2014
... development of microelectromechanical systems (MEMS) in IT industry, the heat flux in microchannel has reached a high level which demands preferable cooling technology. Water cooling has become a favor cooling approach in electronic microdevices due to better thermal performance than air cooling method...
Journal Articles
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. June 2013, 135(2): 021011.
Paper No: EP-12-1075
Published Online: April 12, 2013
... ] actuated, but do not have a structural response. A thin layer of liquid plays an important role as a movable thermal contact to conduct heat across the gap between two silicon dies [ 7 ]. MEMS microswitches heat transfer Steady state behavior of a thermally actuated RF MEMS switch...
Journal Articles
Publisher: ASME
Article Type: Research Papers
J. Electron. Packag. December 2010, 132(4): 041004.
Published Online: November 23, 2010
... Conductance of Actuated Interface ,” Appl. Phys. Lett. 0003-6951 , 81 , pp. 1216 – 1218 . 10.1063/1.1499518 Cho , J. , Richards , C. , Bahr , D. , Jiao , J. , and Richards , R. , 2008 , “ Evaluation of Contacts for MEMS Thermal Switch ,” J. Micromech. Microeng. 0960-1317...
Journal Articles